公开(公告)号：EP1601012A2

公开(公告)日：2005-11-30

申请号：EP05076018.0

申请日：2005-05-02

Applicant: Delphi Technologies, Inc.

Inventor： Runyon, Ronnie J. ,  Berndt, Joanna C. ,  Oberlin, Gary E.

IPC: H01L21/60 ,  H01L29/06

CPC classification number: H01L24/83 ,  H01L23/3735 ,  H01L24/32 ,  H01L29/0657 ,  H01L2224/27013 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15747 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10166 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A microelectronic assembly (10,100) includes a component (12,102) attached to a substrate (14,104) by a variable thickness solder joint (30,108) . The solder joint comprises a first thickness (t1) adjacent the central region (20,110) of the component and a second, relatively greater thickness (t2) adjacent the perimeter region (22,112) of the component. The variable thickness solder joint may be used for attaching a power die to a metal heat sink on a printed circuit board (16,106), so that the relatively thin central portion promotes thermal dissipation to maintain the die within a desired operating temperature range, and the relatively thick perimeter region distributes thermally induced stresses to enhance joint strength and reduce fatigue cracking.

Abstract translation: 微电子组件（10,100）包括通过可变厚度焊接接头（30,108）附接到基板（1414）的部件（12,102）。 焊接接头包括与部件的中心区域（20,110）相邻的第一厚度（t1）和与部件的周边区域（22,112）相邻的第二相对较大的厚度（t2）。 可变厚度焊接点可以用于将功率管芯附接到印刷电路板（16,106）上的金属散热器，使得相对薄的中心部分促进散热以将管芯保持在期望的工作温度范围内，并且 相对较厚的周边区域分布热诱导应力以增强接头强度并减少疲劳开裂。

公开(公告)号：EP1601012A3

公开(公告)日：2006-06-07

申请号：EP05076018.0

申请日：2005-05-02

Applicant: Delphi Technologies, Inc.

Inventor： Runyon, Ronnie J. ,  Berndt, Joanna C. ,  Oberlin, Gary E.

IPC: H01L21/60 ,  H01L29/06

CPC classification number: H01L24/83 ,  H01L23/3735 ,  H01L24/32 ,  H01L29/0657 ,  H01L2224/27013 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15747 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10166 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A microelectronic assembly (10,100) includes a component (12,102) attached to a substrate (14,104) by a variable thickness solder joint (30,108) . The solder joint comprises a first thickness (t1) adjacent the central region (20,110) of the component and a second, relatively greater thickness (t2) adjacent the perimeter region (22,112) of the component. The variable thickness solder joint may be used for attaching a power die to a metal heat sink on a printed circuit board (16,106), so that the relatively thin central portion promotes thermal dissipation to maintain the die within a desired operating temperature range, and the relatively thick perimeter region distributes thermally induced stresses to enhance joint strength and reduce fatigue cracking.