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    Fluid cooled electronic assembly
    2.
    发明公开
    Fluid cooled electronic assembly 审中-公开
    Flüssigkeitsgekühlteelektronische Anordnung

    公开(公告)号：EP1840962A1

    公开(公告)日：2007-10-03

    申请号：EP07075221.7

    申请日：2007-03-22

    Applicant: Delphi Technologies, Inc.

    Inventor： Peugh, Darrel E. ,  Myers, Bruce A. ,  Oberlin, Gary E.

    IPC: H01L23/473

    CPC classification number: H01L23/053 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/13055 ,  H01L2924/00

    Abstract: An electronic assembly (10) is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device (20) within a sealed compartment. The assembly (10) includes a housing generally defining a sealed fluid compartment, an electronic device (20) disposed within the housing (16) and a cooling liquid for cooling the electronic device (20). The assembly (10) includes inlet and outlet ports (44 and 46) in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device (20). Fluid flow channels (26) are formed in thermal communication with the electronic device (20) within the housing (16). The fluid channels (26) include channels that allow liquid to flow in thermal communication with the electronic device (20) to cool the device (20).

    Abstract translation: 提供了一种电子组件（10），其具有诸如液体的热冷却流体，用于冷却密封隔室内的电子设备（20）。 组件（10）包括大致限定密封的流体隔室的壳体，设置在壳体（16）内的电子设备（20）和用于冷却电子设备（20）的冷却液体。 组件（10）包括与密封的流体室流体连通的入口和出口端口（44和46），用于允许冷却液体通过隔室以冷却电子设备（20）。 流体流动通道（26）形成为与壳体（16）内的电子设备（20）热连通。 流体通道（26）包括允许液体与电子设备（20）热连通流动以冷却设备（20）的通道。

    Multi-path bar bond connector for an integrated circuit assembly
    6.
    发明公开
    Multi-path bar bond connector for an integrated circuit assembly 审中-公开
    Mehrwege-StromschienenverbinderfürModul mit integrierten Schaltungen

    公开(公告)号：EP1628346A2

    公开(公告)日：2006-02-22

    申请号：EP05076728.4

    申请日：2005-07-27

    Applicant: Delphi Technologies, Inc.

    Inventor： Oberlin, Gary E. ,  Oman, Todd P.

    IPC: H01L23/48

    CPC classification number: H01L23/49844 ,  H01L23/488 ,  H01L23/492 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/37011 ,  H01L2224/37599 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/37099

    Abstract: A solderable bar bond connector (16) establishes a primary interconnect between a substrate (12) and a high current terminal (34) of an IC chip (14) mounted on the substrate (12), and one or more secondary interconnects between the substrate (12) and low current terminals (36, 38, 40) of the IC chip (14). The bar bond connector (16) includes a plate portion (18) soldered to the high current terminal (34) of the IC chip (14) and a plurality of leg elements (20-32) extending from the plate portion (18) to multiple bond sites (42, 44, 46, 48) on the substrate (12). The underside of at least one leg element (20/26/32) is provided with a secondary circuit (50/52/54) including a conductor (58) that is electrically isolated from the respective leg element (20/26/32). The conductor (58) of the secondary circuit (50/52/54) is soldered to both the substrate (12) and a low current terminal (36/38/40) of the IC chip (14) for establishing a secondary interconnect in addition to the primary interconnect established by the plate portion (18) and the other leg elements (22, 24, 28, 30).

    Abstract translation: 可焊接棒接合连接器（16）在衬底（12）和安装在衬底（12）上的IC芯片（14）的高电流端子（34）之间建立初级互连，并且在衬底 （12）和IC芯片（14）的低电流端子（36,38,40）。 棒接合连接器（16）包括焊接到IC芯片（14）的高电流端子（34）的板部分（18）和从板部分（18）延伸到多个支脚元件（20-32） 多个键合位点（42,44,46,48）在衬底（12）上。 至少一个支腿元件（20/26/32）的下侧设置有包括导体（58）的次级电路（50/52/54），该导体与相应的支脚元件（20/26/32）电隔离， 。 次级电路（50/52/54）的导体（58）焊接到IC芯片（14）的基板（12）和低电流端子（36/38/40），用于建立二次互连 除了由板部分（18）和其它支腿元件（22,24,28,30）建立的主互连之外。

    Thermal conductor and use thereof
    8.
    发明公开
    Thermal conductor and use thereof 审中-公开
    热导体及其使用

    公开(公告)号：EP1708262A3

    公开(公告)日：2009-09-16

    申请号：EP06075616.0

    申请日：2006-03-16

    Applicant: Delphi Technologies, Inc.

    Inventor： Oberlin, Gary E.

    IPC: H01L23/433

    CPC classification number: H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A thermal conductor (16) suitable for communicating heat from an integrated circuit (14) to a thermal transfer device (18) is disclosed. The thermal conductor (16) comprises a base having a first portion (22) and a second portion (24), wherein the first portion (22) is adapted to be positioned substantially planar to and proximate the integrated circuit (14), and further wherein the second portion (24) includes sidewalls that define an aperture (26) in the body and forms a spherical cavity, and wherein the aperture (26) is adapted to pivotally receive at least a portion of the thermal transfer device (18) such that at least a portion of the thermal transfer device (18) is in thermal communication with the integrated circuit (14).

    Method of producing an overmolded electronic module with a flexible circuit pigtail
    9.
    发明公开
    Method of producing an overmolded electronic module with a flexible circuit pigtail 审中-公开
    一种用于制备重铸电子模块的与柔性Schaltkreisanschlusslitze过程

    公开(公告)号：EP2053907A2

    公开(公告)日：2009-04-29

    申请号：EP08166610.9

    申请日：2008-10-14

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Laudick, David A. ,  Oberlin, Gary E.

    IPC: H05K3/28 ,  H05K1/14

    CPC classification number: H05K3/284 ,  B29C45/14377 ,  B29C45/14418 ,  B29C45/14639 ,  B29C45/14836 ,  B29C45/72 ,  H05K1/118 ,  H05K1/147 ,  H05K3/361 ,  H05K5/065 ,  H05K2201/0239 ,  H05K2203/1121 ,  H05K2203/1316 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49172 ,  Y10T29/5193

    Abstract: An electronic assembly including a circuit board (16) and a flexible circuit interconnect (14) is overmolded by fixturing the assembly in a mold cavity such that a portion of the flexible circuit (14) protrudes from the mold, and providing a compressible elastomeric interface (18a/20a, 32) between the mold (18, 20) and the flexible circuit (14) to seal off the mold cavity and protect the flexible circuit (14) from damage due to the clamping force of the mold (18, 20). The portion of the flexible circuit (14) within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound (30), and a heat exchanger (26) thermally coupled to the portion of the flexible circuit (14) that protrudes from the mold protects the flexible circuit (14) from damage due to thermal conduction from the mold (18, 20) and mold compound (30).

    Abstract translation: 一种电子组件，其包括一电路板（16）和柔性电路互连（14）由在模腔中搜索装夹组件包覆模制做的柔性电路（14）的部分从模具中突出，并且提供了一个可压缩的弹性界面 所述模具（18,20）和所述柔性电路（14）之间（18A / 20A，32），以封闭所述模具腔，并保护免受损坏柔性电路（14）由于模具的夹紧力（18，20 ）。 在模腔内的柔性电路（14）的所述部分是预涂覆有材料确实确保与热耦合到所述柔性电路的所述部分的模制化合物（30），和一个热交换器（26）良好的粘附性（14 ）由于从模具（热传导18，20）和模制化合物（30那样突出从模具中免受损坏柔性电路（14））。

    Thermal conductor and use thereof
    10.
    发明公开
    Thermal conductor and use thereof 审中-公开
    Thermischer Leiter und dessen Verwendung

    公开(公告)号：EP1708262A2

    公开(公告)日：2006-10-04

    申请号：EP06075616.0

    申请日：2006-03-16

    Applicant: Delphi Technologies, Inc.

    Inventor： Oberlin, Gary E.

    IPC: H01L23/433

    CPC classification number: H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A thermal conductor (16) suitable for communicating heat from an integrated circuit (14) to a thermal transfer device (18) is disclosed. The thermal conductor (16) comprises a base having a first portion (22) and a second portion (24), wherein the first portion (22) is adapted to be positioned substantially planar to and proximate the integrated circuit (14), and further wherein the second portion (24) includes sidewalls that define an aperture (26) in the body and forms a spherical cavity, and wherein the aperture (26) is adapted to pivotally receive at least a portion of the thermal transfer device (18) such that at least a portion of the thermal transfer device (18) is in thermal communication with the integrated circuit (14).

    Abstract translation: 公开了一种适用于将热量从集成电路（14）传递到热传递装置（18）的热导体（16）。 热导体（16）包括具有第一部分（22）和第二部分（24）的基座，其中第一部分（22）适于被定位成基本平坦于并且靠近集成电路（14），并且还 其中所述第二部分（24）包括在所述主体中限定孔（26）并形成球形腔的侧壁，并且其中所述孔（26）适于枢转地接收所述热转印装置（18）的至少一部分， 所述热转印装置（18）的至少一部分与所述集成电路（14）热连通。

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