公开(公告)号：US20180044813A1

公开(公告)日：2018-02-15

申请号：US15551052

申请日：2016-02-23

Applicant: MACDERMID ENTHONE, INC.

Inventor： Frank Noffke ,  Andreas Konigshofen ,  Axel Fuhrmann ,  Christoph Werner

IPC: C25D21/11 ,  C09K15/26 ,  C08J7/06 ,  C25D5/56 ,  C25D5/34 ,  C23C18/38 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  C09K15/30 ,  C25D17/08

CPC classification number: C25D21/11 ,  C08J7/02 ,  C08J7/06 ,  C08J7/065 ,  C09K15/26 ,  C09K15/30 ,  C23C18/1625 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C25D5/34 ,  C25D5/56 ,  C25D17/08

Abstract: The invention relates to an aqueous inhibition composition for the inhibition of electrochemical metal plating on polymer surfaces, said inhibition composition comprising an inhibition agent selected from the group of compounds having at least one sulfur and at least one nitrogen atom as well as to a method for the inhibition of an insulated surface of a rack area. The inventive inhibition composition is capable to provide a solution for prohibiting unintended metallization on insulated areas of the racks when non-chromic etching is utilized for plating on plastics processes.

公开(公告)号：US09752074B2

公开(公告)日：2017-09-05

申请号：US14702020

申请日：2015-05-01

Applicant: Enthone Inc.

Inventor： Mark Peter Schildmann ,  Ulrich Prinz ,  Christoph Werner

IPC: C03C15/00 ,  C03C25/68 ,  H01L21/302 ,  H01L21/461 ,  H01L21/311 ,  C09K13/00 ,  C09K13/04 ,  B44C1/22 ,  C08J7/14 ,  C23C18/24

CPC classification number: C09K13/04 ,  B44C1/227 ,  C08J7/14 ,  C08J2355/02 ,  C23C18/24

Abstract: A pickling solution for the surface pre-treatment of plastic surfaces in preparation for metallization, the solution comprising a source of Mn(VII) ions; and an inorganic acid; wherein the pickling solution is substantially free of chromium (VI) ions, alkali ions, and alkaline-earth ions.

公开(公告)号：US09249513B2

公开(公告)日：2016-02-02

申请号：US14630268

申请日：2015-02-24

Applicant: ENTHONE INC.

Inventor： Franz-Josef Stark ,  Christoph Werner

IPC: C23C18/34 ,  C23C18/36 ,  C23C18/40 ,  C23C18/44 ,  C23C18/50 ,  C07C229/08 ,  C07C229/12 ,  C07C229/16 ,  C07C229/22 ,  C07C237/06 ,  C07C309/14 ,  C23C18/16 ,  C23C18/31 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/48

CPC classification number: C23C18/44 ,  C07C229/08 ,  C07C229/12 ,  C07C229/16 ,  C07C229/22 ,  C07C237/06 ,  C07C309/14 ,  C23C18/1601 ,  C23C18/31 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/38 ,  C23C18/40 ,  C23C18/42 ,  C23C18/48 ,  C23C18/50

Abstract: A plating formulation for the electroless deposition of a metal layer on a substrate, wherein a β-amino acid and/or β-amino acid derivative is used as a stabilizer. The β-amino acid is present within a range of 1 mg/L to 2 g/L. Typically, the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between −2 and +5. The inventive plating formulation can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid.

Abstract translation: 用于在基底上无电沉积金属层的电镀配方，其中使用“ - 氨基酸和/或” - 氨基酸衍生物作为稳定剂。 β-氨基酸存在于1mg / L至2g / L的范围内。 通常，电解质不含重金属稳定剂，氰化物，硒化合物和包含-2和+5之间氧化态的硫的硫化合物。 本发明的电镀制剂可以包含3-氨基丙酸，3-氨基丁酸，3-氨基-4-甲基戊酸和2-氨基乙磺酸。

公开(公告)号：US20160024381A1

公开(公告)日：2016-01-28

申请号：US14702020

申请日：2015-05-01

Applicant: Enthone Inc.

Inventor： Mark Peter Schildmann ,  Ulrich Prinz ,  Christoph Werner

IPC: C09K13/04

CPC classification number: C09K13/04 ,  B44C1/227 ,  C08J7/14 ,  C08J2355/02 ,  C23C18/24

Abstract: A pickling solution for the surface pre-treatment of plastic surfaces in preparation for metallization, the solution comprising a source of Mn(VII) ions; and an inorganic acid; wherein the pickling solution is substantially free of chromium (VI) ions, alkali ions, and alkaline-earth ions.

Abstract translation: 用于表面预处理塑料表面以用于金属化的酸洗溶液，该溶液包含Mn（VII）离子源; 和无机酸; 其中所述酸洗溶液基本上不含铬（VI）离子，碱离子和碱土离子。

公开(公告)号：US20150167175A1

公开(公告)日：2015-06-18

申请号：US14630268

申请日：2015-02-24

Applicant: ENTHONE INC.

Inventor： Franz-Josef Stark ,  Christoph Werner

IPC: C23C18/44 ,  C23C18/40 ,  C23C18/34

CPC classification number: C23C18/44 ,  C07C229/08 ,  C07C229/12 ,  C07C229/16 ,  C07C229/22 ,  C07C237/06 ,  C07C309/14 ,  C23C18/1601 ,  C23C18/31 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/38 ,  C23C18/40 ,  C23C18/42 ,  C23C18/48 ,  C23C18/50

Abstract: A plating formulation for the electroless deposition of a metal layer on a substrate, wherein a β-amino acid and/or β-amino acid derivative is used as a stabilizer. The β-amino acid is present within a range of 1 mg/L to 2 g/L. Typically, the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between −2 and +5. The inventive plating formulation can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid.

Abstract translation: 用于在基底上无电沉积金属层的电镀配方，其中使用“ - 氨基酸和/或” - 氨基酸衍生物作为稳定剂。 β-氨基酸存在于1mg / L至2g / L的范围内。 通常，电解质不含重金属稳定剂，氰化物，硒化合物和包含-2和+5之间氧化态的硫的硫化合物。 本发明的电镀制剂可以包含3-氨基丙酸，3-氨基丁酸，3-氨基-4-甲基戊酸和2-氨基乙磺酸。