公开(公告)号：AU743764B2

公开(公告)日：2002-02-07

申请号：AU2193399

申请日：1998-12-18

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：AU2193399A

公开(公告)日：1999-07-19

申请号：AU2193399

申请日：1998-12-18

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：SE9704894L

公开(公告)日：1999-06-30

申请号：SE9704894

申请日：1997-12-29

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00 ,  H05K3/10

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：MY120468A

公开(公告)日：2005-10-31

申请号：MYPI9805682

申请日：1998-12-16

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K9/00 ,  H05K3/32

Abstract: IN A METHOD OF PRODUCING A PRINTED BOARD (1) ASSEMBLY FROM A PRINTED BOARD (1), COMPONENTS ARE FURNACE SOLDERED TO THE PRINTED BOARD. A STRING (6) OF HEAT CURING, ELECTRICALLY CONDUCTIVE MATERIAL, ELASTIC AFTER CURING, IS DEPOSITED AROUND THE SITE WHERE THE COMPONENTS (7) TO BE SHIELDED, ARE TO BE FURNACE SOLDERED. THAT STRING (6) IS CURED INTO A SHIELDING GASKET IN THE FURNACE SOLDERING STEP, I.E. IN THE SAME PRODUCTION STEP AS THE COMPONENTS (7) ARE FURNACE SOLDERED TO THE PRINTED BOARD (1). THE SHIELDING GASKET IS ADAPTED TO COOPERATE WITH A SHIELDING HOUSING TO SHIELD THE COMPONENTS (7).

公开(公告)号：EE03794B1

公开(公告)日：2002-06-17

申请号：EEP200000406

申请日：1998-12-18

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：HU0100628A2

公开(公告)日：2001-07-30

申请号：HU0100628

申请日：1998-12-18

Applicant: ERICSSON TELEFON AB L M

Inventor： FRIMAN DANIEL ,  HOLMBERG PER ,  SANDEVI TOMMY

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：SE9704894D0

公开(公告)日：1997-12-29

申请号：SE9704894

申请日：1997-12-29

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00 ,  H05K

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：EE200000406A

公开(公告)日：2001-12-17

申请号：EEP200000406

申请日：1998-12-18

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.

公开(公告)号：SE511330C2

公开(公告)日：1999-09-13

申请号：SE9704894

申请日：1997-12-29

Applicant: ERICSSON TELEFON AB L M

Inventor： HOLMBERG PER ,  SANDEVI TOMMY ,  FRIMAN DANIEL

IPC: H05K3/34 ,  H05K3/32 ,  H05K9/00 ,  H05K3/10

Abstract: In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic after curing, is deposited around the site where the components to be shielded, are to be furnace soldered. That string is cured into a shielding gasket in the furnace soldering step, i.e. in the same production step as the components are furnace soldered to the printed board. The shielding gasket is adapted to cooperate with a shielding housing to shield the components.