公开(公告)号：US20250144675A1

公开(公告)日：2025-05-08

申请号：US19014595

申请日：2025-01-09

Applicant: Ebara Corporation

Inventor： Chikako TAKATOH ,  Akira FUKUNAGA ,  Masamitsu KURASHITA ,  Megumi UNO ,  Satomi HAMADA

IPC: B08B1/32 ,  B08B1/50 ,  B08B3/02 ,  B08B3/12 ,  H01L21/02 ,  H01L21/304

Abstract: There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member. The substrate cleaning apparatus also includes a controller which controls pressing force for the cleaning tool against the self-cleaning member such that self-cleaning torque, with which the rotation mechanism rotates the cleaning tool at the time of self-cleaning of the cleaning tool, is prescribed torque equal to or more than substrate cleaning torque, with which the rotation mechanism rotates the cleaning tool when the cleaning tool cleans the substrate.

公开(公告)号：US20160372344A1

公开(公告)日：2016-12-22

申请号：US15186352

申请日：2016-06-17

Applicant: EBARA CORPORATION

Inventor： Masayoshi IMAI ,  Satomi HAMADA

IPC: H01L21/67 ,  F26B5/12 ,  F26B21/14 ,  H01L21/677

CPC classification number: H01L21/67034 ,  F26B5/12 ,  F26B5/16 ,  F26B15/12 ,  F26B21/004 ,  F26B21/14 ,  F26B2200/12 ,  H01L21/67028 ,  H01L21/6776

Abstract: A wafer drying apparatus capable of preventing formation of a watermark is disclosed. The wafer drying apparatus includes: a conveying mechanism configured to convey a wafer in a drying chamber; an inert-gas jet nozzle disposed above the conveying mechanism and configured to form a descending jet of an inert gas; and a liquid suction nozzle disposed upstream of the inert-gas jet nozzle with respect to a conveying direction of the wafer. A distance between the liquid suction nozzle and a surface of the wafer when the wafer is being conveyed by the conveying mechanism is in a range of 1 mm to 2 mm.

Abstract translation: 公开了一种能够防止形成水印的晶片干燥装置。 晶片干燥装置包括：输送机构，其构造成在干燥室内输送晶片; 惰性气体喷嘴，设置在所述输送机构的上方并被构造成形成惰性气体的下降射流; 以及相对于晶片的输送方向设置在惰性气体喷嘴的上游的液体吸嘴。 当晶片被输送机构输送时，液体吸嘴与晶片表面之间的距离在1mm至2mm的范围内。

公开(公告)号：US20250144674A1

公开(公告)日：2025-05-08

申请号：US19014565

申请日：2025-01-09

Applicant: Ebara Corporation

Inventor： Chikako TAKATOH ,  Akira FUKUNAGA ,  Masamitsu KURASHITA ,  Megumi UNO ,  Satomi HAMADA

IPC: B08B1/32 ,  B08B1/50 ,  B08B3/02 ,  B08B3/12 ,  H01L21/02 ,  H01L21/304

Abstract: There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member. The substrate cleaning apparatus also includes a controller which controls pressing force for the cleaning tool against the self-cleaning member such that self-cleaning torque, with which the rotation mechanism rotates the cleaning tool at the time of self-cleaning of the cleaning tool, is prescribed torque equal to or more than substrate cleaning torque, with which the rotation mechanism rotates the cleaning tool when the cleaning tool cleans the substrate.

公开(公告)号：US20210039142A1

公开(公告)日：2021-02-11

申请号：US16979715

申请日：2019-02-18

Applicant: Ebara Corporation

Inventor： Chikako TAKATOH ,  Akira FUKUNAGA ,  Masamitsu KURASHITA ,  Megumi UNO ,  Satomi HAMADA

IPC: B08B1/04 ,  B08B1/00 ,  B08B3/02 ,  B08B3/12 ,  H01L21/304 ,  H01L21/02

Abstract: There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member. The substrate cleaning apparatus also includes a controller which controls pressing force for the cleaning tool against the self-cleaning member such that self-cleaning torque, with which the rotation mechanism rotates the cleaning tool at the time of self-cleaning of the cleaning tool, is prescribed torque equal to or more than substrate cleaning torque, with which the rotation mechanism rotates the cleaning tool when the cleaning tool cleans the substrate.

公开(公告)号：US20240351078A1

公开(公告)日：2024-10-24

申请号：US18683735

申请日：2022-08-19

Applicant: EBARA CORPORATION

Inventor： Naoyuki HANDA ,  Satomi HAMADA

IPC: B08B7/04 ,  B08B1/14 ,  B08B1/34 ,  B08B3/02 ,  B24B37/34

CPC classification number: B08B7/04 ,  B08B1/14 ,  B08B1/34 ,  B08B3/02 ,  B24B37/34

Abstract: A substrate cleaning apparatus that brings a cleaning tool into sliding contact with a substrate surface while rotating the substrate to perform scrub-cleaning includes a cleaning liquid supply unit that ejects cleaning liquid onto the surface of the substrate to perform a rinsing process of the substrate after scrub-cleaning, in which a temperature of the cleaning liquid in the rinsing process is set to 0° C. to 20° C. The cleaning liquid supply unit includes a first cleaning liquid supply unit that supplies the cleaning liquid toward the vicinity of the center of the substrate and a second cleaning liquid supply unit that supplies the cleaning liquid in a spray form toward a region between the center and an edge of the substrate, and a first ejection angle by the first cleaning liquid supply unit is smaller than a second ejection angle by the second cleaning liquid supply unit.

公开(公告)号：US20200281347A1

公开(公告)日：2020-09-10

申请号：US16648994

申请日：2018-09-20

Applicant: EBARA CORPORATION ,  Industry-University Cooperation Foundation Hanyang University Erica Campus

Inventor： Jin-Goo PARK ,  Jung Hwan LEE ,  Satomi HAMADA

IPC: A46B17/06 ,  A46D1/045 ,  A46D9/04 ,  B08B3/08 ,  B08B3/12

Abstract: A PVA brush cleaning method includes immersing a PVA brush in a cleaning solution containing an organic matter, thereby removing a siloxane compound in the PVA brush; and applying vibration to the PVA brush, thereby removing impurities in the PVA brush.