公开(公告)号：EP1303007B1

公开(公告)日：2005-05-18

申请号：EP02078929.3

申请日：2002-09-23

Applicant: Delphi Technologies, Inc.

Inventor： Van Steenkiste, Thomas H. ,  Drew, George A. ,  Gorgiewicz, Daniel W. ,  Gillispie, Bryan A.

IPC: H01R13/03

CPC classification number: H01R13/03 ,  H01R4/58 ,  Y10T428/12063 ,  Y10T428/12104 ,  Y10T428/12486 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12903 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/25

公开(公告)号：EP1303007A2

公开(公告)日：2003-04-16

申请号：EP02078929.3

申请日：2002-09-23

Applicant: Delphi Technologies, Inc.

Inventor： Van Steenkiste, Thomas H. ,  Drew, George A. ,  Gorgiewicz, Daniel W. ,  Gillispie, Bryan A.

IPC: H01R13/03

CPC classification number: H01R13/03 ,  H01R4/58 ,  Y10T428/12063 ,  Y10T428/12104 ,  Y10T428/12486 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12903 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/25

Abstract: The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.

Abstract translation: 本发明涉及电触点，其包括嵌入并结合到导体表面中的间隔的导电颗粒，其中颗粒已经以足够的能量动力地喷射到导体上，以在预先形成颗粒和导体之间形成直接的机械结合 - 选择位置和颗粒数密度，促进高表面接触和降低导体之间的接触电阻。

公开(公告)号：EP2600476A1

公开(公告)日：2013-06-05

申请号：EP12192581.2

申请日：2012-11-14

Applicant: Delphi Technologies, Inc.

Inventor： Drew, George A. ,  Kiko, Jeffrey S. ,  Musick, Steven A. ,  Boyer, Richard J. ,  Pasha, Brian D. ,  Fuzo, John V.

IPC: H02H5/04 ,  B60L11/18 ,  H02J7/02

CPC classification number: H02H5/04 ,  B60L11/1803 ,  B60L11/1818 ,  B60L11/1825 ,  B60L11/1877 ,  B60L2210/30 ,  B60L2240/36 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/16 ,  B60L2270/32 ,  B60L2270/34 ,  Y02T10/7005 ,  Y02T10/705 ,  Y02T10/7072 ,  Y02T10/7241 ,  Y02T90/121 ,  Y02T90/127 ,  Y02T90/128 ,  Y02T90/14

Abstract: A power safety system (PSS) includes a plurality of thermally-triggered electrical breaking arrangements (TTEBAs (11) ). The plurality of TTEBAs are associated with a plurality of electrical devices (EDs (12,13) ) disposed external to the PSS. The PSS further includes a plurality of electrical power connections (EPCs (19) ) associated with said plurality of TTEBAs (11) that are configured to respectively electrically connect the PSS to the plurality of EDs (12,13). When at least one TTEBA in the plurality of TTEBAs is electrically operative and at least one thermal event occurs that is sufficient to thermally activate the at least one electrically operative TTEBA, at least the EPC (19) associated with the at least one thermally activated TTEBA is electrically broken. A method to protect a human operator of the PSS from a thermal event is also presented. A PSS also extends to a primary and a secondary electrical charging system (10) used to charge a battery of a vehicle (14).

Abstract translation: 一种功率安全系统（PSS）包括热触发电断裂安排有多个（TTEBAs（11））。 TTEBAs的多元性与电气装置（EDS（12,13）），其设置外部PSS的多个相关联的。 的PSS还包括与TTEBAs的所述多个（11）相关联的电功率连接（内皮祖细胞（19））的多元没有被配置为将PSS分别电连接到急诊的多元性（12,13）。 当TTEBAs的多个至少一个TTEBA电操作和发生在至少一个热事件确实足以热激活所述至少一个电操作TTEBA，至少，与所述至少一个热活化TTEBA相关联的EPC（19） 电断了。 因此，以保护PSS的人类操作员从热事件的方法提出。 因此，一个PSS延伸至初级和用于车辆（14）的电池进行充电的二次充电系统（10）。

公开(公告)号：EP1702996A1

公开(公告)日：2006-09-20

申请号：EP06075492.6

申请日：2006-03-03

Applicant: Delphi Technologies, Inc.

Inventor： Harrington, Charles R. ,  Drew, George A. ,  Aukland, Neil R.

IPC: C23C8/40 ,  B32B15/08 ,  H01R13/03

CPC classification number: C23C26/00 ,  C23C24/08 ,  C23C28/00 ,  H01R13/03 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/31699

Abstract: Described is an electrical contact comprising a conductive surface of nickel, tin, or a precious metal having a surface of formed grains and particles of a low friction polymer deposited on a portion of the grains wherein the resistance of the contact is about 1 ohm or less, measured at about 100 mA, and wherein the polymer particles are deposited on the grains from a dispersion of the particles in a liquid.

Abstract translation: 描述的是一种电触点，其包括镍，锡或具有形成晶粒表面的贵金属的导电表面和沉积在晶粒的一部分上的低摩擦聚合物颗粒，其中该触点的电阻为约1欧姆或更小 ，其在约100mA下测量，并且其中聚合物颗粒从颗粒在液体中的分散体沉积在颗粒上。

公开(公告)号：EP1303007A3

公开(公告)日：2004-02-18

申请号：EP02078929.3

申请日：2002-09-23

Applicant: Delphi Technologies, Inc.

Inventor： Van Steenkiste, Thomas H. ,  Drew, George A. ,  Gorgiewicz, Daniel W. ,  Gillispie, Bryan A.

IPC: H01R13/03

CPC classification number: H01R13/03 ,  H01R4/58 ,  Y10T428/12063 ,  Y10T428/12104 ,  Y10T428/12486 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12903 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/25

Abstract: The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.