公开(公告)号：EP1781076B1

公开(公告)日：2011-06-29

申请号：EP06076881.9

申请日：2006-10-13

Applicant: Delphi Technologies, Inc.

Inventor： Taylor, Ralph S. ,  Jeter, Michael A. ,  Gerbsch, Erich W. ,  Ronning, Jeffrey J.

IPC: H05K1/02 ,  H05K7/20 ,  H05K5/00

CPC classification number: H05K7/20872 ,  H05K1/182 ,  H05K7/20927

公开(公告)号：EP1978604A3

公开(公告)日：2010-03-17

申请号：EP08153240.0

申请日：2008-03-25

Applicant: Delphi Technologies, Inc.

Inventor： Jeter, Michael A.

IPC: H01R13/70 ,  H05K7/14 ,  H05K9/00

CPC classification number: H01R13/719 ,  H05K9/0066

Abstract: A high-density pass-through filter apparatus (10) slips over the terminal blade (26) of a standard pass-through electrical connector (50) within an opening (62) in the bulkhead (52) of an electronic module (54) to which the connector (50) is fastened. The filter apparatus (10) retains a large number of axially oriented and axially terminated capacitive filter components (14) which are electrically coupled at one end to the connector terminal (56) and at the other end to a peripheral ring (44) that resiliently engages the periphery of the bulkhead opening (62).

公开(公告)号：EP1978604A2

公开(公告)日：2008-10-08

申请号：EP08153240.0

申请日：2008-03-25

Applicant: Delphi Technologies, Inc.

Inventor： Jeter, Michael A.

IPC: H01R13/70 ,  H05K7/14

CPC classification number: H01R13/719 ,  H05K9/0066

Abstract: A high-density pass-through filter apparatus (10) slips over the terminal blade (26) of a standard pass-through electrical connector (50) within an opening (62) in the bulkhead (52) of an electronic module (54) to which the connector (50) is fastened. The filter apparatus (10) retains a large number of axially oriented and axially terminated capacitive filter components (14) which are electrically coupled at one end to the connector terminal (56) and at the other end to a peripheral ring (44) that resiliently engages the periphery of the bulkhead opening (62).

Abstract translation: 高密度通过过滤器装置（10）在电子模块（54）的隔板（52）内的开口（62）内的标准直通电连接器（50）的端子刀片（26）上滑动， 连接器（50）被紧固到该连接器。 过滤器装置（10）保持大量的轴向取向和轴向端接的电容式过滤器部件（14），其一端电连接到连接器端子（56），另一端电连接到外围环（44） 接合隔板开口（62）的周边。

公开(公告)号：EP1781076A2

公开(公告)日：2007-05-02

申请号：EP06076881.9

申请日：2006-10-13

Applicant: Delphi Technologies, Inc.

Inventor： Taylor, Ralph S. ,  Jeter, Michael A. ,  Gerbsch, Erich W. ,  Ronning, Jeffrey J.

IPC: H05K7/20

CPC classification number: H05K7/20872 ,  H05K1/182 ,  H05K7/20927

Abstract: An electronics assembly (10) is provided having a substrate (12) and at least one electronics package (20) supported on the substrate (12). The electronics package (20) also has electrical circuitry and first and second side surfaces. The assembly (10) further includes a first heat sink device (30) positioned in thermal communication with the first side surface of the electronics package (20), and a second heat sink device (40) positioned in thermal communication with the second side surface of the electronics package (20).

Abstract translation: 电子组件（10）的基材，提供具有支撑在（12）一个基片（12）和至少一个电子器件封装（20）。 电子封装件（20），因此具有电路和第一和第二侧表面。 该组件（10）还包括在热连通并位于与电子器件封装（20）的第一侧面上的第一散热器装置（30），和在热连通并位于与所述第二侧表面的第二散热装置（40） 的电子封装件（20）。

公开(公告)号：EP1377148A2

公开(公告)日：2004-01-02

申请号：EP03076656.2

申请日：2003-05-28

Applicant: Delphi Technologies, Inc.

Inventor： Jeter, Michael A. ,  Mock, Roger A. ,  Gerbsch, Erich W. ,  Ronning, Jeffrey J.

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  F28D2021/0029 ,  F28F3/027 ,  F28F3/12

Abstract: An electronics assembly 10 is provided, including a housing 12 and at least one electronic power device 18 positioned within. A heat sink device 34 is positioned within the housing 12 and is in thermal communication with the electronic power device 18. The heat sink device 34 includes a fluid vessel 44, a fluid input port 50, a fluid output port 52, and at least one fin insert 60 brazed into the fluid vessel 44. The heat sink device 34 is in fluid communication with an automotive radiator 46 such that coolant 48 flows from the automotive radiator 46 through the fluid vessel 44 thereby cooling the electronic power device 18.

Abstract translation: 提供电子组件10，其包括壳体12和位于其内的至少一个电子功率器件18。 散热装置34定位在壳体12内并与电子功率装置18热连通。散热装置34包括流体容器44，流体输入端口50，流体输出端口52和至少一个 翅片插入件60钎焊到流体容器44中。散热装置34与汽车散热器46流体连通，使得冷却剂48从汽车散热器46流过流体容器44，从而冷却电子电力装置18.

公开(公告)号：EP1781076A3

公开(公告)日：2009-03-04

申请号：EP06076881.9

申请日：2006-10-13

Applicant: Delphi Technologies, Inc.

Inventor： Taylor, Ralph S. ,  Jeter, Michael A. ,  Gerbsch, Erich W. ,  Ronning, Jeffrey J.

IPC: H05K1/02 ,  H05K7/20 ,  H05K5/00

CPC classification number: H05K7/20872 ,  H05K1/182 ,  H05K7/20927

Abstract: An electronics assembly (10) is provided having a substrate (12) and at least one electronics package (20) supported on the substrate (12). The electronics package (20) also has electrical circuitry and first and second side surfaces. The assembly (10) further includes a first heat sink device (30) positioned in thermal communication with the first side surface of the electronics package (20), and a second heat sink device (40) positioned in thermal communication with the second side surface of the electronics package (20).

公开(公告)号：EP1632998A1

公开(公告)日：2006-03-08

申请号：EP05076987.6

申请日：2005-08-29

Applicant: Delphi Technologies, Inc.

Inventor： Jeter, Michael A. ,  Taylor, Ralph S.

IPC: H01L25/07 ,  H01L23/367

CPC classification number: H01L23/473 ,  H01L23/3735 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A power electronics module (10) includes a heat sink (14) and an electronic package (22) having a first layer (48) in direct thermal communication with the heat sink. At least one electronic component (46) is disposed between the first layer and a second layer (50). A thermally conductive element (78) is in direct thermal communication with the second layer and carries heat from a first portion of the second layer to a second portion of the second layer such that the heat is transferred from the second portion of the second layer to the heat sink through the first layer.

Abstract translation: 电力电子模块（10）包括散热器（14）和具有与散热器直接热交换的第一层（48）的电子封装（22）。 至少一个电子部件（46）设置在第一层和第二层（50）之间。 导热元件（78）与第二层直接热连通，并将热量从第二层的第一部分传送到第二层的第二部分，使得热量从第二层的第二部分转移到 散热器通过第一层。

公开(公告)号：EP1377148A3

公开(公告)日：2004-08-25

申请号：EP03076656.2

申请日：2003-05-28

Applicant: Delphi Technologies, Inc.

Inventor： Jeter, Michael A. ,  Mock, Roger A. ,  Gerbsch, Erich W. ,  Ronning, Jeffrey J.

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  F28D2021/0029 ,  F28F3/027 ,  F28F3/12

Abstract: An electronics assembly 10 is provided, including a housing 12 and at least one electronic power device 18 positioned within. A heat sink device 34 is positioned within the housing 12 and is in thermal communication with the electronic power device 18. The heat sink device 34 includes a fluid vessel 44, a fluid input port 50, a fluid output port 52, and at least one fin insert 60 brazed into the fluid vessel 44. The heat sink device 34 is in fluid communication with an automotive radiator 46 such that coolant 48 flows from the automotive radiator 46 through the fluid vessel 44 thereby cooling the electronic power device 18.