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公开(公告)号:US20190165204A1
公开(公告)日:2019-05-30
申请号:US16196793
申请日:2018-11-20
Applicant: EPISTAR CORPORATION
Inventor: Tzu-Chieh HU , Wei-Chieh LIEN , Chen OU , Chia-Ming LIU , Tzu-Yi CHI
Abstract: A semiconductor device includes: a first semiconductor region; and a first electrode on the first semiconductor region; wherein first semiconductor region includes a first layer and a second layer, the second layer includes a first portion and a second portion adjacent to the first portion, the first portion has a first thickness, the second portion has a second thickness less than the first thickness, the first layer includes a first material and a first dopant, the first material includes multiple elements, the first dopant has a first concentration, the second layer includes a second material and a second dopant, the second material includes multiple elements, the second dopant has a second concentration, one of the elements of the first material of the first layer is different from the elements of the second material of the second layer.
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公开(公告)号:US20210057603A1
公开(公告)日:2021-02-25
申请号:US17076511
申请日:2020-10-21
Applicant: EPISTAR CORPORATION
Inventor: Tzu-Chieh HU , Wei-Chieh LIEN , Chen OU , Chia-Ming LIU , Tzu-Yi CHI
Abstract: A semiconductor device includes: a first semiconductor region; and a first electrode on the first semiconductor region; wherein first semiconductor region includes a first layer and a second layer, the second layer includes a first portion and a second portion adjacent to the first portion, the first portion has a first thickness, the second portion has a second thickness less than the first thickness, the first layer includes a first material and a first dopant, the first material includes multiple elements, the first dopant has a first concentration, the second layer includes a second material and a second dopant, the second material includes multiple elements, the second dopant has a second concentration, one of the elements of the first material of the first layer is different from the elements of the second material of the second layer.
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公开(公告)号:US20200287082A1
公开(公告)日:2020-09-10
申请号:US16881344
申请日:2020-05-22
Applicant: EPISTAR CORPORATION
Inventor: Jing-Jie DAI , Tzu-Chieh HU
Abstract: A semiconductor device includes: a first semiconductor layer; a second semiconductor layer including a first dopant of a first conductivity type and a second dopant of a second conductivity type, wherein the first dopant has a doping concentration, and the first conductivity type is different from the second conductivity type; a third semiconductor layer on the second semiconductor layer, wherein the third semiconductor layer includes a third dopant including a doping concentration higher than the doping concentration of the first dopant; and an active region between the first semiconductor layer and the second semiconductor layer; wherein the second semiconductor layer includes a bottom surface facing the active region, and the active region includes a top surface facing the second semiconductor layer, and a distance between the bottom surface of the second semiconductor layer and the top surface of the active region is not less than 2 nm.
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公开(公告)号:US20190157511A1
公开(公告)日:2019-05-23
申请号:US16182849
申请日:2018-11-07
Applicant: EPISTAR CORPORATION
Inventor: Jing-Jie DAI , Tzu-Chieh HU
IPC: H01L33/32
Abstract: A semiconductor device includes: a first semiconductor layer; a second semiconductor layer including a first dopant of a first conductivity type and a second dopant of a second conductivity type, wherein the first dopant has a doping concentration, and the first conductivity type is different from the second conductivity type; a third semiconductor layer on the second semiconductor layer, wherein the third semiconductor layer includes a third dopant including a doping concentration higher than the doping concentration of the first dopant; and an active region between the first semiconductor layer and the second semiconductor layer; wherein the second semiconductor layer includes a bottom surface facing the active region, and the active region includes a top surface facing the second semiconductor layer, and a distance between the bottom surface of the second semiconductor layer and the top surface of the active region is not less than 2 nm.
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