公开(公告)号：US20150140907A1

公开(公告)日：2015-05-21

申请号：US14520242

申请日：2014-10-21

Applicant: EBARA CORPORATION

Inventor： Hiromitsu WATANABE ,  Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Yutaka WADA

IPC: B24B57/00 ,  B24B37/04 ,  B24B37/34

CPC classification number: B24B57/00 ,  B24B37/04 ,  B24B37/34

Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.

Abstract translation: 公开了一种在将粗颗粒排放到抛光垫上的同时研磨衬底的抛光方法。 在该抛光方法中，将基板与抛光垫滑动接触，同时将已经通过过滤器的抛光液供给到抛光垫上。 抛光方法包括：使抛光液通过过滤器，同时增加抛光液的物理量，直到物理量达到预定设定值，物理量是抛光液的流量和压力之一; 并在抛光垫上抛光衬底W，同时将已经通过过滤器的抛光液供给到抛光垫上。

公开(公告)号：US20180169831A1

公开(公告)日：2018-06-21

申请号：US15898028

申请日：2018-02-15

Applicant: EBARA CORPORATION

Inventor： Hiromitsu WATANABE ,  Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Yutaka WADA

IPC: B24B57/00 ,  B24B37/04 ,  B24B37/34

CPC classification number: B24B57/00 ,  B24B37/04 ,  B24B37/34

Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.