公开(公告)号：EP1344597A1

公开(公告)日：2003-09-17

申请号：EP03075594.6

申请日：2003-02-28

Applicant: Delphi Technologies, Inc.

Inventor： Yeh, Shing ,  Carter, Bradley H. ,  Melcher, Curtis W.

IPC: B23K35/26

CPC classification number: B23K35/262

Abstract: A lead-free solder alloy consisting essentially of, by weight, 3.0% to 3.5% silver, greater than 1% to about 15% copper, the balance tin and incidental impurities, and having an effective melting range of about 215°C to about 222°C. The solder alloy is noneutectic, and therefore characterized by solidus and liquidus temperatures, the former being in a range of about 215°C to about 218°C, while the latter is about 290°C or more. However, the melting mechanism exhibited by the alloy is such that the alloy is substantially all melted and does not exhibit a "mushy zone" above the effective melting range, enabling the alloy to behave similarly to the SnAgCu eutectic alloy

Abstract translation: 一种无铅焊料合金，其基本上由重量比为3.0％至3.5％的银，大于1％至约15％的铜，余量为锡和附带杂质，并且具有约215℃至约 焊料合金是共晶的，因此以固相线和液相线为特征，前者在约215℃至约218℃的范围内，而后者约为290℃或更高。 然而，合金显示的熔化机理使得合金基本上全部熔化，并且在有效熔融范围之上不显示“糊状区域”，使得该合金的行为与SnAgCu共晶合金类似

公开(公告)号：EP0953400A1

公开(公告)日：1999-11-03

申请号：EP99200888.8

申请日：1999-03-23

Applicant: Delphi Technologies, Inc.

Inventor： Yeh, Shing ,  Melcher, Curtis Wayne ,  Carter, Bradley Howard

IPC: B23K35/26

CPC classification number: B23K35/262 ,  C22C13/00

Abstract: A lead-free solder alloy suitable for forming solder joints of a surface-mount integrated circuit device, such as a flip chip. The solder alloy has a sufficiently low liquidus temperature to achieve desirable reflow properties at temperatures of 240°C and less, and is therefore compatible with integrated circuit processes. The solder alloy has a sufficiently high solidus temperature to ensure that solder joints formed with the alloy exhibit suitable mechanical properties at application temperatures up to 150°C when mounting a component to a laminate substrate. The solder alloy generally contains, in weight percent, about 7 to about 11% indium, about 2.5 to about 3.5% silver, and about 0.5 to about 1.5% copper, the balance tin and incidental impurities.

Abstract translation: 无铅锡基焊料合金包含（重量％）：7-11铟，2.5-3.5银和0.5-1.5铜，该焊料合金的固相线和液相线温度低于200℃， 优选189℃的固相线温度和197℃的液相线温度以及小于240℃的回流温度。

公开(公告)号：EP2275309B1

公开(公告)日：2017-04-26

申请号：EP10167130.3

申请日：2010-06-24

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Yeh, Shing ,  Gose, Mark W.

IPC: B60R16/027 ,  C22C28/00 ,  H01R39/64

CPC classification number: H01R39/646 ,  B60R16/027 ,  C22C28/00 ,  H01R2201/26

公开(公告)号：EP0953400B1

公开(公告)日：2002-02-20

申请号：EP99200888.8

申请日：1999-03-23

Applicant: Delphi Technologies, Inc.

Inventor： Yeh, Shing ,  Melcher, Curtis Wayne ,  Carter, Bradley Howard

IPC: B23K35/26

CPC classification number: B23K35/262 ,  C22C13/00

公开(公告)号：EP1965619A2

公开(公告)日：2008-09-03

申请号：EP08151443.2

申请日：2008-02-14

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Degenkolb, Thomas A. ,  Yeh, Shing

IPC: H05K3/32 ,  H01L23/40 ,  H05K7/10

CPC classification number: H05K7/2049 ,  H01L24/05 ,  H01L24/06 ,  H01L24/72 ,  H01L25/072 ,  H01L2224/05644 ,  H01L2224/06181 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00

Abstract: An improved vertical integrated circuit device package (10) that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device (14) having electrodes (20,21) on opposite surfaces, and a compressed spring member (12c) that is used to establish compression electrical connections between the electrodes (20) and corresponding electrically conductive elements (24).

Abstract translation: 提供了改进的垂直集成电路器件封装（10），其消除或减少对引线接合连接和/或焊接连接的需要。 该封装包括在相对表面上具有电极（20,21）的垂直装置（14）和用于在电极（20）和对应的导电元件（24）之间建立压缩电连接的压缩弹簧构件（12c） 。

公开(公告)号：EP0962275A3

公开(公告)日：2005-08-10

申请号：EP99201577.6

申请日：1999-05-19

Applicant: Delphi Technologies, Inc.

Inventor： Yeh, Shing ,  Jordan, Larry Lee ,  Duffer, Anthony Alan ,  Sparks, Douglas Ray ,  Beni, Ruth Ellen

IPC: B23K1/00 ,  H01L21/00

CPC classification number: B81C1/00269

Abstract: A method by which semiconductor wafers (10, 12) can be solder bonded to form a semiconductor device, such as a sensor with a micromachined structure (14). The method entails forming a solderable ring (18) on the mating surface of a device wafer (10), such that the solderable ring (18) circumscribes the micromachine (14) on the wafer (10). A solderable layer (20, 26, 28) is formed on a capping wafer (12), such that at least the mating surface (24) of the capping wafer (12) is entirely covered by the solderable layer (20, 26, 28). The solderable layer (20, 26, 28) can be formed by etching the mating surface (24) of the capping wafer (12) to form a recess (16) circumscribed by the mating surface (24), and then forming the solderable layer (26) to cover the mating surface (24) and the recess (16) of the capping wafer (12). Alternatively, the solderable layer (28) can be formed by depositing a solderable material to cover the entire lower surface of the capping wafer (12), patterning the resulting solderable layer (28) to form an etch mask on the capping wafer (12), and then to form the recess (16), such that the solderable layer (28) covers the mating surface (24) but not the surfaces of the recess (16).

公开(公告)号：EP1402989A1

公开(公告)日：2004-03-31

申请号：EP03078013.4

申请日：2003-09-23

Applicant: Delphi Technologies, Inc.

Inventor： Carter, Bradley H. ,  Yeh, Shing

IPC: B23K35/26 ,  B23K1/00 ,  H05K3/34

CPC classification number: C22C13/00 ,  B23K35/007 ,  B23K35/262 ,  B23K35/268 ,  B23K2201/36 ,  C22C11/00 ,  H05K1/092 ,  H05K3/3463 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12896

Abstract: A tin-lead solder alloy containing copper and/or nickel and optionally silver, palladium, platinum and/or gold as its alloying constituents. The solder alloy consists essentially of, by weight, about 5% to about 70 % tin, up to about 4% silver palladium, platinum and/or gold, about 0.5 % to about 10% copper and/or nickel, the balance lead and incidental impurities. The presence of copper and/or nickel in the alloy has the beneficial effect of inhibiting the dissolution and leaching of silver from a silver-containing thick-film, such as a conductor (18) or solder pad (16), into the molten solder alloy during reflow. In addition, solder joints (22) formed of the solder alloy form a diffusion barrier layer (24,26) of intermetallic compounds that inhibit solid-state interdiffusion between silver from a silver-containing thick-film (16,18) and tin from the solder joint (22).

Abstract translation: 含有铜和/或镍以及任选的银，钯，铂和/或金作为其合金成分的锡铅焊料合金。 焊料合金基本上由重量计约5％至约70％的锡，至多约4％的银钯，铂和/或金，约0.5％至约10％的铜和/或镍，余量铅和 附带杂质。 合金中铜和/或镍的存在有利于在回流期间抑制银从含银厚膜如导体或焊盘浸入熔融焊料合金中的溶解和浸出。 此外，由焊料合金形成的焊点形成金属间化合物的扩散阻挡层，其阻止来自含银厚膜的银与来自焊料接头的锡之间的固态相互扩散。

公开(公告)号：EP1391261A1

公开(公告)日：2004-02-25

申请号：EP03077387.3

申请日：2003-07-30

Applicant: Delphi Technologies, Inc.

Inventor： Yeh, Shing ,  Carter, Bradley H. ,  Stepniak, Frank ,  Brandenburg, Scott D.

IPC: B23K35/26 ,  H05K3/34

CPC classification number: B23K35/262 ,  B23K2201/36 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  Y10T428/12528 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A tin-lead solder alloy containing copper and optionally silver as its alloying constituents. The solder alloy consists essentially of, by weight, about 55% to about 75% tin, about 11% to about 44% lead, up to about 4% silver, nickel, palladium, platinum and/or gold, greater than 1% to about 10% copper, and incidental impurities. The solder alloys contain a small portion of CuSn intermetallic compounds, and exhibit a melting mechanism in which all but the intermetallic compounds melt within a narrow temperature range, though the actual liquidus temperature of the alloys may be considerably higher, such that the alloys can be treated as requiring peak reflow temperatures of about 250°C or less. The intermetallic compounds precipitate out to form a diffusion barrier that increases the reliability of solder connections formed therewith.

Abstract translation: 包含铜和任选的银作为其合金成分的锡铅焊料合金。 焊料合金基本上由重量计约55％至约75％的锡，约11％至约44％的铅，至多约4％的银，镍，钯，铂和/或金，大于1％ 约10％的铜和杂质。 焊料合金含有少量的CuSn金属间化合物，并且表现出熔融机理，其中除了金属间化合物之外，所有金属间化合物都在窄的温度范围内熔化，尽管合金的实际液相线温度可能相当高，使得合金可以 处理为需要约250℃或更低的回流温度。 金属间化合物沉淀出来形成扩散阻挡层，从而增加与其形成的焊料连接的可靠性。

公开(公告)号：EP2473016A1

公开(公告)日：2012-07-04

申请号：EP11193684.5

申请日：2011-12-15

Applicant: Delphi Technologies, Inc.

Inventor： Sozansky, Wayne A. ,  Yeh, Shing

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3421 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y02P70/613

Abstract: A system (10) and method (300) for supporting an electronic component (12) attached to a circuit board (14). solder paste (40) is applied to a solder pad (16) underneath and aligned with a non-wetting region (18) of an electronic component (12) to form a support (34) formed of solder to prevent electronic component (12) lead (26) flexing. The amount of solder for forming the support (34) and the size of the solder pad (16) are selected to bring the support (34) into contact with, or in close proximity to, the non-wetting region (18).

Abstract translation: 一种用于在电子部件支撑系统（10）和方法（300）（12）连接到一个电路板（14）。 焊膏（40）被施加到焊料焊盘（16）的下方并且与电子元件（12）的非润湿区域（18）对齐以形成FORMED焊料的支撑件（34），以防止电子元件（12） 引线（26）挠曲。 焊料用于形成支撑件（34）和焊料焊盘（16）的大小的量被选择，以使支承件（34）接触到或靠近，非润湿区域（18）。

公开(公告)号：EP2275309A1

公开(公告)日：2011-01-19

申请号：EP10167130.3

申请日：2010-06-24

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Yeh, Shing ,  Gose, Mark W.

IPC: B60R16/027 ,  C22C28/00

CPC classification number: H01R39/646 ,  B60R16/027 ,  C22C28/00 ,  H01R2201/26

Abstract: A liquid metal rotary connector (16) for a vehicle steering mechanism (10) utilizes a conductive alloy comprising Gallium, Indium, Tin and Zinc to electrically couple stationary and rotary terminals (26a, 26b; 28a, 28b) of the connector (16). The alloy is a liquid at ambient temperatures, and has a melting point of -36°C, though testing has shown that it operates satisfactorily at temperatures as low as -40°C. In a preferred arrangement, the rotary connector (16) provides a two-wire connection through which power is supplied from the steering column (12) to the steering wheel (14), and electronic modules (22, 24) located in the steering column (12) and the steering wheel (14) support bi-directional data communication through voltage and current modulation of the supplied power.

Abstract translation: 一种用于车辆的转向机构（10）的液体金属旋转连接器（16）利用导电性合金包括镓，铟，锡和锌以电耦合固定和旋转端子（26A，26B; 28A，28B）的连接器（16）的 ， 该合金是在环境温度下是液体，并具有-36℃的熔点，尽管测试已经显示它并在温度低到-40℃的满意地工作 在一个优选的布置中，旋转连接器（16）提供，通过该动力从转向柱（12）提供一个两线连接到位于转向柱的方向盘（14）和电子模块（22，24） （12）与方向盘（14）支持双向数据通信通过供给的电力的电压和电流调制。