公开(公告)号：US20200152836A1

公开(公告)日：2020-05-14

申请号：US16680214

申请日：2019-11-11

Applicant: EPISTAR CORPORATION

Inventor： Wen-Luh LIAO ,  Cheng-Long YEH ,  Ko-Yin LAI ,  Yao-Ru CHANG ,  Yung-Fu CHANG ,  Yi HSIAO ,  Shih-Chang LEE

IPC: H01L33/38 ,  H01L33/62

Abstract: A semiconductor device and a package structure are provided. The semiconductor device includes a substrate, a light-emitting structure, a first semiconductor layer, a second semiconductor layer and a first electrode. The light-emitting structure is on the substrate. The first semiconductor layer is on the light-emitting structure. The second semiconductor layer is between the first semiconductor layer and the light-emitting structure. The first electrode is on the second semiconductor layer. At least a portion of the first electrode is separated from the first semiconductor layer.