SEMICONDUCTOR DEVICE
    1.
    发明申请

    公开(公告)号:US20230058195A1

    公开(公告)日:2023-02-23

    申请号:US17892814

    申请日:2022-08-22

    Abstract: A semiconductor device is provided, which includes a first semiconductor structure, a second semiconductor structure, and an active region. The first semiconductor structure includes a first semiconductor layer which includes a first dopant and a second dopant. The second semiconductor structure is located on the first semiconductor structure and includes the first dopan. The active region is located between the first semiconductor structure and the second semiconductor structure and includes the first dopant. The first dopant and the second dopant have different conductivity types.

    SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE
    3.
    发明申请

    公开(公告)号:US20200152836A1

    公开(公告)日:2020-05-14

    申请号:US16680214

    申请日:2019-11-11

    Abstract: A semiconductor device and a package structure are provided. The semiconductor device includes a substrate, a light-emitting structure, a first semiconductor layer, a second semiconductor layer and a first electrode. The light-emitting structure is on the substrate. The first semiconductor layer is on the light-emitting structure. The second semiconductor layer is between the first semiconductor layer and the light-emitting structure. The first electrode is on the second semiconductor layer. At least a portion of the first electrode is separated from the first semiconductor layer.

Patent Agency Ranking