公开(公告)号：EP2814310A2

公开(公告)日：2014-12-17

申请号：EP14171564.9

申请日：2014-06-06

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  H05K7/20236 ,  H05K7/20872

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly (10). The configuration allows for more direct contact between the electronic device and the coolant (16), while protecting the electronic device from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract translation: 一种液体冷却配置为使用导电的冷却剂（16）以冷却功率电子器件做功率电子组件（10）用来与周围的电介质板的外周的金属套筒密封，以形成一个装置组件（10），电介质板。 构造允许所述电子装置和冷却剂（16）之间的更直接的接触，而具有潜在的导电的冷却剂（16）保护所述电子设备从接触。 材料用于形成电介质板与所述壳体（18）被选择为具有象在密封件的可靠性最大化热膨胀（CTE）的系数相似。

公开(公告)号：EP1748688A2

公开(公告)日：2007-01-31

申请号：EP06076287.9

申请日：2006-06-23

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Chengalva, Suresh K. ,  Brandenburg, Scott D. ,  Myers, Bruce A.

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L23/44 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K7/20236 ,  H05K7/20909 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.

Abstract translation: 提供了具有循环浸没冷却流体和方法的电子封装。 电子封装具有限定密封外壳的外壳和位于外壳中的电子设备。 电子设备具有热发射电路。 电介质流体，例如液体，以与电子设备的热传递关系位于壳体中。 诸如压电风扇的流体循环器位于壳体中，与电介质液体接触，用于循环介电液体以冷却电子设备。

公开(公告)号：EP1659839A2

公开(公告)日：2006-05-24

申请号：EP05077548.5

申请日：2005-11-07

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Sarma, Dwadasi H. ,  Myers, Bruce A.

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K3/341 ,  H05K3/4061 ,  H05K2201/066 ,  H05K2201/10674 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (50,60,70) with a substrate (10) having a laminate construction of ceramic layers, such as an LTCC ceramic substrate (10). The substrate (10) is configured for the purpose of improving the thermal management of power circuit devices mounted to the substrate (10).
Thermally-conductive vias (16,76) extend through the substrate (10) from a first surface (24) thereof to a second surface (26) thereof. A circuit device (14,74) is mounted to the first surface (24) of the substrate (10) and is electrically interconnected to conductor lines (30) of the substrate (10). The device (14,74) is also thermally coupled to the thermally-conductive vias (16,76) with a first solder material (32,72). A heat sink (22) located adjacent the second surface (26) of the substrate (10) is bonded to the thermally-conductive vias (16,76) with a second solder material (34,78), such that the first solder material (32,72), the thermally-conductive vias (16,76), and the second solder material (34,78) define a thermal path from the device (14,74) to the heat sink (22).

Abstract translation: 一种电路板组件（50,60,70）与具有陶瓷层的层叠体构成的基板（10），作为寻求LTCC陶瓷基板（10）。 基板（10）被配置用于提高安装到基板（10）电源电路的设备的热管理的目的。 导热通孔（16,76）通过从第一表面（24）的基板（10）上的第二表面（26）上延伸。 一种电路装置（14,74）被安装到所述基板（10）的第一表面（24）并且被连接到导线基板（10）的电间（30）。 的装置（14,74）被设置成耦合到所述热热传导性通孔（16,76）与第一焊接材料（32,72）。 衬底的散热片（22）位于相邻的所述第二表面（26）（10）被结合到热传导性通孔（16,76）与第二焊接材料（34,78），检测所做的第一焊料材料 （32,72），所述热传导性通孔（16,76），并且所述第二焊接材料（34,78）限定了从所述装置（14,74）到所述散热器（22）的热路径。

公开(公告)号：EP1473741A3

公开(公告)日：2005-04-13

申请号：EP04076242.9

申请日：2004-04-26

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Morken, James R. ,  Sarma, Dwadasi H. ,  Hart, William ,  Downey, Joel F. ,  McGirr, Kevin J.

IPC: H01C7/00 ,  H01C17/242 ,  H01C1/14 ,  G01R1/20

CPC classification number: H01C17/242 ,  H01C7/003 ,  H01C17/23 ,  Y10T29/49082 ,  Y10T29/49099

Abstract: A thick film current sensing resistor (10) is provided having an input terminal (14) for receiving an electrical current (I), and an output terminal (16) for outputting the electrical current (I). A film of resistive material (20) extends between the input and output terminals (14 and 16) and is electrically coupled to the input and output terminals (14 and 16) so that current (I) flows through the film of resistive material (20). A pair of sensing terminals (24 and 26) are provided to sense a voltage potential (Vs) across the film of resistive material (20). The sensed voltage (Vs) provides an indication of the current (I). An gap (32) is formed in the film of resistive material (20) between the input and output terminals (14 and 16) and the sensing terminals (24 and 26). The length (L A ) of the gap (32) defines a voltage sensing point of the sensing terminals (24 and 26).

公开(公告)号：EP2775516A2

公开(公告)日：2014-09-10

申请号：EP14154512.9

申请日：2014-02-10

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Eesley, Gary L.

IPC: H01L23/373 ,  H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49575 ,  H01L23/3735 ,  H01L23/49513 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49861 ,  H01L23/562 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/75981 ,  H01L2224/83203 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An assembly (10) for packaging one or more electronic devices (12) in die form includes substrates (26, 34) on opposite sides of the assembly (10), with lead frames (42, 60) between the electronic devices (12) and the substrates (26, 34). The substrates (26, 34), lead frames (42, 60) and electronic devices (12) are sintered together using silver-based sintering paste (68, 70, 72, 74) between the one or more electronic devices (12) and the lead frames (42, 60) and between the lead frames (42, 60) and the substrates (26, 34). The material and thicknesses of the substrates (26, 34) and lead frames (42, 60) are selected so that stresses experienced by the electronic devices (12) caused by changes in temperature of the assembly (10) are balanced from the centre of the assembly (10), thereby eliminating the need for balancing stresses at a substrate level by applying substantially matching metal layers to both sides of the substrates.

Abstract translation: 在形式包装的一个或多个电子设备（12）的组件（10）包括在所述组件（10）的相对侧基板（26，34），与所述电子设备之间的引线框架（42，60）（12） 与基板（26，34）。 在基板（26，34），引线框架（42，60）和电子设备（12），所述一个或多个电子设备之间烧结在一起使用基于银的烧结膏（68，70，72，74）（12）和 引线框架（42，60）和引线框架（42，60）和所述基板（26，34）之间。 在基板（26，34）和引线框架的材料和厚度（42，60）是从中心选择，以便没有应力经历由在组件（10）的温度变化所引起的电子设备（12）平衡 该组件（10），从而消除了通过施加基本上匹配的金属层于衬底的bothsides在一个水平基板平衡应力的需要。

公开(公告)号：EP2017889A2

公开(公告)日：2009-01-21

申请号：EP08157492.3

申请日：2008-06-03

Applicant: Delphi Technologies, Inc.

Inventor： Flederbach, Lynda G. ,  Weed, Rick A. ,  Carter, Bradley H. ,  Gerbsch, Erich W. ,  Isenberg, John, K. ,  Berlin, Carl W.

IPC: H01L23/498

CPC classification number: H01L23/49861 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electrically isolated and thermally conductive double-sided prepackaged integrated circuit component exhibiting excellent heat dissipative properties, durability and strength, and which can be manufactured at a low cost includes electrically insulated and thermally conductive substrate members having outer surfaces, ultra-thick thick film materials secured to the outer surfaces of the substrate members and a lead member and a transistor member positioned between the substrate members.

Abstract translation: 显示出优异的散热特性，耐久性和强度的电绝缘导热双面预包装集成电路部件，并且可以以低成本制造，包括具有外表面的电绝缘导热基板部件，超厚厚膜材料 固定到基板构件的外表面和引导构件以及定位在基板构件之间的晶体管构件。

公开(公告)号：EP1933415A1

公开(公告)日：2008-06-18

申请号：EP07121196.5

申请日：2007-11-21

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Nair, Deepukumar M. ,  Zimmermann, David W. ,  Sarma, Dwadasi H.R.

IPC: H01Q1/44 ,  H01Q15/00 ,  G01P15/00 ,  H01P1/203

CPC classification number: G01P15/00 ,  G01P15/08 ,  H01P1/2005 ,  H01P1/203 ,  H01Q1/44 ,  H01Q15/006

Abstract: A high-frequency Electromagnetic Bandgap (EBG) motion sensor device (70), and a method (100) for making such a device (70) are provided. The device (70) includes a substantially planar substrate (72) including multiple conducting vias (76) forming a periodic lattice in the substrate (72). The vias (76) extend from the lower surface of the substrate (72) to the upper surface of the substrate (72). The device (70) also includes a movable defect (83) positioned in the periodic lattice. The movable defect (83) is configured to move relative to the plurality of vias (76). A resonant frequency of the EBG motion sensor device (70) varies based on movement of the movable defect (83).

Abstract translation: 提供了高频电磁带隙（EBG）运动传感器装置（70）和用于制造这种装置（70）的方法（100）。 器件（70）包括基本上平面的衬底（72），其包括在衬底（72）中形成周期性晶格的多个导电通孔（76）。 通孔（76）从衬底（72）的下表面延伸到衬底（72）的上表面。 装置（70）还包括位于周期性晶格中的可动缺陷（83）。 可移动缺陷（83）构造成相对于多个通孔（76）移动。 EBG运动传感器装置（70）的共振频率根据可动缺陷（83）的移动而变化。

公开(公告)号：EP2645839B1

公开(公告)日：2018-09-12

申请号：EP13160107.2

申请日：2013-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

公开(公告)号：EP2034808A3

公开(公告)日：2011-04-06

申请号：EP08159937.5

申请日：2008-07-08

Applicant: Delphi Technologies, Inc.

Inventor： Djordjevic, Aleksandra ,  Berlin, Carl W.

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H05K1/092 ,  H05K1/167 ,  H05K3/1291 ,  H05K2201/0355 ,  H05K2203/1126 ,  H05K2203/171

Abstract: An embedded resistor and capacitor circuit and fabrication method is provided. The circuit includes a substrate, a conductive foil laminated to the substrate, and a thick film dielectric material disposed on the conductive foil. One or more thick film electrodes are formed on the dielectric material and a thick film resistor is formed at least partially contacting the thick film electrodes. A capacitor is formed by an electrode and the conductive foil. The electrodes serve as terminations for the resistor and capacitor.

公开(公告)号：EP2031692A1

公开(公告)日：2009-03-04

申请号：EP08169722.9

申请日：2007-03-13

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Nair, Deepukumar M. ,  Walsh, Matthew R.

IPC: H01P1/203

CPC classification number: H01P1/203 ,  H01P1/2005 ,  H05K1/0233 ,  H05K1/0236 ,  H05K3/4069 ,  H05K2201/0215 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2203/0557 ,  H05K2203/104 ,  H05K2203/171

Abstract: Tuned Electromagnetic Bandgap (EBG)devices (10, 30), and a method for making and tuning tuned EBG devices (10, 30) are provided. The method includes the steps of providing first and second overlapping substrates (32, 32a), placing magnetically alignable conductive material (36) between the substrates (32, 32a), and applying a magnetic field (44, 45) in the vicinity of the magnetically alignable conductive material (36) to align at least some of the material into conductive vias (46, 47). The method further includes the steps of physically altering via characteristics of EBG devices (10, 30) to tune the bandpass and resonant frequencies of the EBG devices (10, 30).