公开(公告)号：DE69301471T2

公开(公告)日：1996-09-19

申请号：DE69301471

申请日：1993-02-26

Applicant: EBARA CORP

Inventor： ISOBE SOICHI ,  KOMATA KIMIO ,  ISHII TOSHIAKI ,  KOMAI YUUICHI

IPC: G02B5/09 ,  G02B7/182 ,  G02B26/12 ,  G02B5/08

Abstract: A polygon mirror which is easy to machine and has fewer assembling steps and an extremely superior rotational performance. The polygon mirror comprises a rotor including a ceramic ring, a yoke and a mirror surface formation member. The yoke and the mirror surface formation member are secured to an outer periphery of the ceramic ring. A radial dynamic pressure bearing is defined by an inner periphery of the ceramic ring and an outer periphery of the fixing shaft. A thrust dynamic pressure bearing is defined by both end surfaces of the ceramic ring and confronting surfaces of a thrust plate fixedly secured to the stator so as to confront both end surfaces of the ceramic ring. The ceramic ring, the yoke and the mirror surface formation member are integrally molded from material making up the mirror surface formation member to form the rotor.

公开(公告)号：DE60140982D1

公开(公告)日：2010-02-25

申请号：DE60140982

申请日：2001-05-28

Applicant: EBARA CORP

Inventor： TORII HIROOMI ,  KOJIMA HIROSHI ,  OGURA SUGURU ,  ISOBE SOICHI

IPC: B24B37/07 ,  H01L21/304

Abstract: The present invention relates to a polishing method and apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A polishing liquid Q is supplied onto a polishing cloth 11 attached on a turntable 1, and a semiconductor wafer W to be polished is held by a top ring 2. The turntable 1 and the top ring 2 are rotated, respectively. A surface, to be polished, of the semiconductor wafer W held by the top ring 2 is pressed against the polishing cloth 11 on the turntable 1 to polish the semiconductor wafer W. When the polished semiconductor wafer W held by said top ring 2 is to be removed from the polishing cloth 11 on the turntable 1, a relative speed of the turntable 1 and the top ring 2 is increased in comparison with a relative speed of the turntable 1 and the top ring 2 at a period of polishing.

公开(公告)号：SG11202009373PA

公开(公告)日：2020-10-29

申请号：SG11202009373P

申请日：2020-03-04

Applicant: EBARA CORP

Inventor： YAMAGUCHI KUNIAKI ,  SHIMOMOTO HIROSHI ,  ISOBE SOICHI ,  MAEDA KOJI ,  SHINKAI KENJI ,  ISOKAWA HIDETATSU ,  YOSHINARI DAI ,  TAMURA MASAYUKI ,  HAIYANG XU ,  EHARA SHUN ,  ASANO KENTARO

IPC: B24B37/00 ,  B24B37/013 ,  B24B53/017 ,  H01L21/304

Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

公开(公告)号：SG10202011613YA

公开(公告)日：2021-01-28

申请号：SG10202011613Y

申请日：2017-06-20

Applicant: EBARA CORP

Inventor： AONO HIROSHI ,  YAMAGUCHI KUNIAKI ,  SHIMOMOTO HIROSHI ,  MAEDA KOJI ,  YASHIMA TETSUYA ,  SHINKAI KENJI ,  HASHIMOTO KOICHI ,  INABA MITSUHIKO ,  ISOKAWA HIDETATSU ,  NAKAO HIDETAKA ,  ISOBE SOICHI

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

公开(公告)号：SG10201705081PA

公开(公告)日：2018-01-30

申请号：SG10201705081P

申请日：2017-06-20

Applicant: EBARA CORP

Inventor： AONO HIROSHI ,  YAMAGUCHI KUNIAKI ,  SHIMOMOTO HIROSHI ,  MAEDA KOJI ,  YASHIMA TETSUYA ,  SHINKAI KENJI ,  HASHIMOTO KOICHI ,  INABA MITSUHIKO ,  ISOKAWA HIDETATSU ,  NAKAO HIDETAKA ,  ISOBE SOICHI

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

公开(公告)号：DE69301471D1

公开(公告)日：1996-03-21

申请号：DE69301471

申请日：1993-02-26

Applicant: EBARA CORP

Inventor： ISOBE SOICHI ,  KOMATA KIMIO ,  ISHII TOSHIAKI ,  KOMAI YUUICHI

IPC: G02B5/09 ,  G02B7/182 ,  G02B26/12 ,  G02B5/08

Abstract: A polygon mirror which is easy to machine and has fewer assembling steps and an extremely superior rotational performance. The polygon mirror comprises a rotor including a ceramic ring, a yoke and a mirror surface formation member. The yoke and the mirror surface formation member are secured to an outer periphery of the ceramic ring. A radial dynamic pressure bearing is defined by an inner periphery of the ceramic ring and an outer periphery of the fixing shaft. A thrust dynamic pressure bearing is defined by both end surfaces of the ceramic ring and confronting surfaces of a thrust plate fixedly secured to the stator so as to confront both end surfaces of the ceramic ring. The ceramic ring, the yoke and the mirror surface formation member are integrally molded from material making up the mirror surface formation member to form the rotor.

公开(公告)号：DE4434344A1

公开(公告)日：1995-04-20

申请号：DE4434344

申请日：1994-09-26

Applicant: EBARA CORP

Inventor： ISOBE SOICHI ,  SANO MASAAKI ,  INOUE YOSHIO ,  SHIMIZU KAZUO

IPC: G02B26/12 ,  G02B7/182

Abstract: A fastening structure for a polygonal mirror is provided for fastening a polygonal mirror on the outer circumference of a rotor. In detail, the following is provided: a mirror-seat surface is designed or shaped on the outer circumference part of the rotor for the seat of the polygonal mirror thereon; and a holding member has a particularly planar annular configuration and a multiplicity of radially extending claws on the outer circumference thereof, in order to hold the polygonal mirror on the mirror-seat surface, the claws having an arcuate or tapering cross-sectional configuration and pressing the polygonal mirror directly downwards and radially outwards in order thereby to permit the fastening of the polygonal mirror on the rotor without penetrating holes being provided for receiving screws in the polygonal mirror.

公开(公告)号：EP1988568A4

公开(公告)日：2011-10-26

申请号：EP07715034

申请日：2007-02-21

Applicant: EBARA CORP

Inventor： TAKAHASHI NOBUYUKI ,  NISHIDA HIROAKI ,  TORII HIROOMI ,  ISOBE SOICHI ,  SONE TADAKAZU ,  KOSUGE RYUICHI ,  KANEKO HIROYUKI ,  SOTOZAKI HIROSHI ,  MITSUKURA TAKAO ,  OGAWA TAKAHIRO ,  SUGITA KENICHI

IPC: H01L21/687 ,  B24B37/34 ,  H01L21/677

CPC classification number: H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

公开(公告)号：JP2010205796A

公开(公告)日：2010-09-16

申请号：JP2009047221

申请日：2009-02-27

Applicant: Ebara Corp ,  株式会社荏原製作所

Inventor： KOGURE NAOAKI ,  TSUJIMURA MANABU ,  ISOBE SOICHI ,  OIKAWA FUMITOSHI ,  SUGITA KENICHI ,  SONE CHUICHI ,  MINAMI YOSHIO

IPC: H01L21/304 ,  B24B37/04 ,  B24B55/06

Abstract: PROBLEM TO BE SOLVED: To reduce utility such as power or the like used in stopping operation. SOLUTION: A semiconductor wafer W is held between a polishing pad 16 and a top ring 18 attached to a rotary surface plate 17 of a CMP (Chemical and Mechanical Polishing) device 1 and is relatively rotated to polish the wafer W. A rinsing flow regulating valve 13 is provided in a rinsing supply pipe 11 to intermittently supply pure water to the polishing pad 16 in a polishing portion 2 to maintain it in a wet state. In a washing portion 3, the polished wafer W is pinched between washing sponge rollers 26, 27 and is washed while carrying it. Rinsing flow regulating valves 14, 14 are provided in rinsing supply pipes 12a, 12b to intermittently supply pure water to the washing sponge rollers 26, 27 to maintain them in a wet state. Assuming that an interval at which the pure water is supplied is t minutes and a duration for which the pure water is supplied each time is dt seconds, the following relations (1) and (2) are satisfied. (1) dt=20ä1.6-exp(-0.01783t)}, (2) 10≤t≤30. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了减少在停止操作中使用的诸如电源等的实用性。 解决方案：半导体晶片W被保持在抛光垫16和附接到CMP（化学和机械抛光）装置1的旋转表面板17上的顶环18之间，并被相对旋转以抛光晶片W. 冲洗流量调节阀13设置在冲洗供给管11中，以在抛光部2中间歇地向研磨垫16供给纯水，使其处于湿润状态。 在洗涤部分3中，抛光的晶片W被夹在洗涤海绵辊26和27之间，并在携带时清洗。 冲洗流量调节阀14,14设置在冲洗供给管12a，12b中，以间歇地向洗涤海绵辊26,27供给纯水，以将它们保持在湿润状态。 假设供给纯水的间隔为t分钟，每次供给纯水的持续时间为dt秒，满足以下关系式（1）和（2）。 （1）dt =20ä1.6-exp（-0.01783t）}，（2）10≤t≤30。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JPH07140412A

公开(公告)日：1995-06-02

申请号：JP23948494

申请日：1994-09-06

Applicant: EBARA CORP

Inventor： ISOBE SOICHI ,  SANO MASAAKI ,  INOUE YOSHIO ,  SHIMIZU KAZUO

IPC: G02B7/198 ,  G02B7/182 ,  G02B26/12 ,  G02B26/10

Abstract: PURPOSE:To provide a structure for mounting a polygon mirror which does not adversely affect wobbling of the surface of a motor and jitter characteristics, maintains balance without degradation with lapse of time, is easy to work and has excellent stability. CONSTITUTION:The polygon mirror 5 is placed on a mirror receiving seat surface 7c formed on the outer periphery of a sleeve 7 of a rotating body shrinkage fitted with the sleeve 7 to a ceramic spring 1 of the structure for mounting the polygon mirror 5 which fixes the polygon mirror 5 to the outer periphery of the rotating body. The polygon mirror 5 is simultaneously pressed and fixed directly downward and radial direction by pawls 3a of a plane annular detaining member 3 having the plural pawls 3a of a tapered or bow-shape in section on the outer periphery.