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    POLISHING APPARATUS AND POLISHING METHOD
    2.
    发明申请
    POLISHING APPARATUS AND POLISHING METHOD 审中-公开
    抛光设备和抛光方法

    公开(公告)号：WO2006022452A3

    公开(公告)日：2006-06-08

    申请号：PCT/JP2005016063

    申请日：2005-08-26

    Applicant: EBARA CORP ,  KODERA MASAKO ,  MOCHIZUKI YOSHIHIRO ,  FUKUDA AKIRA ,  KODERA AKIRA ,  HIYAMA HIROKUNI ,  TSUJIMURA MANABU ,  HIROKAWA KAZUTO ,  FUKUNAGA AKIRA

    Inventor： KODERA MASAKO ,  MOCHIZUKI YOSHIHIRO ,  FUKUDA AKIRA ,  KODERA AKIRA ,  HIYAMA HIROKUNI ,  TSUJIMURA MANABU ,  HIROKAWA KAZUTO ,  FUKUNAGA AKIRA

    IPC: B24B37/04 ,  B24B49/00 ,  H01L21/00

    CPC classification number: H01L21/6708 ,  B24B37/005 ,  B24B37/042 ,  B24B37/046 ,  B24B49/006 ,  B24B57/02

    Abstract: A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).

    Abstract translation: 研磨装置（30）具有研磨面（32），保持晶片（W）的顶圈（36），使研磨面（32）和晶片（W）相对移动的马达（46,56） 以相对速度彼此相对移动;以及垂直移动机构（54），用于在压力下将晶片（W）压靠在抛光表面（32）上。 抛光装置（30）还具有控制器（44），用于在抛光速率不与压制压力和相对速度的乘积成比例的非普雷斯顿范围内调节抛光条件。 抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液并且在晶片（W）的表面内实现均匀的抛光速率。

    SUBSTRATE POLISHING APPARATUS
    3.
    发明申请
    SUBSTRATE POLISHING APPARATUS 审中-公开
    基板抛光装置

    公开(公告)号：WO2004103636A2

    公开(公告)日：2004-12-02

    申请号：PCT/JP2004007152

    申请日：2004-05-19

    Applicant: EBARA CORP ,  SHIMADZU CORP ,  HIROKAWA KAZUTO ,  KOBAYASHI YOICHI ,  NAKAI SHUNSUKE ,  OHTA SHINROU ,  TSUKUDA YASUO

    Inventor： HIROKAWA KAZUTO ,  KOBAYASHI YOICHI ,  NAKAI SHUNSUKE ,  OHTA SHINROU ,  TSUKUDA YASUO

    IPC: B24B49/12 ,  B24D7/12 ,  H01L21/306 ,  B24B

    CPC classification number: B24B37/12 ,  B24B37/013 ,  B24B49/12 ,  H01L21/30625

    Abstract: A substrate polishing apparatus (10) polishes a substrate (20) to a flat mirror finish. The substrate polishing apparatus (10) has a polishing table (12) against which a substrate (20) is pressed, a light-emitting and light-receiving device (24) to emit measurement light from the polishing table (12) to the substrate (20) and to receive reflected light from the substrate (20) for measuring a film on the substrate (20), a fluid supply passage (42) for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber (68) provided at a light-emitting and light-receiving position of the polishing table (12), and a fluid supply control device (56, 58) for controlling supply of the measurement fluid to the fluid chamber (68).

    Abstract translation: 基板研磨装置（10）将基板（20）抛光成平面镜面。 基板研磨装置（10）具有：被加压基板（20）的研磨台（12），从研磨台（12）向基板发射测定光的发光和受光装置（24） （20）接收来自基板（20）的反射光，用于测量基板（20）上的薄膜;流体供给通道（42），用于将测量光和反射光通过的测量流体通过， 设置在所述研磨台（12）的发光和受光位置处的流体室（68）和用于控制向所述流体室（68）供给所述测量流体的流体供应控制装置（56,​​58） 。

    Polishing apparatus
    4.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US6413155B2

    公开(公告)日：2002-07-02

    申请号：US75817401

    申请日：2001-01-12

    Applicant: EBARA CORP

    Inventor： MATSUO HISANORI ,  HIYAMA HIROKUNI ,  WADA YUTAKA ,  HIROKAWA KAZUTO

    IPC: B24B37/30 ,  B24B1/00

    CPC classification number: B24B37/30

    Abstract: A polishing apparatus polishes a workpiece to a planar mirror finish stably, and is prevented from being vibrated while polishing is carried out.The polishing apparatus has a holding member for holding the workpiece, and a bearing supporting an outer circumferential surface of the holding member, for suppressing vibrations transmitted to the holder while the workpiece is being polished.

    Abstract translation: 抛光装置稳定地将工件抛光到平面镜面，并且在抛光时防止振动。抛光装置具有用于保持工件的保持构件和支撑保持构件的外周面的轴承， 用于抑制在抛光工件时传递到保持器的振动。

    5.
    发明专利
    未知

    公开(公告)号：DE60032423D1

    公开(公告)日：2007-02-01

    申请号：DE60032423

    申请日：2000-08-17

    Applicant: EBARA CORP

    Inventor： WADA YUTAKA ,  HIYAMA HIROKUNI ,  HIROKAWA KAZUTO ,  MATSUO HISANORI

    IPC: H01L21/304 ,  B24B53/007 ,  B24B53/017

    Abstract: A method is provided for polishing a device wafer (14), which has projections and depressions formed on a surface thereof, with the use of an abrading plate (12). The method comprises polishing the device wafer (14) while supplying a surface active agent and/or while dressing a surface of the abrading plate (12). This method for polishing the device wafer (14) can always exhibit a self-stop function, without being restricted by the composition of the abrading plate (12), and without being restricted by the type of the substrate.

    6.
    发明专利
    未知

    公开(公告)号：AT95349T

    公开(公告)日：1993-10-15

    申请号：AT90113790

    申请日：1990-07-18

    Applicant: EBARA CORP

    Inventor： KONNO DAISUKE ,  MIWA SACHIHIKO ,  AIYOSHIZAWA SHUNICHI ,  KASHIHARA KAZUYUKI ,  SATO YOSHIO ,  HIROKAWA KAZUTO

    IPC: H02K29/00 ,  F16C33/10 ,  F16C39/06 ,  G11B19/20 ,  H02K5/16 ,  H02K7/08 ,  H02K21/22

    Abstract: A spindle motor which is designed to rotate with minimal vibrations and hence is suitable of a hard disk driver. The spindle motor employs hydrodynamic bearings as radial and thrust bearings. A support shaft is formed in a cylindrical configuration with a center hole, and a rotor has a columnar portion which is inserted into the center hole in the support shaft. A thrust bearing collar is attached to the lower end of the rotor, and a thrust bearing member is secured to a base in opposing relation to the thrust bearing collar. A group of stator coils and a radial bearing member are disposed on either the inner peripheral surface of the center hole in the support shaft or the outer peripheral surface of the support shaft, and a group of rotor magnets and a radial bearing sleeve are disposed on either the outer peripheral surface of the columnar portion or the inner peripheral surface of the rotor in opposing relation to the stator coil group and the radial bearing member.

    ABRADING PLATE AND POLISHING METHOD USING THE SAME
    7.
    发明专利
    ABRADING PLATE AND POLISHING METHOD USING THE SAME 未知

    公开(公告)号：SG142143A1

    公开(公告)日：2008-05-28

    申请号：SG2004070959

    申请日：1999-04-28

    Applicant: EBARA CORP

    Inventor： WADA YUTAKA ,  HIYAMA HIROKUNI ,  HIROKAWA KAZUTO ,  MATSUO HISANORI

    IPC: B24B1/00 ,  B24B37/04 ,  B24B37/24 ,  B24B53/017 ,  B24D3/32 ,  H01L21/304 ,  H01H25/00 ,  H01H19/00

    Abstract: ABRADING PLATE AND POLISHING METHOD USING THE SAME The present invention provides an abrading plate having self-stopping capability such that when an object, such as a semiconductor wafer having a device structure that includes raised regions and depressed regions fabricated on the surface, is being polished, the raised regions are removed and polishing stops automatically. A method of using the abrading plate is also provided. The present invention relates to an abrading plate that produces a flat and mirror polished surface on an object with an abrading plate comprised by abrasive particles having a chemical purity of not less than 90 % and a particle size of not more than two micrometers; a binder material; and a given volume of porosity, wherein a ratio of the abrasive particles and the binder material is not less than 1:0.5 by volume, and proportions of abrasive particles, a binder material and porosity are, respectively, not less than 10 %, not more than 60 % and 10-40 by volume. The method is provided for polishing an object having a device structure that includes raised regions and depressed regions fabricated on the surface according to the steps of polishing the surface for a given duration with a liquid not containing abrasive particles so as to eliminate the raised regions to obtain a flat surface, and performing additional surface removal by supplying abrasive particles to the polishing interface to remove surface material uniformly from the entire surface.

    10.
    发明专利
    未知

    公开(公告)号：DE69003619D1

    公开(公告)日：1993-11-04

    申请号：DE69003619

    申请日：1990-07-18

    Applicant: EBARA CORP

    Inventor： KONNO DAISUKE ,  MIWA SACHIHIKO ,  AIYOSHIZAWA SHUNICHI ,  KASHIHARA KAZUYUKI ,  SATO YOSHIO ,  HIROKAWA KAZUTO

    IPC: H02K29/00 ,  F16C33/10 ,  F16C39/06 ,  G11B19/20 ,  H02K5/16 ,  H02K7/08 ,  H02K21/22

    Abstract: A spindle motor which is designed to rotate with minimal vibrations and hence is suitable of a hard disk driver. The spindle motor employs hydrodynamic bearings as radial and thrust bearings. A support shaft is formed in a cylindrical configuration with a center hole, and a rotor has a columnar portion which is inserted into the center hole in the support shaft. A thrust bearing collar is attached to the lower end of the rotor, and a thrust bearing member is secured to a base in opposing relation to the thrust bearing collar. A group of stator coils and a radial bearing member are disposed on either the inner peripheral surface of the center hole in the support shaft or the outer peripheral surface of the support shaft, and a group of rotor magnets and a radial bearing sleeve are disposed on either the outer peripheral surface of the columnar portion or the inner peripheral surface of the rotor in opposing relation to the stator coil group and the radial bearing member.

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