公开(公告)号：EP1901044A3

公开(公告)日：2011-04-20

申请号：EP07075781.0

申请日：2007-09-10

Applicant: Delphi Technologies, Inc.

Inventor： Hawes, Kevin J. ,  Murphy, Morgan D ,  Hinze, Lee R.

IPC: G01G7/06 ,  G01G19/414

CPC classification number: G01G19/4142 ,  B60N2/002 ,  G01G7/06

Abstract: A capacitive sensor apparatus (12) is disposed between the bottom cushion (18) and frame (16) of a seat (10). The sensor apparatus (12) includes first and second mutually parallel rigid force translation plates (22, 24) biased apart by a set of springs (26), first and second conductor plates (28, 30) centrally affixed to inboard faces of the first and second force translation plates (22, 24), and a control circuit (32) responsive to the gap capacitance between the first and second conductor plates (28, 30). The force translation plates (22, 24) are joined in a manner to maintain the conductor plates (28, 30) parallel to each other while permitting movement of either force translation plate relative to the other in a mutually perpendicular direction.

公开(公告)号：EP1737286A3

公开(公告)日：2009-01-21

申请号：EP06076169.9

申请日：2006-06-06

Applicant: Delphi Technologies, Inc.

Inventor： Hinze, Lee R.

IPC: B60R16/023 ,  H05K7/14 ,  H05K5/06 ,  H05K5/00

CPC classification number: H05K5/064 ,  H05K1/144 ,  H05K3/284 ,  H05K5/006 ,  H05K7/1417 ,  H05K2201/09063

Abstract: A sealed electronic module includes a housing (10) having an open end, a main circuit board (12) and at least one auxiliary circuit board (14), where the main and auxiliary circuit boards (12, 14) are both secured in the housing (10) without fasteners by a potting material (70) that is applied to the exposed face (62) of the main circuit board (12). The main circuit board (12) is peripherally supported by a housing ledge (46, 54), and the auxiliary circuit board (14) is disposed inboard of the main circuit board (12). A controlled amount of the potting material (70) applied to the exposed face (62) of the main circuit board (12) flows through one or more strategically placed apertures (64) in the main circuit board (12), forming one or more bridges of potting material (70a) between the main circuit board (12) and the underlying surface of the auxiliary circuit board (14) so that potting material (70) applied in a single step secures both circuit boards (12, 14) in the housing (10) while environmentally sealing the module.

公开(公告)号：EP1901044A2

公开(公告)日：2008-03-19

申请号：EP07075781.0

申请日：2007-09-10

Applicant: Delphi Technologies, Inc.

Inventor： Hawes, Kevin J. ,  Murphy, Morgan D ,  Hinze, Lee R.

IPC: G01G7/06 ,  G01G19/414

CPC classification number: G01G19/4142 ,  B60N2/002 ,  G01G7/06

Abstract: A capacitive sensor apparatus (12) is disposed between the bottom cushion (18) and frame (16) of a seat (10). The sensor apparatus (12) includes first and second mutually parallel rigid force translation plates (22, 24) biased apart by a set of springs (26), first and second conductor plates (28, 30) centrally affixed to inboard faces of the first and second force translation plates (22, 24), and a control circuit (32) responsive to the gap capacitance between the first and second conductor plates (28, 30). The force translation plates (22, 24) are joined in a manner to maintain the conductor plates (28, 30) parallel to each other while permitting movement of either force translation plate relative to the other in a mutually perpendicular direction.

Abstract translation: 电容传感器装置（12）设置在座垫（10）的底垫（18）和框架（16）之间。 传感器装置（12）包括由一组弹簧（26）偏置的第一和第二相互平行的刚性力平移板（22,24），第一和第二导体板（28,30）中心地固定在第一 和第二力平移板（22,24），以及响应于第一和第二导体板（28,30）之间的间隙电容的控制电路（32）。 力平移板（22,24）以保持导体板（28,30）彼此平行的方式接合，同时允许任何力平移板相对于彼此相对垂直的方向移动。

公开(公告)号：EP2088840B1

公开(公告)日：2016-08-31

申请号：EP09151627.8

申请日：2009-01-29

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/30 ,  H01G2/06 ,  H01G2/10 ,  H01R12/58 ,  H05K3/32

CPC classification number: H01G2/06 ,  H01G2/103 ,  H01R12/585 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651

公开(公告)号：EP2072324A3

公开(公告)日：2015-11-11

申请号：EP08171458.6

申请日：2008-12-12

Applicant: Delphi Technologies, Inc.

Inventor： Hinze, Lee R. ,  Hunkeler, Hugh R.

IPC: B60N2/28

CPC classification number: B60N2/2806 ,  B60N2/2812 ,  B60N2002/2815

Abstract: A child seat (20) and a method for monitoring installation of the child seat (20) are provided. The child seat (20) includes a child seat frame (40) configured to receive a child occupant. The child seat frame (40) is configured to receive a seat belt webbing (24) for securing the child seat frame (40) to a vehicle seat (22). The child seat (20) further includes a first bladder (44) configured to contact the seat belt webbing (24). The first bladder (44) has a fluid therein. The child seat (20) further includes a first pressure sensor (52) fluidly communicating with the fluid in the first bladder (44). The first pressure sensor (52) is configured to output a first signal indicative of an amount of pressure in the first bladder (44). The child seat (20) further includes a controller (56) coupled to the child seat frame (40) configured to receive the first signal and to compute a first tension value based on the first signal. The controller (56) is further configured to generate a second signal to induce a first device disposed on the child seat frame (40) to indicate when the first tension value is less than a first predetermined tension value.

公开(公告)号：EP1996000A3

公开(公告)日：2009-07-22

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

公开(公告)号：EP1996000A2

公开(公告)日：2008-11-26

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

Abstract translation: 一种支架安装装置（10/50/80）包括用于板外安装有铅或表面安装部件（18,20 / 58-62 / 92-96）的绝缘载体（12/52/82） 特别是大的温度敏感分立元件，如电容器。 载体（12/52/82）具有相对于电路板（14）升高的部件安装表面，并且相对于电路板（14）定位，使得电路板面积在 载体（12/52/82）可用于放置较小的非温度敏感组件。 车外部件（18,20 / 58-62 / 92-96）安装在载体（12/52/82）的部件安装表面上，并且载体（82）可以包括支撑特征（102） 用于为部件（92-96）提供额外的机械支撑。 用于将升高的部件（18,20 / 58-62 / 92-96）电连接到电路板（14）的电引线（16/56/88）可以嵌入成型在载体（12/52）中，或 可插入载体（82）中的电镀通孔（110）中。

公开(公告)号：EP1737286A2

公开(公告)日：2006-12-27

申请号：EP06076169.9

申请日：2006-06-06

Applicant: Delphi Technologies, Inc.

Inventor： Hinze, Lee R.

IPC: H05K5/06 ,  H05K5/00

CPC classification number: H05K5/064 ,  H05K1/144 ,  H05K3/284 ,  H05K5/006 ,  H05K7/1417 ,  H05K2201/09063

Abstract: A sealed electronic module includes a housing (10) having an open end, a main circuit board (12) and at least one auxiliary circuit board (14), where the main and auxiliary circuit boards (12, 14) are both secured in the housing (10) without fasteners by a potting material (70) that is applied to the exposed face (62) of the main circuit board (12). The main circuit board (12) is peripherally supported by a housing ledge (46, 54), and the auxiliary circuit board (14) is disposed inboard of the main circuit board (12). A controlled amount of the potting material (70) applied to the exposed face (62) of the main circuit board (12) flows through one or more strategically placed apertures (64) in the main circuit board (12), forming one or more bridges of potting material (70a) between the main circuit board (12) and the underlying surface of the auxiliary circuit board (14) so that potting material (70) applied in a single step secures both circuit boards (12, 14) in the housing (10) while environmentally sealing the module.

Abstract translation: 密封电子模块包括具有开口端的壳体（10），主电路板（12）和至少一个辅助电路板（14），其中主电路板（12）和辅助电路板（12）都固定在 通过施加到主电路板（12）的暴露面（62）的灌封材料（70）而没有紧固件的壳体（10）。 主电路板（12）由壳体凸缘（46,54）外围支撑，辅助电路板（14）设置在主电路板（12）的内侧。 施加到主电路板（12）的暴露面（62）的灌封材料（70）的受控量流过主电路板（12）中的一个或多个策略性放置的孔（64），形成一个或多个 在主电路板（12）和辅助电路板（14）的下表面之间的灌封材料（70a）的桥接件，使得以一个步骤施加的灌封材料（70）将两个电路板（12,14）固定在 外壳（10），同时环保密封模块。

公开(公告)号：EP2175708A1

公开(公告)日：2010-04-14

申请号：EP09170763.8

申请日：2009-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Hinze, Lee R. ,  Krishnan, G. Venkata ,  Wilson, Scott E.

IPC: H05K7/20 ,  H01L23/367

CPC classification number: H05K7/20409 ,  H01L23/367 ,  H01L23/4006 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K7/20445 ,  H01L2924/00

Abstract: An electronic module includes a printed circuit board (24) with a heat producing electrical component (26) assembled in an insulating housing (12). The component is adjacent a thermally conducting heat sink (30) with a thermally conductive material (32) disposed therebetween. Integral with the heat sink is a thermally conductive runner (38), partially encased in the housing wall, connecting the heat sink to a thermally conductive port (22). The port is coupled to a base structure when the housing is attached to the base (14), forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.

Abstract translation: 电子模块包括具有组装在绝缘壳体（12）中的发热电气部件（26）的印刷电路板（24）。 该部件与导热散热器（30）相邻，其间设置有导热材料（32）。 与散热器成一体是导热流道（38），其部分地封装在壳体壁中，将散热器连接到导热端口（22）。 当壳体附接到基座（14）时，该端口联接到基部结构，形成从部件到基部的热传导路径。 该导电路径还可以提供从印刷电路板到基座的电接地路径。

公开(公告)号：EP2088840A3

公开(公告)日：2010-03-31

申请号：EP09151627.8

申请日：2009-01-29

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/30

CPC classification number: H01G2/06 ,  H01G2/103 ,  H01R12/585 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651

Abstract: An electronic component assembly includes an electrical component (12) assembled to a base (14) and mounted to a support (16). The component electrical leads (20,21) protrude through holes, along a channel, and make contact with connectors (38) on the base. The base (14) is formed of a polymeric material and contains protrusions (44) for mechanically supporting the electrical component. When the base is mounted to the support, the connectors complete the electrical connection between the electrical component (12) and the support (16).