公开(公告)号：EP2017889A2

公开(公告)日：2009-01-21

申请号：EP08157492.3

申请日：2008-06-03

Applicant: Delphi Technologies, Inc.

Inventor： Flederbach, Lynda G. ,  Weed, Rick A. ,  Carter, Bradley H. ,  Gerbsch, Erich W. ,  Isenberg, John, K. ,  Berlin, Carl W.

IPC: H01L23/498

CPC classification number: H01L23/49861 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electrically isolated and thermally conductive double-sided prepackaged integrated circuit component exhibiting excellent heat dissipative properties, durability and strength, and which can be manufactured at a low cost includes electrically insulated and thermally conductive substrate members having outer surfaces, ultra-thick thick film materials secured to the outer surfaces of the substrate members and a lead member and a transistor member positioned between the substrate members.

Abstract translation: 显示出优异的散热特性，耐久性和强度的电绝缘导热双面预包装集成电路部件，并且可以以低成本制造，包括具有外表面的电绝缘导热基板部件，超厚厚膜材料 固定到基板构件的外表面和引导构件以及定位在基板构件之间的晶体管构件。