公开(公告)号：US20180282892A1

公开(公告)日：2018-10-04

申请号：US15937353

申请日：2018-03-27

Applicant: EBARA CORPORATION

Inventor： Jumpei FUJIKATA ,  Masashi SHIMOYAMA ,  Ryu MIYAMOTO ,  Kentaro ISHIMOTO

IPC: C25D5/34 ,  H01L21/768 ,  C25D3/02 ,  C25D7/12 ,  C23C18/54

Abstract: A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.