公开(公告)号：EP0918355A3

公开(公告)日：2001-04-25

申请号：EP98203298.9

申请日：1998-09-29

Applicant: Delphi Technologies, Inc.

Inventor： Cornell, Ralph Edward ,  Erickson, Curtis A. ,  Vaidyanthan, Aparna

IPC: H01L23/485

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A surface mount circuit device (110), such as a flip chip, of the type which is attached to a conductor pattern (126) with solder bump connections (120). The solder bump connections (120) are formed by reflowing solder on shaped input/output pads (112) on the device (110), with the shape of the pads (112) being tailored to favorably affect optimal distribution, shape and height of the solder bump connections (120) following reflow soldering of the device (110) to the conductor pattern (126). The solder bump connections (120) are preferably characterized by a shape that increases the stand-off height of the device (110). The shaped solder bump connections (120) also promote stress relief during thermal cycling, improve mechanical bonding, allow better penetration of cleaning solutions, and improve flow of encapsulation materials between the device (110) and its substrate (122).

Abstract translation: 一种表面安装电路器件（110），例如倒装芯片，其类型被连接到具有焊料凸点连接（120）的导体图案（126）上。 焊料凸块连接（120）通过在装置（110）上的成形输入/输出垫（112）上回流焊料形成，其中衬垫（112）的形状被定制以有利地影响最佳分布，形状和高度 在器件（110）回流焊接到导体图案（126）之后的焊料凸点连接（120）。 焊料凸点连接（120）的特征在于增加了装置（110）的支座高度的形状。 成形的焊料凸点连接（120）还促进热循环期间的应力消除，改善机械粘合，允许更好地渗透清洁溶液，并改善装置（110）和其基板（122）之间的封装材料的流动。