公开(公告)号：US20180294171A1

公开(公告)日：2018-10-11

申请号：US15944654

申请日：2018-04-03

Applicant: EBARA CORPORATION

Inventor： Daisuke MINOSHIMA ,  Masayoshi IMAI

IPC: H01L21/67 ,  B08B3/02

Abstract: Various examples regarding substrate cleaning apparatus and methods, and related apparatus and method are disclosed. According to one embodiment, provided is a substrate cleaning apparatus including: a substrate holding and rotating module; an elongated cleaning member configured to come into contact with the substrate while the substrate is held and rotated by the substrate holding and rotating module; and a first nozzle and a second nozzle, both of which are arranged on an identical side with respect to a longitudinal direction of the cleaning member, wherein the first nozzle is operably adjusted to supply liquid more forcefully than liquid from the second nozzle, and the first nozzle is arranged so that the liquid from the first nozzle is reached to a first area located closer to the first nozzle than the cleaning member in the substrate.