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1.发明公开
公开(公告)号：EP0143530A1
公开(公告)日：1985-06-05
申请号：EP84306616.8
申请日：1984-09-28
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson , Schoonejongen, Ronald James
Abstract: A solderable electrically conductive composition comprises metallic silver particles embedded in a matrix formed from acrylic, carboxylated vinyl and epoxy resins and can be formed by dissolving acrylic powder and vinyl powder in respective solvents to form a first solution and a second solution, mixing these solutions with metallic silver particles and an epoxy to form an ink which is applied to a substrate to form a film thereon. The film is heated to evaporate the solvents, and preferably to allow polymerization to occur, thereby leaving the solderable electrically conductive film on the substrate.
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2.发明公开A method of forming a solderable, electrically conductive film on a substrate and the conductive composition itself 失效一种用于制造可钎焊，导电性薄膜和导电性材料的方法。
公开(公告)号：EP0140585A1
公开(公告)日：1985-05-08
申请号：EP84306617.6
申请日：1984-09-28
Applicant: ELECTRO MATERIALS CORP. OF AMERICA
Inventor： Martin, Frank Wayne , Shahbazi, Samson , Schoonejongen, Ronald James
CPC classification number: H01B1/22 , H05K1/095 , Y10S428/901 , Y10T428/12014
Abstract: © A solderable electrically conductive composition comprising metallic silver particles embedded in a matrix of carboxylated vinyl and epoxy may be made by forming an ink comprising a mixture of a solution of vinyl in a solvent, metallic silver particles and the epoxy. The ink is applied to a substrate to form a film which is heated to evaporate the solvent and preferably to allow polymerization to occur thereby leaving the solderable electrically conductive film on the substrate.
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