Seat sensor apparatus for occupant presence detection
    2.
    发明公开
    Seat sensor apparatus for occupant presence detection 有权
    Sitzsensorvorrichtung zur Erkennung der Anwesenheit eines Insassen

    公开(公告)号:EP2216200A1

    公开(公告)日:2010-08-11

    申请号:EP10151949.4

    申请日:2010-01-28

    CPC classification number: B60R21/01516 B60N2/002 B60R21/01524 H01H3/141

    Abstract: An occupant presence sensor apparatus (12) disposed in a seat (10) includes first and second substantially non-compliant force translation plates (22, 24) generally parallel to the seating surface (18) of the seat (10), an elastomeric mat (26) disposed between the first and second force translation plates (22, 24), and a switch mechanism (28) disposed between the first and second force translation plates (22, 24) within an opening (52) formed in the elastomeric mat (26). The elastomeric mat (26) includes a distributed array of hollow protuberances (50a, 50b) that extend toward and contact the force translation plates (22, 24), and the mat (26) has a stiffness that normally provides a clearance between the switch mechanism (28) and one of the force translation plates (22, 24). When an occupant of specified or higher weight sits on the seating surface (18), the protuberances (50a, 50b) collapse and the force translation plates (22, 24) activate the switch mechanism (28).

    Abstract translation: 设置在座椅(10)中的乘员存在传感器设备(12)包括大致平行于座椅(10)的座面(18)的第一和第二基本上非柔顺的力平移板(22,24),弹性垫 (26),设置在第一和第二力平移板(22,24)之间,以及开关机构(28),其设置在第一和第二力平移板(22,24)之间,形成在弹性垫中的开口(52)内 (26)。 弹性垫(26)包括朝向和接触力平移板(22,24)延伸的中空突起(50a,50b)的分布阵列,并且垫(26)具有通常在开关之间提供间隙的刚度 机构(28)和力平移板(22,24)中的一个。 当具有特定或更高重量的乘员坐在座面(18)上时,突起(50a,50b)倒塌,力平移板(22,24)激活开关机构(28)。

    Over-molded Electronic Module
    3.
    发明公开
    Over-molded Electronic Module 审中-公开
    Umgossenes elektronisches Modul

    公开(公告)号:EP2112872A2

    公开(公告)日:2009-10-28

    申请号:EP09157969.8

    申请日:2009-04-15

    Inventor: Lu, Bo

    Abstract: An over-molded electronic module (2) includes a frame (10), an electronic assembly (20), and a polymeric body (32). The frame (10) includes a sidewall (14) that defines an opening (12) to provide a position for the electronic assembly (20), and includes an upper face (16) and a lower face (18) opposite the upper face (16) to act as sealing surfaces during over-molding. The polymeric body (32) is formed of a polymeric composition encapsulating both sides of the electronic assembly (20) and a portion of the frame (10).

    Abstract translation: 包覆模制电子模块(2)包括框架(10),电子组件(20)和聚合体(32)。 框架(10)包括限定开口(12)以提供电子组件(20)的位置的侧壁(14),并且包括与上表面相对的上表面(16)和下表面(18) 16)在过模塑过程中作为密封面。 聚合物主体(32)由包封电子组件(20)的两侧和框架(10)的一部分的聚合物组合物形成。

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