CARD DE-BOWING MECHANISM
    2.
    发明申请
    CARD DE-BOWING MECHANISM 有权
    卡片去除机制

    公开(公告)号:US20160279857A1

    公开(公告)日:2016-09-29

    申请号:US15172402

    申请日:2016-06-03

    Abstract: A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.

    Abstract translation: 描述了衬底去弓形机构,系统和方法。 该机构可以包括衬底支撑件,一个或多个固定接触构件以及一个或多个动态或可动接触构件,其适于接触衬底并在期望的方向上弯曲衬底以减少或消除衬底的弯曲。 该机构由CPU或其他控制器控制,该控制器可以基于可以是动态和/或静态设置的输入设置来调节去弓形机构的去弓参数。 该机制可用于去除各种基材,包括塑料卡,护照和护照页。

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