公开(公告)号：EP1843392A1

公开(公告)日：2007-10-10

申请号：EP07075214.2

申请日：2007-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Ruiz, Javier

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: An electronics assembly (10) is provided having a housing (12) including walls defining a fluid vessel. One or more thermally conductive heat sink devices (20) extend through one or more openings (40) in the housing (12) and in thermal communication with a liquid coolant. One or more electronics devices (30) are mounted onto a mounting surface (22) of the heat sink devices (20) such that the electronics devices (30) are cooled by the liquid coolant in the fluid vessel.

Abstract translation: 电子组件（10）设置有具有限定流体容器的壁的壳体（12）。 一个或多个导热散热装置（20）延伸穿过壳体（12）中的一个或多个开口（40）并与液体冷却剂热连通。 一个或多个电子设备（30）被安装在散热器设备（20）的安装表面（22）上，使得电子设备（30）被流体容器中的液体冷却剂冷却。

公开(公告)号：EP1796444A2

公开(公告)日：2007-06-13

申请号：EP06077045.0

申请日：2006-11-17

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Djordjevic, Aleksandra ,  Ruiz, Javier

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L24/33 ,  H01L2224/32225 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H05K3/0061 ,  H05K2201/09836 ,  H01L2924/00

Abstract: An electronics assembly (10) is provided including a circuit board substrate (20) having a top surface and a bottom surface and a plurality of thermal conductive vias (26) extending from the top surface to the bottom surface. At least one electronics package (12) is mounted to the top surface of the substrate (20). A heat sink device (30) is in thermal communication with the bottom surface of the substrate (20). Thermal conductive vias (26) are in thermal communication to pass thermal energy from the at least one electronics package (12) to the heat sink (30). At least some of the thermal conductive vias (26) are formed extending from the top surface to the bottom surface of the substrate (20) at an angle (θ).

Abstract translation: 提供一种电子组件（10），其包括具有顶表面和底表面的电路板基底（20）和从顶表面延伸到底表面的多个导热通孔（26）。 至少一个电子封装（12）安装到基板（20）的顶表面。 散热装置（30）与衬底（20）的底表面热连通。 导热通孔（26）热连通以将来自至少一个电子封装（12）的热能传递到散热器（30）。 至少一些导热通孔（26）形成为以角度（R）从基板（20）的顶表面延伸到底表面。

公开(公告)号：EP1796444A3

公开(公告)日：2008-11-05

申请号：EP06077045.0

申请日：2006-11-17

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Djordjevic, Aleksandra ,  Ruiz, Javier

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L24/33 ,  H01L2224/32225 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H05K3/0061 ,  H05K2201/09836 ,  H01L2924/00

Abstract: An electronics assembly (10) is provided including a circuit board substrate (20) having a top surface and a bottom surface and a plurality of thermal conductive vias (26) extending from the top surface to the bottom surface. At least one electronics package (12) is mounted to the top surface of the substrate (20). A heat sink device (30) is in thermal communication with the bottom surface of the substrate (20). Thermal conductive vias (26) are in thermal communication to pass thermal energy from the at least one electronics package (12) to the heat sink (30). At least some of the thermal conductive vias (26) are formed extending from the top surface to the bottom surface of the substrate (20) at an angle (θ).