公开(公告)号：US20180308716A1

公开(公告)日：2018-10-25

申请号：US16019415

申请日：2018-06-26

Applicant: EBARA CORPORATION

Inventor： Takeshi SAKURAI ,  Eiji HIRAI ,  Kaoru HAMAURA ,  Mitsuru MIYAZAKI ,  Koji MARUYAMA

IPC: H01L21/67 ,  B08B1/00

CPC classification number: H01L21/67046 ,  B08B1/007 ,  H01L21/67051

Abstract: A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.

公开(公告)号：US20150004886A1

公开(公告)日：2015-01-01

申请号：US14321791

申请日：2014-07-01

Applicant: EBARA CORPORATION

Inventor： Kaoru HAMAURA ,  Takeshi SAKURAI ,  Suguru OGURA

IPC: B24B37/34 ,  B24B37/26 ,  B24B37/20

CPC classification number: B24B37/34 ,  B24B47/22 ,  Y10T29/49826

Abstract: When a polishing pad is attached to a polishing table, the polishing pad can be easily positioned on and attached to the polishing table and air pockets are prevented from forming. As a position guide member 130 is inserted into a guide hole 109 with an attachment surface of a polishing pad 108 downward, the polishing pad 108 is positioned on and attached to a polishing table 110. At this time, the guide hole 109 of the polishing pad 108 is guided by the position guide member 130 and the polishing pad 108 is easily positioned so as to match the upper surface of the polishing table 110 with the outer periphery thereof. Then, as release paper is gradually peeled off from a rear surface of the polishing pad 108, the portion where the release paper is peeled off is attached to the polishing table 110.

Abstract translation: 当抛光垫附着到抛光台上时，抛光垫可以容易地定位在抛光台上并附着到抛光台上，防止气泡成形。 由于位置导向件130被插入具有抛光垫108的附接表面的引导孔109中，抛光垫108被定位在抛光台110上并附着到抛光台110.此时，抛光的引导孔109 垫108由位置引导构件130引导，并且抛光垫108容易定位成使得抛光台110的上表面与其外周匹配。 然后，当剥离纸从抛光垫108的后表面逐渐剥离时，剥离纸的部分被附着到抛光台110上。