公开(公告)号：EP2175708A1

公开(公告)日：2010-04-14

申请号：EP09170763.8

申请日：2009-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Hinze, Lee R. ,  Krishnan, G. Venkata ,  Wilson, Scott E.

IPC: H05K7/20 ,  H01L23/367

CPC classification number: H05K7/20409 ,  H01L23/367 ,  H01L23/4006 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K7/20445 ,  H01L2924/00

Abstract: An electronic module includes a printed circuit board (24) with a heat producing electrical component (26) assembled in an insulating housing (12). The component is adjacent a thermally conducting heat sink (30) with a thermally conductive material (32) disposed therebetween. Integral with the heat sink is a thermally conductive runner (38), partially encased in the housing wall, connecting the heat sink to a thermally conductive port (22). The port is coupled to a base structure when the housing is attached to the base (14), forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.

Abstract translation: 电子模块包括具有组装在绝缘壳体（12）中的发热电气部件（26）的印刷电路板（24）。 该部件与导热散热器（30）相邻，其间设置有导热材料（32）。 与散热器成一体是导热流道（38），其部分地封装在壳体壁中，将散热器连接到导热端口（22）。 当壳体附接到基座（14）时，该端口联接到基部结构，形成从部件到基部的热传导路径。 该导电路径还可以提供从印刷电路板到基座的电接地路径。

公开(公告)号：EP2175708B1

公开(公告)日：2016-05-11

申请号：EP09170763.8

申请日：2009-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Hinze, Lee R. ,  Krishnan, G. Venkata ,  Wilson, Scott E.

IPC: H05K7/20 ,  H01L23/367

CPC classification number: H05K7/20409 ,  H01L23/367 ,  H01L23/4006 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K7/20445 ,  H01L2924/00