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公开(公告)号：EP0161805A1
公开(公告)日：1985-11-21
申请号：EP85302569.0
申请日：1985-04-12
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Lane, George , Martin, Frank Wayne , St. John, Frank
CPC classification number: H05K1/095 , C08K3/08 , H01B1/22 , H01B1/24 , H01C7/005 , H05K1/0293 , H05K3/242 , H05K2203/162 , H05K2203/175
Abstract: The invention concerns a composition which may be used to form a temporary conductor or resistor, for example, by screen printing onto selected parts of an electrical circuit and peeled off when desired. The composition comprises vinylic resin, wax, solvent, and conductive and/or semiconductive particles.
Abstract translation: 本发明涉及可用于形成临时导体或电阻器的组合物，例如通过丝网印刷到电路的选定部分上并在需要时剥离。 该组合物包括乙烯树脂，蜡，溶剂以及导电和/或半导电颗粒。
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2.发明公开A method of forming a solderable, electrically conductive film on a substrate and the conductive composition itself 失效一种用于在衬底和导电材料上产生可焊接的导电膜的方法。
公开(公告)号：EP0143531A1
公开(公告)日：1985-06-05
申请号：EP84306618.4
申请日：1984-09-28
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , St. John, Frank
Abstract: A solderable electrically conductive film is formed on a substrate by forming a film-forming composition comprising polyimide, solvent therefor and dispersed metallic nickel particles. This composition is applied to the substrate, dried and cured to leave the film which comprises nickel particles dispersed in polyimide.
Abstract translation: 可焊接的导电膜是通过形成成膜组合物，其包括聚酰亚胺，溶剂为此形成于基材和分散的金属镍粒子。 该组合物被施加到基板，干燥并固化以离开其包含分散在聚酰亚胺化镍颗粒的膜。
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3.发明授权Solderable conductive compositions, methods for their preparation, and substrates coated with them 失效可焊接的导电组合物，其制备方法和与其贴合的基材
公开(公告)号：EP0162698B1
公开(公告)日：1990-04-25
申请号：EP85303563.2
申请日：1985-05-21
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： St. John, Frank , Martin, Frank Wayne
CPC classification number: H05K1/095 , C08K9/04 , C09D5/24 , H01B1/22 , Y10T428/24802 , Y10T428/24917
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4.发明公开Resistors, methods of forming said resistors, and articles comprising said resistors 失效电阻器，制备这些电阻器以及包含的项目这些电阻的方法。
公开(公告)号：EP0143660A2
公开(公告)日：1985-06-05
申请号：EP84308273.6
申请日：1984-11-29
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson
CPC classification number: H01C17/0652 , H01C17/06586
Abstract: This invention concerns resistor compositions, methods of forming such resistor compositions, and articles comprising a substrate carrying such resistor compositions.
The resistor compositions of the invention comprise carbon particles embedded in a matrix formed from short chain-length phenolic resin, long chain-length phenolic resin, epoxy and, optionally filler.
The resistor compositions of the invention can be formed by mixing short chain-length phenolic resin, long chain-length phenolic resin, solvent, and, if present, filler with carbon particles to form a solution which is then mixed with the epoxy to form an ink. The ink is applied to a substrate to form a film thereon which is cured to evaporate solvent and to allow polymerization to occur thereby leaving the resistor composition on the substrate.Abstract translation: 本发明涉及电阻组合物中，形成寻求电阻组合物和制品包括承载寻求电阻组合物中的底物的方法。 本发明的电阻器组合物包含嵌入在短链长度的酚醛树脂，长链长度的酚醛树脂，环氧树脂，和任选填料形成的基体的碳粒子。 本发明的电阻器组合物可通过短链长的酚醛树脂，长链长度的酚醛树脂，溶剂混合而形成，并且，如果存在的话，与碳粒子填料以形成溶液全部，然后将其与环氧树脂以形成混合 墨。 油墨被施加到基底以形成在其上的所有这些被固化以蒸发溶剂，并允许聚合到好发从而留下基板上的电阻体组成物的膜。
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5.发明公开Resistors, methods of forming said resistors, and articles comprising said resistors 失效电阻器，形成电阻器的方法和包含电阻器的文章
公开(公告)号：EP0143660A3
公开(公告)日：1986-01-29
申请号：EP84308273
申请日：1984-11-29
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson
CPC classification number: H01C17/0652 , H01C17/06586
Abstract: This invention concerns resistor compositions, methods of forming such resistor compositions, and articles comprising a substrate carrying such resistor compositions. The resistor compositions of the invention comprise carbon particles embedded in a matrix formed from short chain-length phenolic resin, long chain-length phenolic resin, epoxy and, optionally filler. The resistor compositions of the invention can be formed by mixing short chain-length phenolic resin, long chain-length phenolic resin, solvent, and, if present, filler with carbon particles to form a solution which is then mixed with the epoxy to form an ink. The ink is applied to a substrate to form a film thereon which is cured to evaporate solvent and to allow polymerization to occur thereby leaving the resistor composition on the substrate.
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Patent Agency Ranking6.发明公开Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates 失效柔性的，可焊接的直接，导电组合物，适用于形成它们和它们作为在衬底上的涂层的组合物。
公开(公告)号：EP0169059A2
公开(公告)日：1986-01-22
申请号：EP85305081.3
申请日：1985-07-17
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson
IPC: H01B1/22
CPC classification number: H05K1/095 , C08K3/08 , H01B1/22 , Y10S428/901 , C08L27/06
Abstract: This invention provides solderable, flexible, conductive compositions which may be bonded directly to substrates. The conductive compositions comprise silver, substantially in the form of flake, and resin system, said resin system comprising vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardener. Also provided are methods of preparing compositions useful in forming conductive compositions. Once cured, the conductive compositions may demonstrate good adhesion directly to a substrate in addition to excellent conductivity, solderability and felxibility characteristics.
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7.发明公开
公开(公告)号：EP0143530A1
公开(公告)日：1985-06-05
申请号：EP84306616.8
申请日：1984-09-28
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson , Schoonejongen, Ronald James
Abstract: A solderable electrically conductive composition comprises metallic silver particles embedded in a matrix formed from acrylic, carboxylated vinyl and epoxy resins and can be formed by dissolving acrylic powder and vinyl powder in respective solvents to form a first solution and a second solution, mixing these solutions with metallic silver particles and an epoxy to form an ink which is applied to a substrate to form a film thereon. The film is heated to evaporate the solvents, and preferably to allow polymerization to occur, thereby leaving the solderable electrically conductive film on the substrate.
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8.发明授权Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates 失效柔性，直接导电导电组合物，组分可用于形成它们及其作为基材上的涂料
公开(公告)号：EP0169059B1
公开(公告)日：1988-08-31
申请号：EP85305081.3
申请日：1985-07-17
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson
IPC: H01B1/22
CPC classification number: H05K1/095 , C08K3/08 , H01B1/22 , Y10S428/901 , C08L27/06
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9.发明公开
公开(公告)号：EP0170468A1
公开(公告)日：1986-02-05
申请号：EP85305083.9
申请日：1985-07-17
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson
CPC classification number: H01C7/005 , H01C17/0652 , H01C17/06586
Abstract: This invention is concerned with resistor compositions, methods of making them and articles comprising them. The resistor compositions comprise solid long chain phenolic resin, liquid short chain phenolic resin and, dispersed therein, a mixture comprising carbon black and graphite particles. The resistor compositions are capable of withstanding high humidity conditions without significant changes in resistivity and are capable of low ohmic values without the need to use metals.
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10.发明公开A method of forming a solderable, electrically conductive film on a substrate and the conductive composition itself 失效一种用于制造可钎焊，导电性薄膜和导电性材料的方法。
公开(公告)号：EP0140585A1
公开(公告)日：1985-05-08
申请号：EP84306617.6
申请日：1984-09-28
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson , Schoonejongen, Ronald James
CPC classification number: H01B1/22 , H05K1/095 , Y10S428/901 , Y10T428/12014
Abstract: © A solderable electrically conductive composition comprising metallic silver particles embedded in a matrix of carboxylated vinyl and epoxy may be made by forming an ink comprising a mixture of a solution of vinyl in a solvent, metallic silver particles and the epoxy. The ink is applied to a substrate to form a film which is heated to evaporate the solvent and preferably to allow polymerization to occur thereby leaving the solderable electrically conductive film on the substrate.
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