Abstract:
A semiconductor storage device (100) having a burst mode capability for accomplishing a rapid pipeline operation is disclosed. A signal delay device (104), such as a first-in-first-out buffer (FIFO), is disposed between the data read circuitry of a memory cell array (102) and an output buffer (106). The signal delay device (104) is composed of a plurality of storage circuits (206-0 and 206-1) connected in parallel. Data values are input to selected of the storage circuits (206-0 and 206-1) by input control signals (DSEL0-DSEL1) and output from selected of the storage circuits (206-0 and 206-1) by output control signals (OSEL0-OSEL1). The DSEL0-DSEL1 and OSEL0-OSEL1 signals are generated in response to count signals (OCNT0-OCNT1).
Abstract:
A semiconductor storage device (100) having a burst mode capability for accomplishing a rapid pipeline operation is disclosed. A signal delay device (104), such as a first-in-first-out buffer (FIFO), is disposed between the data read circuitry of a memory cell array (102) and an output buffer (106). The signal delay device (104) is composed of a plurality of storage circuits (206-0 and 206-1) connected in parallel. Data values are input to selected of the storage circuits (206-0 and 206-1) by input control signals (DSEL0-DSEL1) and output from selected of the storage circuits (206-0 and 206-1) by output control signals (OSEL0-OSEL1). The DSEL0-DSEL1 and OSEL0-OSEL1 signals are generated in response to count signals (OCNT0-OCNT1).
Abstract:
A semiconductor memory device (10) having a peripheral ground line (GND) receiving charge when discharging a sub-word line (SWL) is provided. The semiconductor memory device (10) can include a row decoder (XDEC1), RA driver (RAD11), and sub-decoder blocks (SB). Row decoder (XDEC1) may activate a main word line (MWL) based on a received address value. RA driver (RAD11) may activate a sub-decoder block (SB) from a group of sub-decoder blocks coupled to the activated main word line (MWL). RA driver (RAD11) may provide a current path (4) to peripheral ground (GND) when the sub-word line (SWL) transitions from the activated state to the unactivated state. Non-selected sub-word lines may have a current path (1, 2, or 3) to a word line ground (GNDXDEC) for holding the other word lines at a "quiet" ground potential. Noise produced from discharging a sub-word line may not affect non-selected word lines.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device that autonomously resets a test mode instead of resetting the test mode dependently on the common standard of the semiconductor.SOLUTION: A semiconductor device comprises: a first test unit that enables a test of an internal circuit; a second test unit that can control the operation state of the first test unit; and a test reset unit that is activated in response to releasing the reset state of the first test unit and generates a reset signal after a predetermined period has passed since the activation of the first test unit. The second test unit sets the first test unit to a reset state when receiving the reset signal generated by the test reset unit.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device for initializing using a test mode the output of a level adjustment circuit erroneously set up when the power supply is turned on, and adjusting the output of the level adjustment circuit at a high speed to a regular setting value that is a target level.SOLUTION: The semiconductor device comprises: a plurality of latch circuits 2 for holding test data inputted from the outside in a test mode; a decode circuit 3 for inputting the test data held by the latch circuits 2 to generate a code by a combination of logic of the test data; a transition detection circuit 7 for outputting gate drive signals UPDN_B , UPDN_T , and UPDN_T which are at an H level or an L level during a preset period when the logic level of the test data held by the latch circuits 2 changes to drive a current supply circuit (a reducing circuit 8, a raising circuit 9).
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device in which malfunction in a signal-using circuit can be prevented without increasing the man-hour of layout. SOLUTION: A test mode decode & latch circuit 101 decodes an input signal based on a latch signal TMRS to generate a TEST1 signal. A TEST1 signal line 103 has a high resistance interconnect portion 103a and a low resistance interconnect portion 103b. A latch circuit 105 for latching the TEST1 signal outputted from the test mode decode & latch circuit 101 based on the latch signal TMRS is inserted into the low resistance interconnect portion. The latch circuit 105 brings a switching buffer 151 into inactive state at such a timing as the TEST1 signal does not change. Consequently, even if the potentials at the high resistance interconnect portion 103a and the low resistance interconnect portion 103b vary due to impact of transition noise from an adjacent interconnection, that variation has no effect on the output from the latch circuit 105. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device in which information on defective memory elements in a redundancy area can be used in later test processes, so as to prevent an increase in screening costs which is caused when a test for the redundancy area is required in the later test processes because information indicating that there is a defective redundant memory element cannot be stored when the defective redundant memory element is found to exist in the redundancy area.SOLUTION: A semiconductor device comprises: memory elements that store data; a defective memory element that is one of the memory elements and determined to be defective; a redundant memory element with which replacement can be done; and a first nonvolatile storage element that stores, when the redundant memory element is determined to be defective, information on the address of the defective redundant memory element.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of detecting defects of a column selection line. SOLUTION: A semiconductor device includes: a comparison circuit 111 that compares a plurality of pieces of read data B10 to B13 which are simultaneously read through data wirings DL10 to DL13 with expected values A0 to A3 and generates comparison results C10 to C13; an AND gate 120 that activates a determination signal S1 in response to a fact that at least one of the comparison results C10 to C13 shows a disagreement; and an OR gate 130 that activates a determination signal S2 in response to a fact that all of the comparison results C10 to C13 show disagreements. With this arrangement, when a test for detecting a bad address is performed in a wafer state, a defect of a column selection line can be detected. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To reduce an increase in current consumption during a stress test. SOLUTION: A semiconductor memory device includes: a local IO line LIO and a main IO line MIO to be used for input and output of data to and from a memory cell, with one end connected to each other; a circuit block VBLPBF which applies a voltage having a VDL level to the other end of the local IO line LIO in a first test mode; and a circuit block WAMP which applies a voltage having a VDD level to the other end of the main IO line MIO in a second test mode. The semiconductor memory device includes a circuit block BLEQCT which outputs a control signal BLEQ' having different voltage levels depending on the first and second test modes, and a transfer gate which limits the value of a current flowing through the local IO line LIO and the main IO line MIO, in the first and second test mode, based on the control signal BLEQ'. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor memory which can activate the cell array according to the refresh mode without increasing the number of wirings and circuit area. SOLUTION: The circuit of the oscillator 102 is constituted so that its oscillation cycle can be adjusted by the CODEi output from the ROM circuit 103 and the cycle is set to p times a tRAS period in self refreshing. The n bit counter 106 counts up based on the output of the oscillator 102. The programmable decoder 107 issues a reset signal to the n bit counter at a cycle q times the oscillator cycle based on the count of the n bit counter 106 and the CODEj the ROM circuit 104 outputs. Each time the programmable decoder 107 outputs a reset signal, this memory controls the SRACT at an H level for the period 1/p times the OSC0 cycle to activate the RASB signal. COPYRIGHT: (C)2008,JPO&INPIT