公开(公告)号：US20220395874A1

公开(公告)日：2022-12-15

申请号：US17839382

申请日：2022-06-13

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Daichi KONDO ,  Yu IMAMURA

IPC: B08B13/00 ,  B08B3/02 ,  B24B29/02

Abstract: According to one embodiment of the present disclosure, provided is a substrate cleaning device including: a substrate holder configured to hold a substrate; a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle; a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle; a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member; and a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid.

公开(公告)号：US20250001472A1

公开(公告)日：2025-01-02

申请号：US18883743

申请日：2024-09-12

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Daichi KONDO ,  Yu IMAMURA

IPC: B08B13/00 ,  B08B3/02 ,  B24B29/02

Abstract: According to one embodiment of the present disclosure, provided is a substrate cleaning device including: a substrate holder configured to hold a substrate; a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle; a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle; a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member, and a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid.