公开(公告)号：US20250001472A1

公开(公告)日：2025-01-02

申请号：US18883743

申请日：2024-09-12

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Daichi KONDO ,  Yu IMAMURA

IPC: B08B13/00 ,  B08B3/02 ,  B24B29/02

Abstract: According to one embodiment of the present disclosure, provided is a substrate cleaning device including: a substrate holder configured to hold a substrate; a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle; a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle; a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member, and a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid.

公开(公告)号：US20240321601A1

公开(公告)日：2024-09-26

申请号：US18611156

申请日：2024-03-20

Applicant: EBARA CORPORATION

Inventor： Fumitoshi OIKAWA ,  Koichi FUKAYA ,  Hiroki TAKAHASHI ,  Akira IMAMURA

IPC: H01L21/67 ,  B08B1/34 ,  B08B3/02 ,  B08B3/04 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B1/34 ,  B08B3/022 ,  B08B3/041 ,  H01L21/02057 ,  H01L21/67034

Abstract: A cleaning apparatus includes: a rotation support section that supports and rotates a substrate; a chemical liquid supply section that supplies a chemical liquid other than an organic solvent to a surface of the substrate; an organic solvent supply section that supplies an organic solvent to a surface of the substrate; and cleaning means that cleans a surface of the substrate supported by the rotation support section using a chemical liquid from the chemical liquid supply section, and then cleans a surface of the substrate using an organic solvent from the organic solvent supply section with the substrate being kept supported by the rotation support section.

公开(公告)号：US20230321696A1

公开(公告)日：2023-10-12

申请号：US18128892

申请日：2023-03-30

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Ban ITO ,  Seungho YUN ,  Kohei SATO

IPC: B08B3/10 ,  B08B1/00 ,  B08B3/02 ,  B08B5/02 ,  B24B57/02

CPC classification number: B08B3/10 ,  B08B1/002 ,  B08B3/02 ,  B08B5/02 ,  B24B57/02 ,  B08B2205/00 ,  B08B2203/00

Abstract: A substrate processing system capable of supplying a processing liquid containing fine bubbles at a high concentration without generating large sized bubbles in a middle of a supply line of the processing liquid is disclosed. There is provided a substrate processing system comprising: a gas dissolved water generation tank; a chemical liquid dilution module; and a substrate processing module. The substrate processing module comprises a processing liquid supply nozzle configured to supply the processing liquid onto a substrate. The processing liquid supply nozzle has a decompression release portion configured to generate fine bubbles of a gas from a diluted chemical liquid. The processing liquid supply nozzle is configured to supply the diluted chemical liquid containing fine bubbles in a process scrubbing the substrate.

公开(公告)号：US20220395874A1

公开(公告)日：2022-12-15

申请号：US17839382

申请日：2022-06-13

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Daichi KONDO ,  Yu IMAMURA

IPC: B08B13/00 ,  B08B3/02 ,  B24B29/02

Abstract: According to one embodiment of the present disclosure, provided is a substrate cleaning device including: a substrate holder configured to hold a substrate; a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle; a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle; a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member; and a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid.

公开(公告)号：US20240308018A1

公开(公告)日：2024-09-19

申请号：US18570406

申请日：2022-05-24

Applicant: EBARA CORPORATION

Inventor： Yuta SUZUKI ,  Hiroki TAKAHASHI ,  Akira NAKAMURA ,  Katsuhide WATANABE ,  Hisanori MATSUO ,  Takahito KAGOSHIMA

IPC: B24B37/005 ,  H01L21/67

CPC classification number: B24B37/005 ,  H01L21/67253 ,  H01L21/67288

Abstract: Included are: at least one sensor that detects a physical quantity of an object during polishing and/or during cleaning and/or during drying of a substrate; a conversion section that converts a sensor value during polishing and/or during cleaning and/or during drying detected by the sensor into a feature amount for each processing step with respect to a trained machine learning model; and an inference section that outputs at least one predicted value of a number of defects, a size of a defect, and a position of a defect in a target substrate by inputting target data including the feature amount to the trained machine learning model.

公开(公告)号：US20230207339A1

公开(公告)日：2023-06-29

申请号：US18087619

申请日：2022-12-22

Applicant: EBARA CORPORATION

Inventor： Kohei SATO ,  Hiroki TAKAHASHI

IPC: H01L21/67 ,  B08B3/02 ,  B08B13/00 ,  B05C11/10 ,  B05C5/02

CPC classification number: H01L21/67051 ,  B05C5/0225 ,  B05C11/1007 ,  B08B3/02 ,  B08B13/00 ,  H01L21/67248

Abstract: A substrate processing apparatus includes: a first module used in a substrate processing process; a second module used in a substrate processing process after the first module; a nozzle provided in the second module and configured to supply a target treatment liquid; a temperature detector that detects a temperature of a treatment liquid inside the nozzle or a temperature of the nozzle; a substrate detection sensor that detects a position of a substrate; and a controller that controls discharge of the target treatment liquid from the nozzle performed before the substrate is conveyed to the second module according to the temperature of the treatment liquid detected by the temperature detector and the position of the substrate.

公开(公告)号：US20230023260A1

公开(公告)日：2023-01-26

申请号：US17783069

申请日：2020-11-25

Applicant: EBARA CORPORATION

Inventor： Hiroki TAKAHASHI ,  Kohei SATO ,  Koichi FUKAYA

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67 ,  B08B3/02 ,  B08B3/14 ,  B08B1/00 ,  B08B1/02 ,  B08B13/00

Abstract: The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).