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公开(公告)号：US20170159203A1
公开(公告)日：2017-06-08
申请号：US15437157
申请日：2017-02-20
Applicant: EBARA CORPORATION
Inventor： Yoshio MINAMI , Jumpei FUJIKATA , Takashi KISHI
CPC classification number: C25D17/06 , C25D17/001 , C25D17/004 , C25D21/12
Abstract: A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.
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公开(公告)号：US20190226114A1
公开(公告)日：2019-07-25
申请号：US16373456
申请日：2019-04-02
Applicant: EBARA CORPORATION
Inventor： Jumpei FUJIKATA , Masashi SHIMOYAMA , Yoichi NAKAGAWA , Yoshitaka MUKAIYAMA , Yoshio MINAMI
Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.
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公开(公告)号：US20130255360A1
公开(公告)日：2013-10-03
申请号：US13849178
申请日：2013-03-22
Applicant: EBARA CORPORATION
Inventor： Yoshio MINAMI , Jumpei FUJIKATA , Takashi KISHI
IPC: C25D17/00
CPC classification number: C25D17/06 , C25D17/001 , C25D17/004 , C25D21/12
Abstract: A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.
Abstract translation: 一种电镀方法，包括：在使基板保持器的基板与基板的周边部分压力接触的同时保持基板，同时在所述基板支架内形成封闭的内部空间; 通过在内部空间中产生真空并检查内部空间中的压力是否在一定时间内达到预定的真空压力来进行基板保持器的第一级泄漏测试; 并且如果衬底保持器已经通过了第一级泄漏测试，则通过在其中产生真空之后关闭内部空间来进行衬底保持器的第二级泄漏测试，并且检查内部空间中的压力变化是否达到 一定时间内的预定值。
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公开(公告)号：US20190249325A1
公开(公告)日：2019-08-15
申请号：US16391638
申请日：2019-04-23
Applicant: EBARA CORPORATION
Inventor： Yoshio MINAMI , Jumpei FUJIKATA , Takashi KISHI
CPC classification number: C25D17/06 , C25D17/001 , C25D17/004 , C25D21/12 , G01M3/26
Abstract: A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.
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公开(公告)号：US20160222540A1
公开(公告)日：2016-08-04
申请号：US15096972
申请日：2016-04-12
Applicant: EBARA CORPORATION
Inventor： Yoshio MINAMI , Jumpei FUJIKATA , Takashi KISHI
IPC: C25D17/06
CPC classification number: C25D17/06 , C25D17/001 , C25D17/004 , C25D21/12
Abstract: A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.
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Patent Agency Ranking
公开(公告)号：US20160145760A1
公开(公告)日：2016-05-26
申请号：US14919002
申请日：2015-10-21
Applicant: EBARA CORPORATION
Inventor： Jumpei FUJIKATA , Masashi SHIMOYAMA , Yoichi NAKAGAWA , Yoshitaka MUKAIYAMA , Yoshio MINAMI
CPC classification number: C25D17/008 , C25D5/022 , C25D17/001 , C25D17/06 , C25D17/10
Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.
Abstract translation: 根据本公开的电镀设备包括：阳极保持器，其构造成保持阳极; 衬底保持器，与所述阳极保持器相对放置并且构造成保持衬底; 以及阳极掩模，其安装在所述阳极保持器的前表面上并且设置有适于允许在阳极和所述基板之间流动的电流通过的第一开口。 阳极掩模中的第一开口的直径被配置为可调节的。 当第一衬底被镀覆时，将第一开口的直径调节到第一直径。 当第二基板被镀覆时，将第一开口的直径调节到小于第一直径的第二直径。
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公开(公告)号：US20140314957A1
公开(公告)日：2014-10-23
申请号：US14257929
申请日：2014-04-21
Applicant: EBARA CORPORATION
Inventor： Yoshio MINAMI , Masaaki KIMURA
CPC classification number: B05C3/02 , B05C3/04 , B05C21/00 , B08B3/047 , C25D17/001 , C25D17/004 , C25D17/06 , C25D21/08
Abstract: A substrate plating apparatus is disclosed. The apparatus includes a substrate holder; a plating bath configured to plate a surface of the substrate in a plating solution; a cleaning bath configured to clean the substrate holder and the substrate with a cleaning liquid; an inner shell disposed in the cleaning bath and configured to house the substrate holder holding the substrate therein; and a cleaning liquid supply conduit configured to supply a cleaning liquid into the inner shell to clean the substrate, together with the substrate holder, with the cleaning liquid. The inner shell has an inner surface having an uneven configuration that follows an uneven exterior configuration of the substrate holder holding the substrate.
Abstract translation: 公开了一种基板电镀装置。 该装置包括：基板支架; 电镀液，其被配置为在电镀溶液中对所述基板的表面进行平板化; 清洗浴，其配置成用清洁液清洁所述基板保持件和所述基板; 内壳，设置在所述清洗槽中并且构造成容纳将所述基板保持在其中的所述基板保持架; 以及清洁液供给管道，其构造成将清洗液体供应到所述内壳体中，以与所述基板保持器一起清洁所述基板与所述清洁液体。 内壳具有内表面，该内表面具有跟随保持基板的基板保持器的不均匀外部构造的不均匀构造。
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公开(公告)号：US20170287762A1
公开(公告)日：2017-10-05
申请号：US15630130
申请日：2017-06-22
Applicant: EBARA CORPORATION
Inventor： Yoshio MINAMI
IPC: H01L21/677 , C25D17/06 , C25D17/00
CPC classification number: H01L21/67775 , C25D17/00 , C25D17/001 , C25D17/06
Abstract: A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.
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公开(公告)号：US20170287761A1
公开(公告)日：2017-10-05
申请号：US15630119
申请日：2017-06-22
Applicant: EBARA CORPORATION
Inventor： Yoshio MINAMI
IPC: H01L21/677 , C25D17/06 , C25D17/00
CPC classification number: H01L21/67775 , C25D17/00 , C25D17/001 , C25D17/06
Abstract: A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.
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公开(公告)号：US20170175285A1
公开(公告)日：2017-06-22
申请号：US15450873
申请日：2017-03-06
Applicant: EBARA CORPORATION
Inventor： Yoshio MINAMI , Ryuya KOIZUMI
CPC classification number: C25D17/001 , C23C18/1628 , C23C18/163 , C23C18/1632 , C23C18/1675 , C25D17/06 , C25D21/12 , H01L21/6723 , H01L21/67751 , H01L21/68721 , H01L24/743 , H01L24/83 , H01L2924/0002 , H01L2924/00
Abstract: A plating apparatus is described. The apparatus includes: a substrate holder configured to hold a substrate in a vertical position; at least one processing bath configured to process the substrate held by the substrate holder; a transporter configured to grip and horizontally transport the substrate holder; at least one lifter configured to receive the substrate holder from the transporter, lower the substrate holder to place the substrate holder in the processing bath, elevate the substrate holder from the processing bath after processing of the substrate, and transfer the substrate holder to the transporter; and a controller configured to control operations of the transporter and the lifter.
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