公开(公告)号：WO2022026230A2

公开(公告)日：2022-02-03

申请号：PCT/US2021/042153

申请日：2021-07-19

Applicant: ELBIT SYSTEMS OF AMERICA, LLC

Inventor： CHILCOTT, Dan ,  SMITH, Arlynn, W. ,  HAMMOND, John, B.

IPC: H01J19/24 ,  H01J19/42 ,  H01J31/50 ,  H01J43/08 ,  H01J1/34 ,  H01J9/12 ,  B81B7/02 ,  H01J2229/4824 ,  H01J2231/50063 ,  H01J29/04 ,  H01J29/085 ,  H01J31/26

Abstract: An apparatus, system and method is provided for producing stacked wafers containing an array of image intensifiers that can be evacuated on a wafer scale. The wafer scale fabrication techniques, including bonding, evacuation, and compression sealing concurrently forms a plurality of EBCMOS imager anodes with design elements that enable high voltage operation with optional enhancement of additional gain via TMSE amplification. The TMSE amplification is preferably one or more multiplication semiconductor wafers of an array of EBD die placed between a photocathode within a photocathode wafer and an imager anode that is preferably an EBCMOS imager anode bonded to or integrated within an interconnect die within an interconnect wafer.

公开(公告)号：EP4189719A2

公开(公告)日：2023-06-07

申请号：EP21849111.6

申请日：2021-07-19

Applicant: Elbit Systems of America, LLC

Inventor： CHILCOTT, Dan ,  SMITH, Arlynn, W. ,  HAMMOND, John, B.

IPC: H01J19/24 ,  H01J19/42 ,  H01J31/50 ,  H01J43/08 ,  H01J1/34 ,  H01J9/12 ,  B81B7/02