公开(公告)号：JP2010004036A

公开(公告)日：2010-01-07

申请号：JP2009128649

申请日：2009-05-28

Applicant: Epcos Ag ,  エプコス アクチエンゲゼルシャフトEpcos Ag

Inventor： FEIEL GERNOT ,  KRUGER HANS ,  LEIDL ANTON ,  PUFF MARKUS ,  STELZL ALOIS ,  SLAKHORST JUSTINUS ,  LEHRHOFER JOHANNES ,  SEBASTIAN BRUNNER ,  HOFFMANN CHRISTIAN ,  KARTASCHEV IGOR

IPC: H05K1/18

CPC classification number: H05K3/32 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/107 ,  H01L2224/16225 ,  H05K1/181 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10083 ,  H05K2201/10287 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10962 ,  H05K2201/2045 ,  Y02P70/611

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus in which vibrations of the piezoelectric element remain extensively unaffected.
SOLUTION: The apparatus is disclosed for the suspension and contacting of the piezoelectric component 1 which has multiple electrode layers. The apparatus has a substrate 2 on which electrical conductor tracks 3 are arranged. The piezoelectric component 1 is suspended above the substrate 2 and electrically contacted at a minimum of two of its edge areas, in which the component has vibration nodes 4a and 4b. The piezoelectric component 1 is spaced apart from the substrate 2 and the vibrations of the piezoelectric component 1 remain extensively unaffected by the suspension.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种其压电元件的振动保持不受影响的装置。 解决方案：公开了用于具有多个电极层的压电元件1的悬挂和接触的装置。 该装置具有布置有电导体轨道3的基板2。 压电元件1悬挂在基板2上方并且在其边缘区域中的至少两个处被电接触，其中元件具有振动节点4a和4b。 压电部件1与基板2间隔开，并且压电部件1的振动保持不受悬架的影响。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：CA2332891A1

公开(公告)日：1999-11-25

申请号：CA2332891

申请日：1999-05-03

Applicant: EPCOS AG

Inventor： WOSSLER MANFRED ,  STELZL ALOIS ,  KRUGER HANS ,  WEIDNER KARL

IPC: H05K3/00 ,  H01L21/48 ,  H01L23/498 ,  H03H3/00 ,  H05K1/02 ,  H05K3/18 ,  H05K3/24 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42

Abstract: The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3), especially acoustic surface wave components. Each of these electronic components is suitable for contacting chips on the individual printed panels (2) using the flip-chip technique and for contacting the individual printed panels (2) wit h external connections using SMD technology. The inventive multiple printed panel (1) has metal-plated surfaces (5) for each individual printed panel (2 ), said metal-plated surfaces being located on a network which is integrated in the multiple printed panel and leads to a terminal pole (8). The bumps (13) are formed by galvanically separating metal onto the metal-plated surfaces ( 5).

公开(公告)号：CA2321473A1

公开(公告)日：1999-08-26

申请号：CA2321473

申请日：1999-02-05

Applicant: EPCOS AG

Inventor： KRUGER HANS ,  STELZL ALOIS ,  DEMMER PETER

IPC: H01L23/02 ,  H01L23/552 ,  H03H3/02 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25

Abstract: In a process for manufacturing a surface-wave filter, a carrier plate 10 which can be subdivided into base plates 2 is provided with printed circuits in each base plate zone A and these are contacted with the active structures of surface-wave chips 1 by a flip-chip technique. A metal or plastic foil 3 or 4 is then laid on the carrier plate 10 fitted with chips and then processed under heat and pressure, for example, so that each chip 1 - except for the chip surface facing the carrier plate 10 - is enveloped and hermetically sealed on the carrier plate surface in the zones between the chips.

公开(公告)号：CA2330039A1

公开(公告)日：1999-11-04

申请号：CA2330039

申请日：1999-03-25

Applicant: EPCOS AG

Inventor： STELZL ALOIS ,  KRUGER HANS

IPC: H01L23/02 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25

Abstract: The invention relates to a surface wave component and to a method for the production of the same, comprising a chip (2) with a piezoelectric substrate, electronic conductive structures arranged on said chip (IDT converters, contact strips and the like), a base plate (3) with external contact elements contacting the electric conductive structures of the chip and a hermetically sealed frame (4) mounted on the base plate, the chip being arranged inside and at a distance from said frame. The area between the chip (2) and the base plate (3) is sealed off with a foil (5), the area between the frame (4) and the foil (5) is filled with a sealing compound (6) and the chip (2) along with the sealing compound (6) and the frame (4) are protected by a cover (7) or a protective cap made of galvanic material, the edges (8) of which rest on the base plate (3) hermetically sealing the latter.

公开(公告)号：CA2320907A1

公开(公告)日：1999-08-19

申请号：CA2320907

申请日：1999-02-16

Applicant: EPCOS AG

Inventor： WEIDNER KARL ,  KRUGER HANS ,  WOSSLER MANFRED ,  STELZL ALOIS

IPC: H01L25/16 ,  H03H9/05 ,  H03H9/25

Abstract: The invention relates to an OFW component working with acoustic surface waves. Said component comprises a chip (1), a piezoelectric substrate (1a), electrically conductive structures (2, 3, 4) arranged on the substrate and a base plate (15) with external electrical connections lines which are in contact with the electrical conductive structures of the chip (1). A protective film (5, 6) is applied on the surface of the chip supporting the electrically conductive structures (2, 3, 4), which has electrical contact elements (7, 11) on the surface opposite to their piezoelectric substrate (1a). Said elements are connected directly to the structures (2, 3, 4) of the chip (1) by through contacts (8) in the protective film (5, 6) and/or through bumps (10) and to the electrical connection elements of the base plate (15) using SMT technology.

公开(公告)号：GB2493246B

公开(公告)日：2014-02-12

申请号：GB201211029

申请日：2011-01-24

Applicant: EPCOS AG

Inventor： FEIERTAG GREGOR ,  KRUGER HANS ,  PAHL WOLFGANG ,  LEIDL ANTON

IPC: B81C1/00 ,  G01L9/00

Abstract: The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.