公开(公告)号：US20150183084A1

公开(公告)日：2015-07-02

申请号：US14583505

申请日：2014-12-26

Applicant: EBARA CORPORATION

Inventor： Ban ITO ,  Naoshi SAKUMA ,  Akihiro KAJITA ,  Tadashi SAKAI

IPC: B24B49/12 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/013 ,  H01L21/31053 ,  H01L21/3212 ,  H01L22/12 ,  H01L22/26 ,  H01L23/53276 ,  H01L2221/1094

Abstract: There is provided a polishing end point detection method of improving the accuracy of detecting a polishing end point. The polishing end point detection method emits light toward a polishing object including a hybrid film made of a nanocarbon material and a light-transmissive material while polishing the polishing object (Step S102). Then, the polishing end point detection method receives light reflected from the polishing object (Step S103). Then, the polishing end point detection method subjects the received reflected light to signal processing (Step S104). Then, the polishing end point detection method determines the polishing end point of the polishing object based on the result of the signal processing (Step S105), and detects the polishing end point (Step S106).

Abstract translation: 提供了一种提高抛光终点检测精度的抛光终点检测方法。 抛光终点检测方法在抛光抛光对象的同时向包括由纳米碳材料和透光材料制成的混合膜的抛光对象发光（步骤S102）。 然后，研磨终点检测方法接收从研磨对象反射的光（步骤S103）。 然后，抛光终点检测方法使接收到的反射光进行信号处理（步骤S104）。 然后，抛光终点检测方法基于信号处理的结果确定研磨对象的研磨终点，（步骤S105），并检测研磨终点（步骤S106）。