公开(公告)号：CA2332891A1

公开(公告)日：1999-11-25

申请号：CA2332891

申请日：1999-05-03

Applicant: EPCOS AG

Inventor： WOSSLER MANFRED ,  STELZL ALOIS ,  KRUGER HANS ,  WEIDNER KARL

IPC: H05K3/00 ,  H01L21/48 ,  H01L23/498 ,  H03H3/00 ,  H05K1/02 ,  H05K3/18 ,  H05K3/24 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42

Abstract: The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3), especially acoustic surface wave components. Each of these electronic components is suitable for contacting chips on the individual printed panels (2) using the flip-chip technique and for contacting the individual printed panels (2) wit h external connections using SMD technology. The inventive multiple printed panel (1) has metal-plated surfaces (5) for each individual printed panel (2 ), said metal-plated surfaces being located on a network which is integrated in the multiple printed panel and leads to a terminal pole (8). The bumps (13) are formed by galvanically separating metal onto the metal-plated surfaces ( 5).

公开(公告)号：DE59900868D1

公开(公告)日：2002-03-21

申请号：DE59900868

申请日：1999-05-03

Applicant: EPCOS AG

Inventor： STELZL ALOIS ,  KRUEGER HANS ,  WEIDNER KARL ,  WOSSLER MANFRED

IPC: H05K3/00 ,  H01L21/48 ,  H01L23/498 ,  H03H3/00 ,  H05K1/02 ,  H05K3/18 ,  H05K3/24 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42

Abstract: The multiple blank can be diced into individual blanks for electronic components, in particular surface acoustic wave components. Each of the individual blanks is suitable for contact to be made with chips in the flip-chip technique and for contact to be made with the individual blanks in the SMD technique, using external connections. The multiple blank has, for each individual blank, metalized areas which are located on a network which is integrated between layers of the multiple blank and leads to a connecting terminal. Bumps are built up by depositing metal by electroplating on the metalized areas.

公开(公告)号：CA2320907A1

公开(公告)日：1999-08-19

申请号：CA2320907

申请日：1999-02-16

Applicant: EPCOS AG

Inventor： WEIDNER KARL ,  KRUGER HANS ,  WOSSLER MANFRED ,  STELZL ALOIS

IPC: H01L25/16 ,  H03H9/05 ,  H03H9/25

Abstract: The invention relates to an OFW component working with acoustic surface waves. Said component comprises a chip (1), a piezoelectric substrate (1a), electrically conductive structures (2, 3, 4) arranged on the substrate and a base plate (15) with external electrical connections lines which are in contact with the electrical conductive structures of the chip (1). A protective film (5, 6) is applied on the surface of the chip supporting the electrically conductive structures (2, 3, 4), which has electrical contact elements (7, 11) on the surface opposite to their piezoelectric substrate (1a). Said elements are connected directly to the structures (2, 3, 4) of the chip (1) by through contacts (8) in the protective film (5, 6) and/or through bumps (10) and to the electrical connection elements of the base plate (15) using SMT technology.

公开(公告)号：DE59903249D1

公开(公告)日：2002-12-05

申请号：DE59903249

申请日：1999-02-16

Applicant: EPCOS AG

Inventor： STELZL ALOIS ,  KRUEGER HANS ,  WEIDNER KARL ,  WOSSLER MANFRED

IPC: H01L25/16 ,  H03H9/05 ,  H03H9/25

Abstract: An electronic component such as a surface acoustic wave component has a chip a piezoelectric substrate with electrically conductive structures thereon and a base plate having external electrical terminal elements that are contacted to the electrically conductive structures of the chip. A protective film is applied onto the chip surface carrying the electrically conductive structures. The surface of the protective film facing away from the piezoelectric substrate carries electrical contact elements that are connected, to the electrically conductive structures of the chip via through-contacts in the protective film and/or directly via bumps, as well as to the electrical terminal elements of the base plate.