LOW CAPACITY MULTILAYER VARISTOR
    1.
    发明申请
    LOW CAPACITY MULTILAYER VARISTOR 审中-公开
    多层压敏电阻低容量

    公开(公告)号:WO0103148A3

    公开(公告)日:2001-07-19

    申请号:PCT/DE0002204

    申请日:2000-07-06

    CPC classification number: H01C7/18 H01C7/105

    Abstract: The invention relates to a low capacity multilayer varistor that consists of a ceramic body (1) and two connections (2, 3) that are applied on the ceramic body (1) at a distance to each other. Said ceramic body (1) is configured as a multilayer structure produced by film techniques and preferably comprises internal electrodes (4, 5) whose ends face each other with a gap (d).

    Abstract translation: 本发明涉及一种多层变阻器低容量的陶瓷体(1)和两个连接(2,3),其以一定距离施加彼此在陶瓷体(1)。 所述陶瓷体(1)在膜技术被构造成具有多层结构,并且优选地具有内部电极(4,5),其端部彼此相对的与间隙(d)。

    5.
    发明专利
    未知

    公开(公告)号:DE102008033392A1

    公开(公告)日:2010-01-21

    申请号:DE102008033392

    申请日:2008-07-16

    Applicant: EPCOS AG

    Abstract: A method for increasing the ESD pulse stability of an electrical component is disclosed. An electrical component is pre-aged by means of an aging pulse generated by a pulse generator. The degradation of an electrical characteristic curve of the component by ESD pulses that occur during operation of the electrical component is improved by the pre-aging.

    6.
    发明专利
    未知

    公开(公告)号:DE50213994D1

    公开(公告)日:2009-12-24

    申请号:DE50213994

    申请日:2002-09-25

    Applicant: EPCOS AG

    Abstract: A method produces a component having a ceramic base body and contact surfaces on opposite sides of the ceramic base body. The method includes forming first protective layers on the opposite sides of the ceramic base body in regions not to be covered by the contact surfaces, forming second protective layers on opposite surfaces of the ceramic base body, sintering the ceramic base body with the first and second protective layers at a first temperature, forming the contact surfaces on the ceramic base body, and sintering the contact surfaces at a temperature that is lower than the first temperature.

    7.
    发明专利
    未知

    公开(公告)号:DE102008024481A1

    公开(公告)日:2009-12-03

    申请号:DE102008024481

    申请日:2008-05-21

    Applicant: EPCOS AG

    Abstract: An electric component arrangement is described, comprising a semiconductor component (1) and a varistor body (2), which is contact-connected to the semiconductor component in order to protect the latter against electrostatic discharges. The semiconductor component and the varistor body are arranged on a common carrier (3) containing a highly thermally conductive ceramic.

    9.
    发明专利
    未知

    公开(公告)号:DE50106829D1

    公开(公告)日:2005-08-25

    申请号:DE50106829

    申请日:2001-12-06

    Applicant: EPCOS AG

    Abstract: An electrical component includes stacked electrode layers arranged on a foundation. The stacked electrode layers include a first type of electrode layer and a second type of electrode layer. Dielectric layers separate the stacked electrode layers to form at least one capacitor. Two pairs of external contacts are arranged such that one external contact in each pair of external contacts is located on a side of the foundation and such that connections between each pair of external contacts overlap. A first pair of the external contacts connects to the first type of electrode layer and a second pair of the external contacts connects to the second type of electrode layer. The first type of electrode layer includes a first conductive layer which connects to at least one of the first pair of external contacts and the second type of electrode layer includes a second conductive layer which connects to at least one of the second pair of external contacts.

    10.
    发明专利
    未知

    公开(公告)号:AT300091T

    公开(公告)日:2005-08-15

    申请号:AT01995584

    申请日:2001-12-06

    Applicant: EPCOS AG

    Abstract: An electrical component includes stacked electrode layers arranged on a foundation. The stacked electrode layers include a first type of electrode layer and a second type of electrode layer. Dielectric layers separate the stacked electrode layers to form at least one capacitor. Two pairs of external contacts are arranged such that one external contact in each pair of external contacts is located on a side of the foundation and such that connections between each pair of external contacts overlap. A first pair of the external contacts connects to the first type of electrode layer and a second pair of the external contacts connects to the second type of electrode layer. The first type of electrode layer includes a first conductive layer which connects to at least one of the first pair of external contacts and the second type of electrode layer includes a second conductive layer which connects to at least one of the second pair of external contacts.

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