公开(公告)号：US20190301044A1

公开(公告)日：2019-10-03

申请号：US16359365

申请日：2019-03-20

Applicant: EBARA CORPORATION

Inventor： Hirotaka OHASHI ,  Takahiro ABE

IPC: C25D5/48

Abstract: There is provided a cleaning device capable of conveying a substrate even when having large warpage. A cleaning device configured to clean a substrate W1 includes a horizontal conveyance mechanism 56 configured to convey the substrate W1 to be subjected to cleaning processing. Furthermore, the cleaning device includes a pressurizing roller 70 provided at a position facing the horizontal conveyance mechanism 56 with the substrate W1 therebetween and configured to press the substrate W1 against the horizontal conveyance mechanism 56, and a roller moving mechanism 72 configured to move the pressurizing roller 70 toward the horizontal conveyance mechanism 56 to cause the pressurizing roller 70 to press the substrate W1 against the horizontal conveyance mechanism 56.