公开(公告)号：EP1344597A1

公开(公告)日：2003-09-17

申请号：EP03075594.6

申请日：2003-02-28

Applicant: Delphi Technologies, Inc.

Inventor： Yeh, Shing ,  Carter, Bradley H. ,  Melcher, Curtis W.

IPC: B23K35/26

CPC classification number: B23K35/262

Abstract: A lead-free solder alloy consisting essentially of, by weight, 3.0% to 3.5% silver, greater than 1% to about 15% copper, the balance tin and incidental impurities, and having an effective melting range of about 215°C to about 222°C. The solder alloy is noneutectic, and therefore characterized by solidus and liquidus temperatures, the former being in a range of about 215°C to about 218°C, while the latter is about 290°C or more. However, the melting mechanism exhibited by the alloy is such that the alloy is substantially all melted and does not exhibit a "mushy zone" above the effective melting range, enabling the alloy to behave similarly to the SnAgCu eutectic alloy

Abstract translation: 一种无铅焊料合金，其基本上由重量比为3.0％至3.5％的银，大于1％至约15％的铜，余量为锡和附带杂质，并且具有约215℃至约 焊料合金是共晶的，因此以固相线和液相线为特征，前者在约215℃至约218℃的范围内，而后者约为290℃或更高。 然而，合金显示的熔化机理使得合金基本上全部熔化，并且在有效熔融范围之上不显示“糊状区域”，使得该合金的行为与SnAgCu共晶合金类似