公开(公告)号：EP1739746B1

公开(公告)日：2018-12-19

申请号：EP06076224.2

申请日：2006-06-14

Applicant: Delphi Technologies, Inc.

Inventor： Myers, Bruce A. ,  Peugh, Darrel E. ,  Sanftleben, Henry M.

IPC: H01L23/473 ,  H01L23/44

CPC classification number: H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/16251 ,  H01L2924/00

Abstract: A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.

公开(公告)号：EP2323470A2

公开(公告)日：2011-05-18

申请号：EP10186911.3

申请日：2010-10-07

Applicant: Delphi Technologies, Inc.

Inventor： Oman, Todd P. ,  Tieman, Craig A. ,  Sultan, Michel F. ,  Partin, Dale L. ,  Myers, Bruce A.

IPC: H05K7/20

CPC classification number: H05K7/20854

Abstract: A thermal-protection apparatus (10) disposed in a vehicle cabin or storage compartment includes a housing (16) enveloping a chamber (26) in which a thermally-sensitive consumer electronic device (18) is received, a thermoelectric module (20) mounted in a wall (16b) of the housing (16), and a remote electronic controller (12) and power source (14) coupled to the housing (16) via an electrical cable (24) for activating the thermoelectric module (20), and optionally the consumer electronic device (18), in a manner to prevent the temperature in the chamber (26) from exceeding a prescribed maximum operating temperature of the consumer electronic device (18) or falling below a prescribed minimum operating temperature of the consumer electronic device (18).

Abstract translation: 设置在车厢或储藏室中的热保护装置（10）包括：壳体（16），其包围容纳热敏消费电子设备（18）的腔室（26），安装有热敏模块（20） 在壳体（16）的壁（16b）中，以及远程电子控制器（12）和电源（14），电源（14）通过用于激活热电模块（20）的电缆（24）耦合到壳体（16） 以及任选的消费电子设备（18），以防止所述室（26）中的温度超过所述消费电子设备（18）的规定的最大工作温度或低于所述消费者电子设备（18）的规定的最低工作温度的方式 装置（18）。

公开(公告)号：EP1703557A3

公开(公告)日：2009-08-19

申请号：EP06075528.7

申请日：2006-03-07

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Myers, Bruce A. ,  Walsh, Matthew R.

IPC: H01L23/427 ,  H01L23/373 ,  H01L23/367 ,  H01L23/31

CPC classification number: H01L23/367 ,  H01L23/3675 ,  H01L23/4275 ,  H01L23/433 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic assembly (100) with integral thermal transient suppression includes an integrated circuit (IC) chip (106) disposed within a cavity (103) of an IC device package (102). A transient thermal suppression material (TTSM) (110) is disposed in the cavity (103) in thermal contact with the IC chip (106). A heat sink (112) may also be provided in thermal contact with the chip (106). When present, the heat sink (112) serves as a cover of the packaged IC chip (106) and may include fins (112A,112B) extending from an upper surface (in contact with air) and a lower surface (in thermal contact with the TTSM (110)).The TTSM (110) may be thought of as a phase change material that absorbs energy dissipated by the IC chip (106) in a phase change event.

公开(公告)号：EP1760721A3

公开(公告)日：2008-12-17

申请号：EP06076603.7

申请日：2006-08-21

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Wilson, Scott E. ,  Myers, Bruce A.

IPC: G11B33/14 ,  G11B17/028

CPC classification number: G11B17/028 ,  G11B17/0282 ,  G11B33/142

Abstract: The present invention relates to the cooling of electronic components such as CD or DVD players and recorders and the disc or discs within. Specifically, the present invention relates to the internal cooling of a disc playing or recording device and the disc or discs within.

公开(公告)号：EP1840962A1

公开(公告)日：2007-10-03

申请号：EP07075221.7

申请日：2007-03-22

Applicant: Delphi Technologies, Inc.

Inventor： Peugh, Darrel E. ,  Myers, Bruce A. ,  Oberlin, Gary E.

IPC: H01L23/473

CPC classification number: H01L23/053 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/13055 ,  H01L2924/00

Abstract: An electronic assembly (10) is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device (20) within a sealed compartment. The assembly (10) includes a housing generally defining a sealed fluid compartment, an electronic device (20) disposed within the housing (16) and a cooling liquid for cooling the electronic device (20). The assembly (10) includes inlet and outlet ports (44 and 46) in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device (20). Fluid flow channels (26) are formed in thermal communication with the electronic device (20) within the housing (16). The fluid channels (26) include channels that allow liquid to flow in thermal communication with the electronic device (20) to cool the device (20).

Abstract translation: 提供了一种电子组件（10），其具有诸如液体的热冷却流体，用于冷却密封隔室内的电子设备（20）。 组件（10）包括大致限定密封的流体隔室的壳体，设置在壳体（16）内的电子设备（20）和用于冷却电子设备（20）的冷却液体。 组件（10）包括与密封的流体室流体连通的入口和出口端口（44和46），用于允许冷却液体通过隔室以冷却电子设备（20）。 流体流动通道（26）形成为与壳体（16）内的电子设备（20）热连通。 流体通道（26）包括允许液体与电子设备（20）热连通流动以冷却设备（20）的通道。

公开(公告)号：EP1528850B1

公开(公告)日：2007-03-07

申请号：EP04077881.3

申请日：2004-10-20

Applicant: Delphi Technologies, Inc.

Inventor： Oberlin, Gary E. ,  Myers, Bruce A. ,  Degenkolb, Thomas A. ,  Peugh, Darrel E.

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1748688A2

公开(公告)日：2007-01-31

申请号：EP06076287.9

申请日：2006-06-23

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Chengalva, Suresh K. ,  Brandenburg, Scott D. ,  Myers, Bruce A.

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L23/44 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K7/20236 ,  H05K7/20909 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.

Abstract translation: 提供了具有循环浸没冷却流体和方法的电子封装。 电子封装具有限定密封外壳的外壳和位于外壳中的电子设备。 电子设备具有热发射电路。 电介质流体，例如液体，以与电子设备的热传递关系位于壳体中。 诸如压电风扇的流体循环器位于壳体中，与电介质液体接触，用于循环介电液体以冷却电子设备。

公开(公告)号：EP1659839A2

公开(公告)日：2006-05-24

申请号：EP05077548.5

申请日：2005-11-07

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Sarma, Dwadasi H. ,  Myers, Bruce A.

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K3/341 ,  H05K3/4061 ,  H05K2201/066 ,  H05K2201/10674 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (50,60,70) with a substrate (10) having a laminate construction of ceramic layers, such as an LTCC ceramic substrate (10). The substrate (10) is configured for the purpose of improving the thermal management of power circuit devices mounted to the substrate (10).
Thermally-conductive vias (16,76) extend through the substrate (10) from a first surface (24) thereof to a second surface (26) thereof. A circuit device (14,74) is mounted to the first surface (24) of the substrate (10) and is electrically interconnected to conductor lines (30) of the substrate (10). The device (14,74) is also thermally coupled to the thermally-conductive vias (16,76) with a first solder material (32,72). A heat sink (22) located adjacent the second surface (26) of the substrate (10) is bonded to the thermally-conductive vias (16,76) with a second solder material (34,78), such that the first solder material (32,72), the thermally-conductive vias (16,76), and the second solder material (34,78) define a thermal path from the device (14,74) to the heat sink (22).

Abstract translation: 一种电路板组件（50,60,70）与具有陶瓷层的层叠体构成的基板（10），作为寻求LTCC陶瓷基板（10）。 基板（10）被配置用于提高安装到基板（10）电源电路的设备的热管理的目的。 导热通孔（16,76）通过从第一表面（24）的基板（10）上的第二表面（26）上延伸。 一种电路装置（14,74）被安装到所述基板（10）的第一表面（24）并且被连接到导线基板（10）的电间（30）。 的装置（14,74）被设置成耦合到所述热热传导性通孔（16,76）与第一焊接材料（32,72）。 衬底的散热片（22）位于相邻的所述第二表面（26）（10）被结合到热传导性通孔（16,76）与第二焊接材料（34,78），检测所做的第一焊料材料 （32,72），所述热传导性通孔（16,76），并且所述第二焊接材料（34,78）限定了从所述装置（14,74）到所述散热器（22）的热路径。

公开(公告)号：EP1534052A2

公开(公告)日：2005-05-25

申请号：EP04078154.4

申请日：2004-11-18

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Ihms, David W. ,  Myers, Bruce A.

IPC: H05K1/02 ,  H01L23/00

CPC classification number: H05K1/0206 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K2201/068 ,  H05K2201/10204 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A circuit board assembly (10) comprising a laminate substrate (12) and a surface mount device (18) having a CTE less than that of the laminate substrate (12) and attached with at least one solder joint (20) to a first surface (14) of the laminate substrate (12). The assembly (10) further includes a localized stiffener (24,124,224) attached to a second surface (16) of the laminate substrate (12) so as to be directly opposite the circuit device (18). The localized stiffener (24,124,224) is formed of a material and is shaped so that, when attached to the laminate substrate (12), the stiffener (24,124,224) is capable of increasing the thermal cycle fatigue life of the one or more solder joints (20) that attach the device (18) to the substrate (12).

Abstract translation: 一种电路板组件（10），包括一个层叠体的基材（12）和一个表面安装具有CTE小于层压基材（12）的装置（18）和与至少一个焊接接头（20）附连到第一表面 层叠基板（14）（12）。 该组件（10）包括附连到层压基材（12）的第二表面（16），以便直接在该电路装置（18）相对的局部此外加强件（24124224）。 局部加强件（24124224）形成的材料制成并且被成形为使得，当附连到层压基材（12），所述加强件（24124224）能够增加所述一个或多个焊接点的热循环疲劳寿命（20 ）那样附加装置（18）与基板（12）。

公开(公告)号：EP1351562A2

公开(公告)日：2003-10-08

申请号：EP03075806.4

申请日：2003-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Myers, Bruce A. ,  Tsai, Jeenhuei ,  Chengalva, Suresh K.

IPC: H05K9/00

CPC classification number: H05K5/065 ,  H05K1/0203 ,  H05K3/284 ,  H05K9/0045 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172

Abstract: An overmolded electronic assembly 20 having an electromagnetic interference shield 50, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body 33. The shield 50 effectively reduces the amount of electromagnetic interference ("EMI") emissions from penetrating within the assembly to the circuit board 22 without substantially increasing the cost of the unit. Thus, an electronic assembly having improved vibration, moisture, and EMI emission resistance is achieved as compared with traditional overmolded or metal assemblies. Further, because the shield 50 can be formed on the electronic assembly in one continuous processing step, a substantial savings in time and cost for the manufacturing process is also realized.

Abstract translation: 具有对电磁干扰屏蔽罩50包覆模制的电子组件20，在薄金属膜或金属箔，连接到顶部或内的过模制主体33的屏蔽件50的形式有效地减少电磁干扰的量（“EMI”） 从装配到电路板22中贯通，而基本上不增加装置的成本排放。 因此，在电子组件具有改进的振动，潮湿和EMI辐射电阻，实现与传统包覆成型或者金属组件相比。 此外，由于护罩50可以在电子组件在一个连续的处理步骤中形成，在时间和制造工艺成本大幅节省因此实现。