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公开(公告)号：US10699509B2
公开(公告)日：2020-06-30
申请号：US15616184
申请日：2017-06-07
Applicant: ENTRUST DATACARD CORPORATION
Abstract: A card mechanism used in an array with other card mechanisms. Each card mechanism handles plastic cards that are to be personalized and provided to end users. The plastic cards can be cards such as financial cards including credit and debit cards, identification cards, driver's licenses, and other plastic cards that are personalized. The card mechanism(s) can supply cards to be personalized in one or more other card mechanisms and/or in a card personalization machine used with the card mechanism(s) in which case the card mechanism(s) is configured as a card input hopper, collect cards that have been personalized in which case the card mechanism is configured as a card output hopper, and/or perform one or more personalization operations on the cards in which case the card mechanism is configured as a card personalization mechanism.
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公开(公告)号：US09751253B2
公开(公告)日：2017-09-05
申请号：US15172402
申请日：2016-06-03
Applicant: ENTRUST DATACARD CORPORATION
CPC classification number: B29C53/18 , B29L2017/006 , B32B37/0015 , B32B37/14 , B32B38/145 , B32B2037/0061 , B32B2425/00 , B65H29/70 , B65H2301/512565 , B65H2701/1914 , Y10T156/1002
Abstract: A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.
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公开(公告)号：US20160279857A1
公开(公告)日：2016-09-29
申请号：US15172402
申请日：2016-06-03
Applicant: ENTRUST DATACARD CORPORATION
CPC classification number: B29C53/18 , B29L2017/006 , B32B37/0015 , B32B37/14 , B32B38/145 , B32B2037/0061 , B32B2425/00 , B65H29/70 , B65H2301/512565 , B65H2701/1914 , Y10T156/1002
Abstract: A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.
Abstract translation: 描述了衬底去弓形机构，系统和方法。 该机构可以包括衬底支撑件，一个或多个固定接触构件以及一个或多个动态或可动接触构件，其适于接触衬底并在期望的方向上弯曲衬底以减少或消除衬底的弯曲。 该机构由CPU或其他控制器控制，该控制器可以基于可以是动态和/或静态设置的输入设置来调节去弓形机构的去弓参数。 该机制可用于去除各种基材，包括塑料卡，护照和护照页。
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