公开(公告)号：EP1653794A1

公开(公告)日：2006-05-03

申请号：EP05077405.8

申请日：2005-10-19

Applicant: Delphi Technologies, Inc.

Inventor： Sanftleben, Henry M. ,  Hutchins, Rebecca A. ,  Lawrence, Erin M. ,  Chandler, Brian Lee

IPC: H05K13/08 ,  H05K1/02 ,  G01N21/956 ,  G01R31/309 ,  G06T7/00

CPC classification number: G01N21/95684 ,  G01R31/2812 ,  G01R31/309 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/30152 ,  H05K1/0269 ,  H05K3/3484 ,  H05K2201/10204

Abstract: A technique (200) for optical inspection verification implements a number of steps. Initially, a simulated solder paste material, including a solder powder and an organic resin, is provided (202). Next, the simulated solder paste material is printed in a desired pattern on a base material (206) to provide a reference test board (101). Then, the test board (101) is cured to stabilize the simulated solder paste material. Next, the test board (101) is utilized to train the optical inspection system to reject defective product.

Abstract translation: 用于光学检查验证的技术（200）实现了许多步骤。 首先，提供包括焊料粉末和有机树脂的模拟焊膏材料（202）。 接下来，将模拟的焊膏材料以所需的图案印刷在基材（206）上，以提供参考测试板（101）。 然后，使测试板（101）固化以使模拟的焊膏材料稳定。 接下来，使用测试板（101）来训练光学检查系统以拒绝有缺陷的产品。