公开(公告)号：US09538665B2

公开(公告)日：2017-01-03

申请号：US14350971

申请日：2012-10-10

Applicant: ENTHONE INC.

Inventor： Edwin W. Bastenbeck ,  Harald Orschel ,  Ulrich Prinz

IPC: B05D5/12 ,  H05K3/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  B05D3/00

CPC classification number: H05K3/182 ,  B05D3/005 ,  B05D5/12 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/166 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  H05K3/185 ,  H05K2201/0236

Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.

Abstract translation: 所公开的本发明涉及水激活剂溶液和用于在激光直接结构化的衬底表面上无电沉积铜的方法。 通过本发明，提出了含有强还原剂的水活化剂溶液，以提高LDS基材的照射表面积的催化活性。

公开(公告)号：US20140255600A1

公开(公告)日：2014-09-11

申请号：US14350971

申请日：2012-10-10

Applicant: ENTHONE INC.

Inventor： Edwin W. Bastenbeck ,  Harald Orschel ,  Ulrich Prinz

IPC: H05K3/18

CPC classification number: H05K3/182 ,  B05D3/005 ,  B05D5/12 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/166 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  H05K3/185 ,  H05K2201/0236

Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.

Abstract translation: 所公开的本发明涉及水激活剂溶液和用于在激光直接结构化的衬底表面上无电沉积铜的方法。 通过本发明，提出了含有强还原剂的水活化剂溶液，以提高LDS基材的照射表面积的催化活性。

公开(公告)号：US09752074B2

公开(公告)日：2017-09-05

申请号：US14702020

申请日：2015-05-01

Applicant: Enthone Inc.

Inventor： Mark Peter Schildmann ,  Ulrich Prinz ,  Christoph Werner

IPC: C03C15/00 ,  C03C25/68 ,  H01L21/302 ,  H01L21/461 ,  H01L21/311 ,  C09K13/00 ,  C09K13/04 ,  B44C1/22 ,  C08J7/14 ,  C23C18/24

CPC classification number: C09K13/04 ,  B44C1/227 ,  C08J7/14 ,  C08J2355/02 ,  C23C18/24

Abstract: A pickling solution for the surface pre-treatment of plastic surfaces in preparation for metallization, the solution comprising a source of Mn(VII) ions; and an inorganic acid; wherein the pickling solution is substantially free of chromium (VI) ions, alkali ions, and alkaline-earth ions.

公开(公告)号：US20160024381A1

公开(公告)日：2016-01-28

申请号：US14702020

申请日：2015-05-01

Applicant: Enthone Inc.

Inventor： Mark Peter Schildmann ,  Ulrich Prinz ,  Christoph Werner

IPC: C09K13/04

CPC classification number: C09K13/04 ,  B44C1/227 ,  C08J7/14 ,  C08J2355/02 ,  C23C18/24

Abstract: A pickling solution for the surface pre-treatment of plastic surfaces in preparation for metallization, the solution comprising a source of Mn(VII) ions; and an inorganic acid; wherein the pickling solution is substantially free of chromium (VI) ions, alkali ions, and alkaline-earth ions.

Abstract translation: 用于表面预处理塑料表面以用于金属化的酸洗溶液，该溶液包含Mn（VII）离子源; 和无机酸; 其中所述酸洗溶液基本上不含铬（VI）离子，碱离子和碱土离子。