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公开(公告)号:WO2022238231A1
公开(公告)日:2022-11-17
申请号:PCT/EP2022/062158
申请日:2022-05-05
Applicant: EPINOVATECH AB
Inventor: OLSSON, Martin , NORELIUS, Andreas
IPC: H02M1/00 , H02M7/00 , H05K1/11 , H02M1/42 , H03K17/0814 , H02M1/44 , H02M7/219 , H02M1/0077 , H02M7/003 , H03K17/08142 , H05K1/144 , H05K2201/042 , H05K2201/2036
Abstract: The present invention relates to a power converter device (1) comprising; a first circuit board (100), the first circuit board comprising a first driver (102) and at least four GaN HEMT devices (101) arranged in pairs (103, 104), said pairs connected in parallel; a second circuit board (200), the second circuit board comprising a second driver (202), and at least four MOSFET devices (201) arranged in pairs (203, 204), said pairs connected in parallel; the power converter device comprises at least two electrical connections (20) between the two circuit boards; wherein the first circuit board extends in a first plane and the second circuit board extends in a second plane, and the first and second circuit boards are arranged one above the other such that the two planes extends in parallel and the electrical connections between the two circuit boards extends in a direction substantially perpendicular to said first and second planes; and wherein said at least four GaN HEMT devices (101) are electrically connected equidistant to said first driver (102). The invention further relates to a system (2, 3) comprising such power converter device, and the use thereof.
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公开(公告)号:WO2023006410A1
公开(公告)日:2023-02-02
申请号:PCT/EP2022/069468
申请日:2022-07-12
Applicant: EPINOVATECH AB
Inventor: OLSSON, Martin
Abstract: A transistor (1) comprising a source (10), a body (12) and a drain (14), the transistor (1) further comprising a plurality of semiconductor layers (20), wherein layers of the plurality of semiconductor layers (20) are made of AIGaN or GaN, and wherein the plurality of semiconductor layers (20) is configured such that an aluminum content changes between each consecutive layer such that every second layer has a lower aluminum content than the neighboring mutually opposite layers thereof, wherein the transistor (1) is either a N-channel metal-oxide-semiconductor, NMOS, transistor (1'), wherein part of the plurality of semiconductor layers (20) is p-doped and forms part of the body (12) of the NMOS transistor (1'); or a P-channel metal-oxide-semiconductor, PMOS, transistor (1"), wherein part of the plurality of semiconductor layers (20) is p-doped and forms part of the source (10) or the drain (14) of the PMOS transistor (1").
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公开(公告)号:EP4378004A1
公开(公告)日:2024-06-05
申请号:EP22751303.3
申请日:2022-07-12
Applicant: Epinovatech AB
Inventor: OLSSON, Martin
CPC classification number: H01L29/78 , H01L29/66522 , H01L29/2003 , H01L29/0847 , H01L29/1054
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公开(公告)号:EP4338272A1
公开(公告)日:2024-03-20
申请号:EP22727341.4
申请日:2022-05-05
Applicant: Epinovatech AB
Inventor: OLSSON, Martin , NORELIUS, Andreas
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公开(公告)号:EP4090139A1
公开(公告)日:2022-11-16
申请号:EP21172959.5
申请日:2021-05-10
Applicant: Epinovatech AB
Inventor: OLSSON, Martin , NORELIUS, Andreas
IPC: H05K1/11 , H02M1/42 , H02M7/00 , H03K17/0814
Abstract: The present invention relates to a power converter device (1), comprising; a first circuit board (100), the first circuit board comprising a first driver (102) and at least four GaN HEMT devices (101) arranged in pairs (103, 104), said pairs connected in parallel; a second circuit board (200), the second circuit board comprising a second driver (202), and at least four MOSFET devices (201) arranged in pairs (203, 204), said pairs connected in parallel; the power converter device comprises at least two electrical connections (20) between the two circuit boards; wherein the first circuit board extends in a first plane and the second circuit board extends in a second plane, and the first and second circuit boards are arranged one above the other such that the two planes extends in parallel and the electrical connections between the two circuit boards extends in a direction substantially perpendicular to said first and second planes; and wherein said at least four GaN HEMT devices (101) are electrically connected equidistant to said first driver (102). The invention further relates to a system (2, 3) comprising such power converter device, and the use thereof.
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