公开(公告)号：US20170144267A1

公开(公告)日：2017-05-25

申请号：US15402703

申请日：2017-01-10

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Shintaro ISONO

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion, The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.

公开(公告)号：US20180117730A1

公开(公告)日：2018-05-03

申请号：US15790733

申请日：2017-10-23

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Makoto FUKUSHIMA ,  Keisuke NAMIKI ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Masahiko KISHIMOTO ,  Tomoko OWADA

IPC: B24B37/30

CPC classification number: B24B37/30 ,  B24B37/32

Abstract: A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

公开(公告)号：US20170173756A1

公开(公告)日：2017-06-22

申请号：US15378761

申请日：2016-12-14

Applicant: EBARA CORPORATION

Inventor： Satoru YAMAKI ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI ,  Shintaro ISONO

IPC: B24B37/005 ,  B24B37/20

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: A polishing object is prevented from slipping out without depending on the process type or the polishing condition. A polishing apparatus for polishing a surface to be polished of an polishing object by sliding the surface to be polished and a polishing member relative to each other, including: a pressing unit that presses a back surface of the surface to be polished of the polishing object such that the surface to be polished is pressed against the polishing member; a retainer member that is arranged on an outer side of the pressing unit and presses the polishing member; a storage unit that stores information concerning a condition for preventing the polishing object from slipping out, the condition being defined by use of information concerning a pressing force of the retainer member; and a control unit that acquires information concerning a force of friction between the surface to be polished of the polishing object and the polishing member or information concerning the pressing force of the retainer member, and executes control for adapting to the condition for preventing the slipping-out by using the acquired information concerning the force of friction or the acquired information concerning the pressing force of the retainer member.

公开(公告)号：US20230065029A1

公开(公告)日：2023-03-02

申请号：US17895925

申请日：2022-08-25

Applicant: EBARA CORPORATION

Inventor： Osamu NABEYA ,  Shingo TOGASHI

IPC: B24B37/26 ,  B24B37/04 ,  B24B37/24 ,  B29C35/02 ,  B29C43/02

Abstract: An elastic membrane having a physical property required for each portion of the elastic membrane and capable of uniformly polishing a workpiece is disclosed. The elastic membrane includes: a contact portion having a workpiece pressing surface for pressing a workpiece against a polishing surface; and a partition wall extending upward from the contact portion and forming a pressure chamber. The contact portion and at least a part of the partition wall are composed of a first rubber structure and a second rubber structure which are integrally formed, the first rubber structure has a first hardness, and the second rubber structure has a second hardness lower than the first hardness, the first rubber structure includes the workpiece pressing surface, and the second rubber structure includes the at least a part of the partition wall.

公开(公告)号：US20170266779A1

公开(公告)日：2017-09-21

申请号：US15458513

申请日：2017-03-14

Applicant: EBARA CORPORATION

Inventor： Shintaro ISONO ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/04 ,  B24B37/32 ,  B24B37/20

CPC classification number: B24B37/042 ,  B24B37/20 ,  B24B37/32

Abstract: According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.

公开(公告)号：US20160176011A1

公开(公告)日：2016-06-23

申请号：US15058710

申请日：2016-03-02

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Tetsuji TOGAWA ,  Shingo TOGASHI ,  Tomoshi INOUE

IPC: B24B37/20

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/32 ,  B24B49/10 ,  B24B49/12

Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

Abstract translation: 抛光方法用于将半导体晶片等基板研磨成平面镜面。 通过研磨装置研磨基板的方法包括具有研磨面的研磨台（100），用于保持基板并将基板压靠在研磨面上的顶环（1），以及可升降机构 沿垂直方向移动顶环（1）。 在将衬底压靠在抛光表面之前，将顶环（1）移动到第一高度，然后在衬底被压靠在抛光表面上之后将顶环（1）移动到第二高度。

公开(公告)号：US20250100107A1

公开(公告)日：2025-03-27

申请号：US18885188

申请日：2024-09-13

Applicant: EBARA CORPORATION

Inventor： Yuichi KATO ,  Shingo TOGASHI

IPC: B24B41/06 ,  B24B37/10

Abstract: An elastic membrane that can improve elasticity is disclosed. The elastic membrane has a pressing portion and a partition wall having a bulging structure.

公开(公告)号：US20140065934A1

公开(公告)日：2014-03-06

申请号：US14011626

申请日：2013-08-27

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Osamu NABEYA ,  Shingo TOGASHI

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane is used in a substrate holding apparatus for holding a substrate such as a semiconductor wafer and pressing the substrate against a polishing surface. The elastic membrane includes a plurality of concentrically circumferential walls configured to define a plurality of pressurizing areas for pressing the substrate. The pressurizing areas includes a central pressurizing area located at a central part of the elastic membrane, an annular edge pressurizing area located at the outermost part of the elastic membrane, and a plurality of intermediate pressurizing areas located between the central pressurizing area and the annular edge pressurizing area. The area width of at least one of the intermediate pressurizing areas is set in a range to allow a polishing rate responsive width not to vary even when the area width is varied.

Abstract translation: 在用于保持诸如半导体晶片的基板并将基板压靠在抛光表面上的基板保持装置中使用弹性膜。 弹性膜包括多个同心圆周壁，其被配置为限定用于按压基板的多个加压区域。 加压区域包括位于弹性膜的中央部的中央加压区域，位于弹性膜的最外部的环状边缘加压区域和位于中央加压区域与环状边缘之间的多个中间加压区域 加压区域。 至少一个中间加压区域的面积宽度被设定在允许抛光速率响应宽度即使当面积宽度变化时也不变化的范围内。

公开(公告)号：US20130324012A1

公开(公告)日：2013-12-05

申请号：US13905763

申请日：2013-05-30

Applicant: Ebara Corporation

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/005 ,  B24B7/22 ,  B24B37/04 ,  B24B37/07 ,  B24B37/32

CPC classification number: B24B37/005 ,  B24B7/228 ,  B24B37/042 ,  B24B37/07 ,  B24B37/32 ,  B24B49/16

Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.

Abstract translation: 抛光装置通过使基板与抛光表面滑动接触来抛光基板。 抛光装置包括：基板保持器，其具有被配置为将基板压靠在抛光表面上的基板保持表面;保持环，其联接到基板保持表面并且构造成围绕基板，其中保持环与抛光接触 所述保持环被构造成可以独立于所述基板保持表面倾斜; 旋转机构，其构造成使所述衬底保持器围绕其自身的轴线旋转; 以及至少一个局部负载施加机构，其被构造成沿与所述抛光表面垂直的方向在所述保持环的一部分上施加局部负载，所述至少一个局部负载施加机构被布置成不依照所述衬底移动 持有人

公开(公告)号：US20240399526A1

公开(公告)日：2024-12-05

申请号：US18670447

申请日：2024-05-21

Applicant: EBARA CORPORATION

Inventor： Yuichi KATO ,  Itsuki KOBATA ,  Nobuyuki TAKADA ,  Shingo TOGASHI ,  Hiroaki NISHIDA

IPC: B24B37/005 ,  B24B37/11

Abstract: A polishing head capable of accurately controlling a thickness profile of a wafer is disclosed. The polishing head includes a plurality of pressure actuators, an actuator operation controller, an actuator support portion, and an clastic holder. The actuator operation controller is mounted on a head main body.