-
公开(公告)号：US20180282893A1
公开(公告)日：2018-10-04
申请号：US15933280
申请日：2018-03-22
Applicant: EBARA CORPORATION
Inventor： Gaku YAMASAKI , Hirotaka OHASHI
IPC: C25D17/06 , B25J5/02 , B25J11/00 , B25J9/16 , C25D21/12 , H01L21/677 , H01L21/687
CPC classification number: C25D17/06 , B25J5/02 , B25J9/023 , B25J9/1669 , B25J9/1676 , B25J9/1697 , B25J11/0095 , C23C18/163 , C25D17/001 , C25D21/12 , H01L21/67173 , H01L21/6723 , H01L21/67718 , H01L21/67733 , H01L21/67742 , H01L21/67751 , H01L21/68707 , H01L21/68764 , Y10S901/47 , Y10S901/49
Abstract: In assembly of a conventional plating apparatus, a position of a processing tank is adjusted so that the processing tank is disposed at an ideal position. This adjustment takes time and effort to assemble a plating apparatus, and assembly of the plating apparatus requires a high cost. The invention provides a substrate transporting apparatus provided with a substrate holder for holding a substrate, a holder griping mechanism that grips the substrate holder, a substrate transporting section that transports the substrate holder, a rotation mechanism that rotationally moves the holder griping mechanism around a vertical direction as an axis, and a linear motion mechanism that linearly moves the holder griping mechanism in a direction perpendicular to a plane defined by a transporting direction of the substrate holder by the substrate transporting section and a vertical direction.
-
公开(公告)号：US20190084777A1
公开(公告)日：2019-03-21
申请号：US16084948
申请日：2017-03-07
Applicant: EBARA CORPORATION
Inventor： Yoshitaka MUKAIYAMA , Toshio YOKOYAMA , Junitsu YAMAKAWA , Takuya TSUSHIMA , Tomonori HIRAO , Sho TAMURA , Hirotaka OHASHI
Abstract: To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.
-
公开(公告)号：US20250033164A1
公开(公告)日：2025-01-30
申请号：US18716865
申请日：2022-11-30
Applicant: EBARA CORPORATION
Inventor： Hirotaka OHASHI
Abstract: A substrate processing apparatus includes: a substrate holder (5) having a suction holding surface (5a) configured to hold a first surface (2a) of a substrate (W); a processing head (7) arranged to process an outer circumferential portion of the substrate (W); a hydrostatic plate (9) having a fluid support surface (9a) facing the suction holding surface (5a); and a fluid supply line (10) coupled to the hydrostatic plate (9) and configured to supply fluid to a space between the fluid support surface (9a) and a second surface (2b) of the substrate (W). The second surface (2b) is an opposite side of the substrate (W) from the first surface (2a). The fluid support surface (9a) is larger than the suction holding surface (5a).
-
公开(公告)号：US20190301044A1
公开(公告)日：2019-10-03
申请号：US16359365
申请日：2019-03-20
Applicant: EBARA CORPORATION
Inventor： Hirotaka OHASHI , Takahiro ABE
IPC: C25D5/48
Abstract: There is provided a cleaning device capable of conveying a substrate even when having large warpage. A cleaning device configured to clean a substrate W1 includes a horizontal conveyance mechanism 56 configured to convey the substrate W1 to be subjected to cleaning processing. Furthermore, the cleaning device includes a pressurizing roller 70 provided at a position facing the horizontal conveyance mechanism 56 with the substrate W1 therebetween and configured to press the substrate W1 against the horizontal conveyance mechanism 56, and a roller moving mechanism 72 configured to move the pressurizing roller 70 toward the horizontal conveyance mechanism 56 to cause the pressurizing roller 70 to press the substrate W1 against the horizontal conveyance mechanism 56.
-
-
-
Search Results
4
records
(took 0.023 seconds)
