PROCESS AND DEVICE FOR JOINING BY PUNCHING AND RIVETING
    1.
    发明申请
    PROCESS AND DEVICE FOR JOINING BY PUNCHING AND RIVETING 审中-公开
    方法和设备用于生产冲压铆钉

    公开(公告)号:WO9926743A3

    公开(公告)日:1999-07-22

    申请号:PCT/EP9807621

    申请日:1998-11-26

    Abstract: A process and device are disclosed for joining by punching and riveting. At least two layers (4, 5) are pressed by a holding-down clamp (1) against the die-plate (3). For joining the layers (4, 5), a rivet, in particular a semitubular rivet (8), is pressed through at least the layer (4) facing the semitubular rivet (8) by a riveting die (2), is deformed in the lower layer(s) (5), forming a closure head, and is then upset. The holding-down clamp is connected to the riveting die (2) by a coupling unit (6) in such a way that during punching and riveting coupling between the holding-down clamp (1) and the riveting die (2) can be altered between a substantially rigid coupling state and an uncoupled state.

    Abstract translation: 本发明涉及一种方法和用于制造,其中至少两个层(4,5)由一个压紧装置(1)被压在阴模(3)和一个铆钉穿孔铆钉连接,尤其是半中空铆钉的装置(8), 对于(5 4,)由(2)至少对应于半中空铆钉(8)表面片材(4)被切断,或以较低的层(5)变形以形成一个封闭头并且此后压缩冲头的装置中的层中的连接。 坯料夹持器经由耦合单元(6)与所述标记(2)连接,以使得可以基本上刚性的联接状态和非耦合状态之间的冲铆操作期间压紧装置(1)的耦合与冲头而变化(2)。

    4.
    发明专利
    未知

    公开(公告)号:DE59803377D1

    公开(公告)日:2002-04-18

    申请号:DE59803377

    申请日:1998-11-26

    Applicant: EMHART INC

    Abstract: A method as well as an apparatus manufactures a punch riveted joint, wherein at least two layers are pressed by a holding-down device against the die and a rivet, in particular a semitubular rivet, is provided for joining the layers. The holding-down device is connected by a coupling unit to the punch in such a way that during a punch riveting operation a coupling of the holding-down device to the punch may be varied between a substantially rigid coupling state and an uncoupled state.

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