公开(公告)号：US20140287653A1

公开(公告)日：2014-09-25

申请号：US14187150

申请日：2014-02-21

Applicant: EBARA CORPORATION

Inventor： Takahiro SHIMANO ,  Mutsumi TANIKAWA ,  Hisanori MATSUO ,  Kuniaki YAMAGUCHI ,  Katsuhide WATANABE

IPC: B24B53/017 ,  B24B37/005

CPC classification number: B24B53/017 ,  B24B37/005

Abstract: The method includes the steps of measuring a surface height of a polishing member 10 at each of plural oscillation sections Z1 to Z5 which are defined in advance on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a current profile obtained from measured values of the surface height and a target profile of the polishing member 10; and correcting moving speeds of the dresser 5 in the plural oscillation sections Z1 to Z5 so as to eliminate the difference.

Abstract translation: 该方法包括以下步骤：沿着修整器5的摆动方向在研磨部件10上预先确定的多个振动部Z1〜Z5的每一个上测量研磨部件10的表面高度; 计算从抛光构件10的表面高度和目标轮廓的测量值获得的电流曲线之间的差; 并修正多个振荡部Z1〜Z5中的修整器5的移动速度，以消除差异。

公开(公告)号：US20160158911A1

公开(公告)日：2016-06-09

申请号：US15041284

申请日：2016-02-11

Applicant: EBARA CORPORATION

Inventor： Mutsumi TANIKAWA ,  Takahiro SHIMANO

IPC: B24B53/017

CPC classification number: B24B53/017 ,  B24B49/006 ,  B24B49/18 ,  B24B53/02

Abstract: A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.

Abstract translation: 调整抛光垫的表面的方法用于调理抛光台上的抛光垫，用于抛光形成在基板表面上的薄膜。 调理方法包括使修整器与抛光垫接触，并且通过在抛光垫的中心部分和抛光垫的外圆周部分之间移动修整器来调节抛光垫。 修磨器在抛光垫的预定区域的移动速度高于修整器在抛光垫的预定区域的标准移动速度。

公开(公告)号：US20140342642A1

公开(公告)日：2014-11-20

申请号：US14184655

申请日：2014-02-19

Applicant: EBARA CORPORATION

Inventor： Takahiro SHIMANO ,  Mutsumi TANIKAWA ,  Hisanori MATSUO ,  Kuniaki YAMAGUCHI ,  Katsuhide WATANABE

IPC: B24B53/00 ,  B24B53/017 ,  B24B53/02

CPC classification number: B24B53/005 ,  B24B53/017 ,  B24B53/02

Abstract: The method includes: calculating an increment of a sliding distance of a dresser by multiplying a relative speed between the dresser and a polishing member by a contact time between them; correcting the increment of the sliding distance by multiplying the calculated increment of the sliding distance by at least one correction coefficient; calculating the sliding distance by repeatedly adding the corrected increment of the sliding distance to the sliding distance according to elapse of time; and producing the sliding-distance distribution of the dresser from the obtained sliding distance and a position of a sliding-distance calculation point. The at least one correction coefficient includes an unevenness correction coefficient provided for the sliding-distance calculation point. The unevenness correction coefficient is a correction coefficient that allows a profile of the polishing member to reflect a difference between an amount of scraped material of the polishing member in its raised portion and an amount of scraped material of the polishing member in its recess portion.

Abstract translation: 该方法包括：通过将修整器和抛光构件之间的相对速度乘以它们之间的接触时间来计算修整器的滑动距离的增量; 通过将计算出的滑动距离的增加乘以至少一个校正系数来校正滑动距离的增量; 通过根据时间经过反复地将滑动距离的校正增量反复地添加到滑动距离来计算滑动距离; 并且从获得的滑动距离和滑动距离计算点的位置产生修整器的滑动距离分布。 所述至少一个校正系数包括为所述滑动距离计算点提供的不均匀性校正系数。 不均匀性校正系数是使研磨部件的轮廓反映研磨部件的凸起部分的刮削材料量与其凹部中研磨部件的刮削材料量之间的差异的校正系数。