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1.发明申请公开(公告)号：US20140120808A1
公开(公告)日：2014-05-01
申请号：US14150068
申请日：2014-01-08
Applicant: EBARA CORPORATION
Inventor： Akira FUKUDA , Yoshihiro MOCHIZUKI , Yutaka WADA , Yoichi SHIOKAWA , Hirokuni HIYAMA
IPC: B24B53/017
CPC classification number: B24B53/017
Abstract: A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
Abstract translation: 一种方法用抛光件与金刚石修整器连接，金刚石修整器具有布置在其表面上的金刚石颗粒。 该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布的模拟进行模拟，以及在确定的修整条件下用金刚石修整器修整抛光构件来确定修整条件。 模拟包括计算根据推入抛光构件的金刚石颗粒的深度校正的滑动距离。
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公开(公告)号：US20150140907A1
公开(公告)日：2015-05-21
申请号：US14520242
申请日：2014-10-21
Applicant: EBARA CORPORATION
Inventor： Hiromitsu WATANABE , Kuniaki YAMAGUCHI , Itsuki KOBATA , Yutaka WADA
Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.
Abstract translation: 公开了一种在将粗颗粒排放到抛光垫上的同时研磨衬底的抛光方法。 在该抛光方法中，将基板与抛光垫滑动接触，同时将已经通过过滤器的抛光液供给到抛光垫上。 抛光方法包括：使抛光液通过过滤器，同时增加抛光液的物理量，直到物理量达到预定设定值，物理量是抛光液的流量和压力之一; 并在抛光垫上抛光衬底W，同时将已经通过过滤器的抛光液供给到抛光垫上。
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公开(公告)号：US20180169831A1
公开(公告)日：2018-06-21
申请号：US15898028
申请日：2018-02-15
Applicant: EBARA CORPORATION
Inventor： Hiromitsu WATANABE , Kuniaki YAMAGUCHI , Itsuki KOBATA , Yutaka WADA
Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.
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