公开(公告)号：EP1667226A3

公开(公告)日：2008-10-22

申请号：EP05077632.7

申请日：2005-11-18

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Zimmerman, David W. ,  Chengalva, Suresh K.

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/0061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09745 ,  H05K2201/1056 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (40,50) having a laminate construction of multiple layers (12), such as a LTCC ceramic substrate (10), with conductor lines (30) between adjacent pairs of layers (12). A heat sink (22) is bonded to a first surface (26) of the substrate (10), and a cavity (24) is defined by and between the heat sink (22) and the substrate (10) such that a base wall (28) of the cavity (24) is defined by one of the layers (12) with conductor lines (30) thereof being present on the base wall (28). A surface-mount circuit device (14) is received within the cavity (24), mounted to the base wall (28), and electrically connected to the conductor lines (30) on the base wall (28). The device (14) is received within the cavity (24) such that a surface of the device (14) contacts a surface region of the heat sink (22). The surface of the device (14) is bonded to the surface region of the heat sink (22) to provide a substantially direct thermal path from the device (14) to the heat sink (22).

公开(公告)号：EP1718138A2

公开(公告)日：2006-11-02

申请号：EP06075721.8

申请日：2006-03-29

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Badget, Jerome L.

IPC: H05K3/00

CPC classification number: H05K1/0266 ,  H05K1/0306 ,  H05K3/0002 ,  H05K3/0005 ,  H05K3/1225 ,  H05K3/1291 ,  H05K3/3484 ,  H05K2201/0125 ,  H05K2203/056 ,  H05K2203/1126

Abstract: Substrate shrinkage that occurs during manufacture of an electronic assembly (100A) is compensated for by the incorporation of a horizontal line (102,104), having a plurality of vertical graduations, across a horizontal portion of a substrate (100) and a vertical line (106,108), having a plurality of horizontal graduations, across a vertical portion of the substrate (100). The substrate (100) is then cured and an amount of substrate shrinkage is determined, based upon a location change in the graduations of the horizontal and vertical lines (102,104,106,108). In this manner, solder can be properly provided on solder pads of the substrate (100) responsive to the amount of substrate shrinkage. As such, electronic components (110,112,114,116) can be properly mounted to the solder pads of the substrate (100).

Abstract translation: 衬底收缩确实制造电子组件（100A）被用于通过一个水平行（102,104）的掺入补偿的过程中发生，具有垂直刻度的复数，跨越衬底（100）和垂直线的水平部分（106.108 ），具有水平刻度的复数，横跨衬底（100）的垂直部分。 然后将底物（100）被固化并在基板收缩量是确定性的开采，根据在水平和垂直线（102104106108）的刻度的位置改变。 以这种方式，焊料可以适当地设置在响应于收缩底物量的底物（100）的焊盘。 为供试，电子部件（110112114116）可以被正确地安装在基板（100）的焊盘。

公开(公告)号：EP1796444A2

公开(公告)日：2007-06-13

申请号：EP06077045.0

申请日：2006-11-17

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Djordjevic, Aleksandra ,  Ruiz, Javier

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L24/33 ,  H01L2224/32225 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H05K3/0061 ,  H05K2201/09836 ,  H01L2924/00

Abstract: An electronics assembly (10) is provided including a circuit board substrate (20) having a top surface and a bottom surface and a plurality of thermal conductive vias (26) extending from the top surface to the bottom surface. At least one electronics package (12) is mounted to the top surface of the substrate (20). A heat sink device (30) is in thermal communication with the bottom surface of the substrate (20). Thermal conductive vias (26) are in thermal communication to pass thermal energy from the at least one electronics package (12) to the heat sink (30). At least some of the thermal conductive vias (26) are formed extending from the top surface to the bottom surface of the substrate (20) at an angle (θ).

Abstract translation: 提供一种电子组件（10），其包括具有顶表面和底表面的电路板基底（20）和从顶表面延伸到底表面的多个导热通孔（26）。 至少一个电子封装（12）安装到基板（20）的顶表面。 散热装置（30）与衬底（20）的底表面热连通。 导热通孔（26）热连通以将来自至少一个电子封装（12）的热能传递到散热器（30）。 至少一些导热通孔（26）形成为以角度（R）从基板（20）的顶表面延伸到底表面。

公开(公告)号：EP1667226A2

公开(公告)日：2006-06-07

申请号：EP05077632.7

申请日：2005-11-18

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Zimmerman, David W. ,  Chengalva, Suresh K.

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/0061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09745 ,  H05K2201/1056 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (40,50) having a laminate construction of multiple layers (12), such as a LTCC ceramic substrate (10), with conductor lines (30) between adjacent pairs of layers (12). A heat sink (22) is bonded to a first surface (26) of the substrate (10), and a cavity (24) is defined by and between the heat sink (22) and the substrate (10) such that a base wall (28) of the cavity (24) is defined by one of the layers (12) with conductor lines (30) thereof being present on the base wall (28). A surface-mount circuit device (14) is received within the cavity (24), mounted to the base wall (28), and electrically connected to the conductor lines (30) on the base wall (28). The device (14) is received within the cavity (24) such that a surface of the device (14) contacts a surface region of the heat sink (22). The surface of the device (14) is bonded to the surface region of the heat sink (22) to provide a substantially direct thermal path from the device (14) to the heat sink (22).

Abstract translation: 电路板组件（40,50）具有多层（12）的叠层结构，例如LTCC陶瓷衬底（10），在相邻的层对（12）之间具有导线（30）。 散热器（22）被结合到基板（10）的第一表面（26）上，并且在散热器（22）和基板（10）之间由散热器（22）和基板（10）之间限定空腔（24），使得底壁 腔（24）中的一个（28）由其中一个层（12）限定，其中导体线（30）存在于基壁（28）上。 表面安装电路装置（14）被容纳在空腔（24）内，安装到基壁（28），并且电连接到基壁（28）上的导线（30）。 装置（14）被容纳在空腔（24）内，使得装置（14）的表面接触散热器（22）的表面区域。 装置（14）的表面结合到散热器（22）的表面区域，以提供从装置（14）到散热器（22）的基本上直接的热路径。

公开(公告)号：EP2407348A1

公开(公告)日：2012-01-18

申请号：EP11172691.5

申请日：2011-07-05

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Zimmerman, David W. ,  Miller, Michael E.

IPC: B60R1/00 ,  G06K9/00

CPC classification number: B60R1/00 ,  B60R2300/202 ,  B60R2300/301 ,  B60R2300/306 ,  B60R2300/70 ,  B60R2300/802 ,  B60R2300/8093 ,  G06K9/00805 ,  G06K9/2054

Abstract: A vision system in a vehicle (10) and a method (600) for operating the system. The system displays a field of view that is a portion of an image (200) of an area (24) proximate to the vehicle (10). The system includes an object detection means that provides an indication of an object being present in the area (24) proximate to the vehicle (10). The field of view is selected at least in part based on the detection of the object, such as directing the field of view toward the object so the vehicle (10) driver (12) can more easily discern the presence of the object in a display (14).

Abstract translation: 视觉系统在车辆（10）和用于操作该系统的方法（600），该系统显示的视场确实是一个区域的图像（200）的一个部分（24）靠近所述车辆（10） ， 该系统包括在物体检测bedeutet，DASS提供有关对象存在于该区域的指示（24）靠近所述车辆（10）。 的视场至少部分地基于所述检测的对象，颜色的选择：如引导的视场朝向物体为车辆（10）驾驶员（12）可以更容易地辨别在显示的物体的存在 （14）。

公开(公告)号：EP1796444A3

公开(公告)日：2008-11-05

申请号：EP06077045.0

申请日：2006-11-17

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Djordjevic, Aleksandra ,  Ruiz, Javier

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L24/33 ,  H01L2224/32225 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H05K3/0061 ,  H05K2201/09836 ,  H01L2924/00

Abstract: An electronics assembly (10) is provided including a circuit board substrate (20) having a top surface and a bottom surface and a plurality of thermal conductive vias (26) extending from the top surface to the bottom surface. At least one electronics package (12) is mounted to the top surface of the substrate (20). A heat sink device (30) is in thermal communication with the bottom surface of the substrate (20). Thermal conductive vias (26) are in thermal communication to pass thermal energy from the at least one electronics package (12) to the heat sink (30). At least some of the thermal conductive vias (26) are formed extending from the top surface to the bottom surface of the substrate (20) at an angle (θ).

公开(公告)号：EP1718138A3

公开(公告)日：2007-08-08

申请号：EP06075721.8

申请日：2006-03-29

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Badget, Jerome L.

IPC: H05K3/00

CPC classification number: H05K1/0266 ,  H05K1/0306 ,  H05K3/0002 ,  H05K3/0005 ,  H05K3/1225 ,  H05K3/1291 ,  H05K3/3484 ,  H05K2201/0125 ,  H05K2203/056 ,  H05K2203/1126

Abstract: Substrate shrinkage that occurs during manufacture of an electronic assembly (100A) is compensated for by the incorporation of a horizontal line (102,104), having a plurality of vertical graduations, across a horizontal portion of a substrate (100) and a vertical line (106,108), having a plurality of horizontal graduations, across a vertical portion of the substrate (100). The substrate (100) is then cured and an amount of substrate shrinkage is determined, based upon a location change in the graduations of the horizontal and vertical lines (102,104,106,108). In this manner, solder can be properly provided on solder pads of the substrate (100) responsive to the amount of substrate shrinkage. As such, electronic components (110,112,114,116) can be properly mounted to the solder pads of the substrate (100).