Abstract:
Described is a metal alloy comprising at least two metal elements which are not precious metals, said alloy being capable of forming a surface metal oxide layer that is conductive having a contact resistivity of 100 Ωcm or less after the alloy has been subjected to 125°C for 1008 hours. Also described is a process of preparing a metal alloy providing two metal elements which are not precious metals and oxidizing the metal alloy to produce a surface metal oxide layer that is conductive having a contact resistivity of 100 Ω-cm or less after the alloy has been subjected to 125°C for 1008 hours.
Abstract:
Infrared sensors and methods for manufacturing the infrared sensors are provided. In one exemplary embodiment, the method includes depositing a germanium layer (204) on a silicon substrate (202). The method further includes depositing a first electrically conductive layer (208) on both the germanium layer (204) and a portion of the silicon substrate (202). The method further includes depositing a ferroelectric layer (210) on the first electrically conductive layer (208) opposite the germanium layer (204). The method further includes depositing a second electrically conductive layer (212) on both the ferroelectric layer (210) and a portion of the silicon substrate (202). The method further includes removing the germanium layer (204) by applying a liquid on the germanium layer (204) that dissolves the germanium layer (204) such that a cavity (206) is formed between the first electrically conductive layer (208) and the silicon substrate (202).
Abstract:
Infrared sensors and methods for manufacturing the infrared sensors are provided. In one exemplary embodiment, the method includes depositing a germanium layer (204) on a silicon substrate (202). The method further includes depositing a first electrically conductive layer (208) on both the germanium layer (204) and a portion of the silicon substrate (202). The method further includes depositing a ferroelectric layer (210) on the first electrically conductive layer (208) opposite the germanium layer (204). The method further includes depositing a second electrically conductive layer (212) on both the ferroelectric layer (210) and a portion of the silicon substrate (202). The method further includes removing the germanium layer (204) by applying a liquid on the germanium layer (204) that dissolves the germanium layer (204) such that a cavity (206) is formed between the first electrically conductive layer (208) and the silicon substrate (202).
Abstract:
A ferroelectric/pyroelectric sensor (92) that employs a technique for determining a charge output of a pyroelectric element (96) of the sensor (92) by measuring the hysteresis loop output of the element (96) several times during a particular time frame for the same temperature. An external AC signal (104) is applied to the pyroelectric element (96) to cause the hysteresis loop output from the element (96) to switch polarization. Charge integration circuitry (106), such as a combination capacitor (108) and operational amplifier (110), is employed to measure the charge from the element (96). A mechanical shutter is not used, and thus the charge integration output from the element (96) is directly proportional to the incident radiation thereof.